DLS-4

Duo-Lateral, Super Linear PSD’s Position Sensing Detectors (PSD) The Super Linear Position Sensors feature state of the art duo-lateral technology to provide a continuous analog output proportional to the displacement of the centroid of a light spot from the center, on the active area. As continuous position sensors, these detectors are unparalleled; offering position accuracies of 99% over 64% of the sensing area. These accuracies are achieved by duo-lateral technology, manufacturing the detectors with two separate resistive layer, one located on the top and the other at the bottom of the chip. One or two dimensional position measurements can be obtained using these sensors. A reverse bias should be applied to these detectors to achieve optimum current linearity at high light levels. The maximum recommended power density incident on the duo lateral PSDs are 1 mW / cm2 . For optimum performance, incident beam should be perpendicular to the active area with spot size less than 1mm in diameter. APPLICATIONS 50 • Beam Alignment • Position Sensing • Angle Measurement • Surface Profiling • Height Measurements • Targeting • Guidance System • Motion Analysis FEATURES • Super Linear • Ultra High Accuracy • Wide Dynamic Range • High Reliability • Duo Lateral Structure For position calculations and further details on circuit set up, refer to the “Photodiode Characteristics” section of the catalog. Typical Position Detectability Typical Spectral Response Typical Capacitance vs. Reverse Bias Voltage Typical Dark Current vs. Reverse Bias Duo-Lateral Super Linear PSD’s Position Detection Error (µm) Dark Current (nA) Capacitance (pF) Rise Time (µs) 670 nm Over 80% of Length 64% of Sensing Area -15 V, SL Series -5 V, DL Series -15 V, SL Series -5 V, DL Series 670 nm 50 Ω min. typ. typ. typ. max. Position Detection Drift † (µm / °C) Interelectrode Resistance (kΩ) typ. max. typ. typ. min. max. Temp Range (˚C) Storage Responsivity (A/W) Operating Dimension (mm) Position Sensing Area Area (mm2) Model Number Typical Electro-Optical Specifications at TA=23ºC Package Style ¶ 3 3x1 0.3 SL5-1 5 3 5 50 3 7 0.04 0.06 15 80 5 10 100 5 9 0.10 0.10 20 100 0.4 5x1 -20 ~ +80 SL3-1 -10 ~ +60 One-Dimensional Series, Metal Package (VBIAS=-15V) 41 / TO-5 42 / TO-8 One-Dimensional Series, Ceramic Package (VBIAS=-15V) 3x1 3 5 50 3 7 0.04 0.06 15 80 SL5-2 5 5x1 5 10 100 5 9 0.10 0.10 20 100 SL15 15 15 x 1 15 150 300 15 25 0.60 0.1 60 300 SL30 120 30 x 4 30 150 1000 125 150 1.0 0.6 40 80 SL76-1 190 76 x 2.5 76 100 1000 190 250 14.0 1.4 120 600 10 30 0.3 0.4 48 / 8-pin DIP -20 ~ +80 3 -10 ~ +60 SL3-2 49 / 24-pin DIP 51 / Ceramic 50 / Special Two-Dimensional Series, Metal Package § (VBIAS=-5V) DL-2 « 30 600 0.20 37 / TO-8 2 sq 30 0.025 10 175 8 14 0.40 DLS-2S « DL-4 0.3 16 0.4 4 sq 50 1000 35 60 50 DLS-4 0.25 5 25 0.08 25 300 30 40 0.30 -20 ~ +80 4 -10 ~ +60 DLS-2 « 14 / TO-5 37 / TO-8 DL-10 100 10 sq 100 500 5000 175 375 0.20 0.60 34 / Special DL-20 400 20 sq 200 2000 12000 600 1500 1.00 1.0 35 / Special 100 10 sq 0.3 DLS-20 400 100 50 400 160 200 0.20 0.70 200 100 1000 580 725 1.00 1.2 0.20 0.60 0.4 20 sq 5 25 5 25 -20 ~ +80 DLS-10 -10 ~ +60 Two-Dimensional Series, Ceramic Package § (VBIAS=-5V) 36 / Ceramic 100 10 sq 100 0.3 DL-20C 400 500 5000 175 375 0.4 20 sq 200 2000 12000 600 1500 1.00 1.0 -20 ~ +80 DL-10C -10 ~ +60 Two-Dimensional Series, Low-Cost Ceramic Package (VBIAS=-5V) 38 / Ceramic 39 / Ceramic † The position temperature drift specifications are for the die mounted on a copper plate without a window and the beam at the electrical center of the sensing area. § The DLS Series are packaged with A/R coated windows and have a lower dark current than the DL series. ¶ For mechanical drawings please refer to pages 61 thru 73. * Non-Condensing temperature and Storage Range, Non-Condensing Environment. NOTES: 1. DL(S) series are available with removable windows. 