MXD8661H

MXD8661H High Power SP6T for 2G/3G/4G Applications VED APPRO This document contains information that is confidential and proprietary to Maxscend Technologies Inc. (Maxscend) and may not be reproduced in any form without express written consent of Maxscend. No transfer or licensing of technology is implied by this document. Page 1 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications General Description Features The MXD8661H is a low loss, high power SP6T  Excellent insertion loss and isolation performance switch for 2G/3G/4G TRX applications. - 0.5 dB Insertion Loss at 2.7GHz The MXD8661H is compatible with +1.0V control - 25 dB Isolation at 2.7GHz logic, which is a key requirement for most - 36dBm of P0.1dB cellular transceivers. This part is packaged in a compact 2mm x 2mm, 14-pin, QFN package which allows for a small solution size with no  Multi-Band operation 100MHz to 3000MHz  Compact 2mm x 2mm in QFN-14 package，MSL1 need for external DC blocking capacitors (when  no external DC is applied to the device ports). No DC blocking capacitors required (unless external DC is applied to the RF ports) Applications  2G/3G/4G TRX  Cellular modems and USB Devices Functional Block Diagram and Pin Function NC ANT NC 14 13 12 RF1 RF2 RF3 ANT RF4 RF5 RF5 1 RF3 2 RF1 3 VDD 4 Ground Paddle 11 RF6 10 RF4 9 RF2 8 NC RF6 6 7 V3 V2 V1 V2 5 VDD V1 V3 Figure 1 Functional Block Diagram and Pinout (Top View) Page 2 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications ANT Application Circuit RF3 RF1 RF1 VDD VDD 12 RF3 13 14 RF5 NC ANT NC RF5 1 11 2 10 3 9 4 8 RF6 RF4 RF2 RF6 RF4 RF2 NC C4 100pF V1 C2 100pF V2 V3 C1 100pF 7 6 5 V3 V2 V1 C3 100pF Figure 2 MXD8661H Evaluation Board Schematic Table 1. Pin Description Pin No. 1 2 3 4 5 6 7 Ground Paddle Name RF5 RF3 RF1 VDD V3 V2 V1 Description RF port5 RF port3 RF port1 Power supply Control logic 3# Control logic 2# Control logic 1# GND Ground Pin No. 8 9 10 11 12 13 14 Name NC RF2 RF4 RF6 NC ANT NC Description No connection RF port2 RF port4 RF port6 No connection Antenna port No connection Note: Bottom ground paddles must be connected to ground. Page 3 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications Truth Table Table 2. Control pins V1 V2 V3 0 0 0 0 0 1 Switched RF Outputs RF1 Insertion Loss Isolation RF2 RF3 RF4 RF5 RF6 Isolation Isolation Isolation Isolation Isolation Insertion Loss Isolation Isolation Isolation Isolation Isolation Isolation Isolation 0 1 0 Isolation Isolation Insertion Loss 0 1 1 Isolation Isolation Isolation Insertion Loss Isolation Isolation 1 0 0 Isolation Isolation Isolation Isolation Insertion Loss Isolation 1 0 1 Isolation Isolation Isolation Isolation Isolation Insertion Loss 1 1 X Note: Isolation “1” = 1.0 V to 3.0 V. “0” = 0 V to 0.3 V. Recommended Operation Range Table 3. Recommended Operation Condition Parameters Operation Frequency Power supply Switch Control Voltage High Switch Control Voltage Low Symbol Min Typ Max f1 VDD VH VL 0.1 2.5 1.0 0 2.8 1.8 0 3.0 3.0 3.0 0.3 Units GHz V V V Specifications Table 4. Electrical Specifications Parameter Symbol Test Condition Min Typical Max Units 2.5 2.8 3.0 V 45 70 uA 1.0 0 1.8 0 3.0 0.3 V V 0.5 1.0 μA 0.5 1 μs 5 10 μs 0.35 0.45 0.50 40 35 25 40 34 24 25 22 20 0.40 0.50 0.60 dB dB dB dB dB dB dB dB dB dB dB dB DC Specifications Supply voltage Supply current Control voltage: High Low Control current VDD IDD VCTL_H VCTL_L ICTL Switching Speed, on RF to another Turn-on time VCTL = 1.8 V 10% to 90% RF ton Time from VDD=0V to part ON and RF at 90% RF Specifications Insertion loss (ANT pin to RF1/2/3/4/5/6 pins) IL Isolation (ANT pin to RF1/2/3/4/5/6 pins) Iso Isolation (RFx pin to the other RF pins in RFx to ANT mode，x=1/2/3/4/5/6) Iso Input return loss (ANT pin to RF1/2/3/4/5/6 pins) RL 0.1 dB Compression Point (ANT pin to RF1/2/3/4/5/6 pins) P0.1dB 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.1 to 1.0 GHz 1.0 to 2.0 GHz 2.0 to 2.7 GHz 0.5 GHz to 3.0 GHz 35 30 22 34 28 20 20 18 15 +36 dBm Page 4 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications Absolute Maximum Ratings Table 5. Maximum ratings Parameters Symbol Minimum Maximum Units Supply voltage Control voltage (V1, V2, and V3) RF input power (RF1 to RF6) Operating temperature Storage temperature Electrostatic Discharge Human body model (HBM), Class 1C Machine Model (MM), Class A Charged device model (CDM), Class III VDD 2.5 +3.3 V VCTL 0 +3.0 V +36 dBm +90 +125 ℃ ℃ PIN TOP TSTG –30 –40 ESD_HBM 1000 ESD_MM 100 ESD_CDM 500 V Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device Page 5 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications Package Outline Dimension Figure 3 package outline dimension Page 6 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications Marking Specification Figure 4 Marking specification (Top View) Page 7 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential MXD8661H – High Power SP6T for 2G/3G/4G Applications Reflow Chart tP TP Critical Zone TL to TP Ramp-up Temperature TL TSmax tL TSmin Ramp-down tS Preheat t 25 ℃ to Peak Time Figure 5 Recommended Lead-Free Reflow Profile Table 6. Reflow condition Profile Parameter Ramp-up rate（TSmax to Tp） Preheat temperature（TSmin to TSmax） Preheat time（ts） Time above TL , 217℃（tL） Peak temperature（Tp） Time within 5℃ of peak temperature(tp) Ramp-down rate Time 25℃ to peak temperature Lead-Free Assembly, Convection, IR/Convection 3℃/second max. 150℃ to 200℃ 60 - 180 seconds 60 - 150 seconds 260℃ 20 - 40 seconds 6℃/second max. 8 minutes max. ESD Sensitivity Integrated circuits are ESD sensitive and can be damaged by static electric charge. Proper ESD protection techniques should be used when handling these devices. RoHS Compliant This product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), and are considered RoHS compliant. Page 8 of 8 Maxscend Technologies Inc. All rights reserved. Maxscend Confidential