MXD8680Q

MXD8680Q SP8T Antenna Switch This document contains information that is confidential and proprietary to Maxscend Microelectronics Company Limited (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch General Description Features The MXD8680Q is a low loss, high isolation SP8T  - 0.60 dB Insertion Loss at 2.7GHz switch with performance for antenna diversity receiving. The MXD8680Q is compatible with +1.0V control Excellent insertion loss  Broadband frequency range: 0.1 to 3.0 GHz  No DC blocking capacitors required (unless external DC is applied to the RF ports) logic, which is a key requirement for most cellular  transceivers. This part is packaged in a compact Compact 2mm x 2mm x 0.53mm in QFN-14 package, MSL1 2mm x 2mm x 0.53mm, 14-pin, QFN package which allows for a small solution size with no need for external DC blocking capacitors (when no external DC is applied to the device ports). Applications  2G/3G/4G antenna diversity  Cellular modems and USB Devices Functional Block Diagram and Pin Function RF1 RF2 11 RF3 RF4 ANT RF5 Ground Paddle 10 9 RF6 8 RF7 RF8 VDD V1 V2 V3 Figure 1. Functional Block Diagram and Pinout (Top View) Page 2 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch ANT RF3 RF1 RF1 VDD VDD 12 RF3 13 14 RF5 RF8 ANT RF7 RF5 RF8 RF7 Application Circuit 1 11 2 10 3 9 4 8 RF6 RF4 RF2 RF6 RF4 RF2 NC C4 100pF V1 C2 100pF V2 V3 C1 100pF 7 6 5 V3 V2 V1 C3 100pF Figure 2. MXD8680Q Evaluation Board Schematic Table 1. Pin Description Pin No. 1 2 3 4 5 6 7 Ground Paddle Name RF5 RF3 RF1 VDD V3 V2 V1 Description RF port5 RF port3 RF port1 Power supply Control logic 3# Control logic 2# Control logic 1# GND Ground Pin No. 8 9 10 11 12 13 14 Name NC RF2 RF4 RF6 RF8 ANT RF7 Description No connection RF port2 RF port4 RF port6 RF port8 Antenna port RF port7 Note: Bottom ground paddles must be connected to ground. Page 3 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch Truth Table Table 2. Control pins V1 V2 V3 0 0 0 0 0 1 Switched RF Outputs RF1 Insertion Loss Isolation RF2 RF3 RF4 RF5 RF6 RF7 RF8 Isolation Isolation Isolation Isolation Isolation Isolation Isolation Insertion Loss Isolation Isolation Isolation Isolation Isolation Isolation Isolation Isolation Isolation Isolation Isolation 0 1 0 Isolation Isolation Insertion Loss 0 1 1 Isolation Isolation Isolation Insertion Loss Isolation Isolation Isolation Isolation 1 0 0 Isolation Isolation Isolation Isolation Insertion Loss Isolation Isolation Isolation 1 0 1 Isolation Isolation Isolation Isolation Isolation Insertion Loss Isolation Isolation 1 1 0 Isolation Isolation Isolation Isolation Isolation Isolation Insertion Loss Isolation 1 1 1 Isolation Isolation Isolation Isolation Isolation Isolation Isolation Insertion Loss Note: “1” = 1.6 V to 3.0 V. “0” = 0 V to 0.3 V. Recommended Operation Range Table 3. Recommended Operation Condition Parameters Operation Frequency Power supply Switch Control Voltage High Switch Control Voltage Low Symbol Min Typ Max f1 VDD VH VL 0.1 2.5 1.6 0 2.8 1.8 0 3.0 3.0 3.0 0.3 Units GHz V V V Specifications Table 4. Electrical Specifications Parameter DC Specifications Supply voltage Supply current Control voltage Control current Switching Speed, on RF to another Turn-on time RF Specifications Insertion loss (ANT pin to all RF ports) Isolation (ANT pin to all RF ports) RF to RF Isolation (Active port to the other RF ports) Input return loss (ANT pin to all RF ports) Symbol Min Typ Max Units VDD 2.5 2.8 3.0 V IDD VCTL_H VCTL_L ICTL 1.6 0 25 1.8 0 1.0 60 3.0 0.3 2.0 uA V V uA 10% to 90% RF 1 2 uS Time from VDD=0V to part ON and RF at 90% 5 10 uS 0.35 0.45 0.60 40 30 24 38 30 25 25 20 15 0.45 0.55 0.75 dB dB dB dB dB dB dB dB dB dB dB dB ton IL Iso Iso RL Test Condition VCTL = 1.8 V 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 35 25 20 27 22 19 20 15 12 Page 4 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch 0.1 dB Compression Point (ANT pin to all RF ports) P0.1dB 0.1 GHz to 3.0 GHz +28 +29 dBm Absolute Maximum Ratings Table 5. Maximum ratings Parameters Supply voltage Control voltage (V1, V2, and V3) RF input powerNote1 Operating temperature Storage temperature Humidity Grade Storage Cycle(package) Symbol VDD Minimum +2.5 Maximum +3.3 Units V VCTL 0 +3.0 V +29 +90 +150 dBm ℃ ℃ PIN TOP TSTG Electrostatic Discharge Human body model (HBM), Class 1C Machine Model (MM), Class A Charged device model (CDM), Class III –45 –65 MSL1 2 years ESD_HBM 1000 V ESD_MM 100 V ESD_CDM 500 V Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device Note1: Continuous wave for 5000hrs, 50℃ Page 5 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch Package Outline Dimension Figure 3. package outline dimension Page 6 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch Marking Specification Product Code(Fixed)： 8680Q 8680 QAAA Manufacture Code(Variable): From 1~9 and A ~Z excluding letter I and O for lot tracking PIN1 Figure 4. Marking specification (Top View) Tape and Reel Dimensions Figure 5. Tape and reel dimensions Page 7 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential MXD8680Q – SP8T Antenna Switch Reflow Chart tP TP Critical Zone TL to TP Ramp-up Temperature TL TSmax tL TSmin Ramp-down tS Preheat t 25 ℃ to Peak Time Figure 6. Recommended Lead-Free Reflow Profile Table 6. Reflow condition Profile Parameter Ramp-up rate（TSmax to Tp） Preheat temperature（TSmin to TSmax） Preheat time（ts） Time above TL , 217℃（tL） Peak temperature（Tp） Time within 5℃ of peak temperature(tp) Ramp-down rate Time 25℃ to peak temperature Lead-Free Assembly, Convection, IR/Convection 3℃/second max. 150℃ to 200℃ 60 - 180 seconds 60 - 150 seconds 260℃ 20 - 40 seconds 6℃/second max. 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 8 of 8 Maxscend Microelectronics Company Limited. All rights reserved. Maxscend Confidential