2. Chip centering within ± 0.010". « Minimum order quantities apply World Class Products - Light Sensing Solutions 51 Photodiode Care and Handling Instructions AVOID DIRECT LIGHT Since the spectral response of silicon photodiode includes the visible light region, care must be taken to avoid photodiode exposure to high ambient light levels, particularly from tungsten sources or sunlight. During shipment from OSI Optoelectronics, your photodiodes are packaged in opaque, padded containers to avoid ambient light exposure and damage due to shock from dropping or jarring. AVOID SHARP PHYSICAL SHOCK Photodiodes can be rendered inoperable if dropped or sharply jarred. The wire bonds are delicate and can become separated from the photodiode’s bonding pads when the detector is dropped or otherwise receives a sharp physical blow. CLEAN WINDOWS WITH OPTICAL GRADE CLOTH / TISSUE Most windows on OSI Optoelectronics photodiodes are either silicon or quartz. They should be cleaned with isopropyl alcohol and a soft (optical grade) pad. OBSERVE STORAGE TEMPERATURES AND HUMIDITY LEVELS Photodiode exposure to extreme high or low storage temperatures can affect the subsequent performance of a silicon photodiode. Storage temperature guidelines are presented in the photodiode performance specifications of this catalog. Please maintain a non-condensing environment for optimum performance and lifetime. OBSERVE ELECTROSTATIC DISCHARGE (ESD) PRECAUTIONS OSI Optoelectronics photodiodes, especially with IC devices (e.g. Photops) are considered ESD sensitive. The photodiodes are shipped in ESD protective packaging. When unpacking and using these products, anti-ESD precautions should be observed. DO NOT EXPOSE PHOTODIODES TO HARSH CHEMICALS Photodiode packages and/or operation may be impaired if exposed to CHLOROTHENE, THINNER, ACETONE, or TRICHLOROETHYLENE. INSTALL WITH CARE Most photodiodes in this catalog are provided with wire or pin leads for installation in circuit boards or sockets. Observe the soldering temperatures and conditions specified below: Soldering Iron: Soldering 30 W or less Temperature at tip of iron 300°C or lower. Dip Soldering: Bath Temperature: Immersion Time: Soldering Time: Vapor Phase Soldering: DO NOT USE Reflow Soldering: DO NOT USE 260±5°C. within 5 Sec. within 3 Sec. Photodiodes in plastic packages should be given special care. Clear plastic packages are more sensitive to environmental stress than those of black plastic. Storing devices in high humidity can present problems when soldering. Since the rapid heating during soldering stresses the wire bonds and can cause wire to bonding pad separation, it is recommended that devices in plastic packages to be baked for 24 hours at 85°C. The leads on the photodiode SHOULD NOT BE FORMED. If your application requires lead spacing modification, please contact OSI Optoelectronics Applications group at (310)978-0516 before forming a product’s leads. Product warranties could be voided. *Most of our standard catalog products are RoHS Compliant. Please contact us for details World Class Products - Light Sensing Solutions 59 A a B c = = = = Distance from top of chip to top of glass. Photodiode Anode. Distance from top of glass to bottom of case. Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted). W = Window Diameter. F.O.V. = Filed of View (see definition below). 2. Dimensions are in inches (1 inch = 25.4 mm). 3. Pin diameters are 0.018 ± 0.002" unless otherwise specified. 4. Tolerances (unless otherwise noted) General: 0.XX ±0.01" 0.XXX ±0.005" Chip Centering: ±0.010" Dimension ‘A’: ±0.015" 5. Windows All ‘UV’ Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick. All ‘XUV’ products are provided with removable windows. All ‘DLS’ PSD products are provided with A/R coated glass windows. All ‘FIL’ photoconductive and photovoltaic products are epoxy filled instead of glass windows. Mechanical Drawings Mechanical Specifications and Die Topography 1. Parameter Definitions: For Further Assistance Please Call One of Our Experienced Sales and Applications Engineers 310-978-0516 - Or visit our website at www.osioptoelectronics.com 61 Mechanical Specifications All units in inches. Pinouts are bottom view. 10 Low Profile 11 1.000 0.975 BNC 12 Products: Products: PIN-10DI PIN-10DPI PIN-10DPI/SB UV-50L UV-100L PIN-10D PIN-10DP PIN-10DP/SB UV-50 UV-100 UV-100DQ UV-100EQ PIN-25D PIN-25DP 0.975 0.695 (W) 0.695 (W) 0.125 0.195 BNC Products: 1.675 1.302 (W) 0.175 0.092 0.252 0.100 0.560 0.750 0.560 0.630 0.470 0.470 1 2 Outer Contact — Anode 3 Pin Circle Dia.=0.73 Outer Contact — Anode PIN-10D, PIN-10DP, PIN-10DP/SB UV-100DQ, UV-100EQ Outer Contact — Cathode UV-50, UV-100 1a 2c 3 Case 13 Special BNC 14 TO-5 15 Products: Special Plastic Products: PIN-10AP PIN-10DF Products: FIL-UV50 DLS-2S 0.360 0.325 1.230 0.240 B FILTER CAP 0.750 0.575 (W) 0.180 0.086 A B 0.200 0.500 0.100 0.018 1 A 2 3 4 0.675 C 1.230 0.700 (W) 8 C 7 6 1.000 5 A A B Pin Circle Dia.= 0.200 Bottom View C Dimensions P/N FIL-UV50 Dimensions A B 0.090 0.155 Pinouts P/N A B C PIN-10DF 0.217 0.330 1.020 PIN-10AP 0.386 0.550 1.415 P/N FIL-UV50 1 2 3 4 5 6 7 8 c - - a c - - a World Class Products - Light Sensing Solutions 63 Mechanical Specifications All units in inches. Pinouts are bottom view. 0.255 World Class Products - Light Sensing Solutions 67 Mechanical Specifications All units in inches. Pinouts are bottom view. SC-4D SL3-1 SPOT-2D SPOT-3D SPOT-4D SPOT-4DMI QD7-0 SPOT-2DMI QD7-0 0.050 0.130 SL5-1 0.230 QD7-0 SPOT-9D SPOT-9DMI 68 SC-10D SC-25D Mechanical Specifications All units in inches. World Class Products - Light Sensing Solutions 69 Mechanical Specifications All units in inches. Pinouts are bottom view. 51 Low Cost Ceramic 52 Special 53 Special Products: Products: Products: SL-30 A2V-76 A2V-16 2.000 1.018 1.735 A B C Two Rows of Pins Even Numbered Pins these Rows 0.590 0.910 0.385 0.316 76 Element Array Two Rows of Pins Odd Numbered Pins these Rows C A 1.600 Circular Hole 0.128 Dia. 0.075 0.375 0.280 C 0.600 0.020 A Ellipse 0.151 X 0.128 0.030 0.115 E D F 0.310 1.400 0.018 0.100 Typ. P/N A2V-16 Pin Diameter = 0.025 54 40-PIN-DIP 55 A5C-35, A5C-38 A5V-35, A5V-38 A5V-35UV 2.095 40 22 21 40 39 38 2.000 35 or 38 19 20 3 2 1 1 70 C 2 2 0.82 DIA. WINDOW 1.09 DIA. 0.180 35 Element Array 1 Products: OSD100-0A OSD100-5TA 0.110 0.05 RED DOT INDICATES CATHODE LEAD 0.100 0.20 0.11 NOM. 0.45 MIN. 0.039 DIA. 38 Element Array Element Number Pin Number Element Number Pin Number Element Number 21 C 1 C 21 C 22 35 2 2 22 37 35 3 4 23 33 3 4 23 4 6 24 31 4 6 24 33 5 8 25 29 5 8 25 31 6 10 26 27 6 10 26 29 7 12 27 25 7 12 27 27 8 14 28 23 8 14 28 25 9 16 29 21 9 16 29 23 10 18 30 19 10 18 30 21 11 -- 31 17 11 20 31 19 12 20 32 15 12 22 32 17 13 22 33 13 13 24 33 15 14 24 34 11 14 26 34 13 15 26 35 9 15 28 35 11 16 28 36 7 16 30 36 9 17 30 37 5 17 32 37 7 18 32 38 3 18 34 38 5 19 34 39 1 19 36 39 3 20 C 40 C 20 38 40 1 F 0.06 A5V-35UV A5C-35 A5C-38 A5V-35 A5V-38 0.28 0.225 E 0.062 Special 20 0.105 0.130 Pin Number D 0.2 Products: 0.600 Array Elements Element Number Dimensions B C 0.1 0.212 A 1 21 0.790 Pin Number 0.787 67 71 75 0.75 DIA. 1.25 DIA.