Preliminary
SG901-1091 Miniature Wi-Fi Radio
Overview
Features
The SG901-1091 WiFi module is optimized to
simplify successful integration into systems
requiring the latest performance with small size.
This module is a highly integrated single chip
based 802.11b/g/n WLAN radio for embedded,
low-power and extremely small form factor mobile
applications. The product conforms to the IEEE
802.11b, g, and n protocols operating in the
2.45GHz ISM frequency band supporting
802.11g/n modulations from 6 to 65Mbps, and
802.11b modulations.
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The SG901-1091 is a fully integrated wireless
radio including RF Synthesizer/VCO, high-speed
data converters, digital baseband processor,
onboard MAC and PHY processors, Power
Management, and Power Amplifier.
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Ultra Low Current Consumption
Very Small Footprint (8.5 x 9.5mm)
Self Calibrated
RoHs Compliant
Fully Integrated 802.11 System Solution
Fully Compliant with the IEEE 802.11B,G, and N
WLAN Standards
Support for 802.11g/n Modulations up to 65Mbps,
and Mandatory 802.11b Modulations
Intelligent Power Control, Including 802.11 Power
Save Mode
Supports SPI Interface and SDIO Interface
Factory Support for Linux 2.6/Android, Windows
CE, Symbian
Source Code Available for porting to RTOS or
Custom OS
Hardware driver is provided under GPL
Industrial Temperature -40 to +85C
Contact Factory for FCC compliant applications
On-chip auto-calibration eliminates unit specific
and customer calibration.
An on-board crystal and filter simplify system
integration. The addition of 2.3 to 4.8V and 1.8V
supplies, Antenna, and host communication
provides a complete WiFi solution.
Host control is provided by either an SDIO or SPI
interface at 1.8V.
Applications
• Hand-held Devices
• Embedded Systems
• Portable Systems
• Point of Sale terminals
• Personal Digital Assistants (PDA)
• Cameras
• Cable Replacement
Ordering Information
Packaging
Temp Range
Part Number
Tape and Reel
Industrial
SG901-1091-ET-TR
Bulk
Industrial
SG901-1091-ET-BLK
Tape and Reel
Commercial
SG901-1091-CT-TR
Bulk
Commercial
SG901-1091-CT-BLK
Evaluation Kit Available
This EVK supports embedded software
development.
EVK for 1091
1-321-255-0515
WWW.SAGRAD.COM
SG923-0010
DOC#: SG914-0029 Rev. 0.4
Preliminary
Block Diagram
VDDIO
Voltage
VBATT
Antenna
PAD
Timebase
Supply Inputs
Power Management Unit
PA
T/R
Switch
ZIF
Transceiver
Hos
tInterface
Connection
BB
Baseband
Processor
Processor
MA
C
To HOST
SPI/SD
IO
Hi Speed
g
Data
Converters
Standards Performance
Target Regulatory Domains
US – FCC
Canada – IC
EU – ETSI
Japan – TELEC
Standards Support
Modulations
Power Save
Encryption
Resources
Regulatory Support
Fast BSS Transition
Protected Frames
Direct Connect
1-321-255-0515
Yes
Yes
Soon
Optional
a/b/g/n Modulations
802.11e/WMM/WMM-PS
802.11i/WPA/WPA2
802.11k
802.11d
802.11r
802.11w
Wi-Fi Direct
WWW.SAGRAD.COM
DOC#: SG914-0029 rev. 0.5
Preliminary
General Electrical Specifications
Parameter
Test Condition / Comment
Min.
Typ.
Max.
Units
Absolute Maximum Ratings
VBAT Supply
-0.3
5.5
V
VDDIO Supply
-0.3
2.5
V
-40
85
°C
Operating Conditions and Input Power Specifications
Operating Temperature Range
Input Supply Voltage
2.3
3.6
Sleep Mode Current
VBAT Supply
VDDIO Supply
4.8
V
80
uA
DTIM = 1
0.87
mA
Peak TX Current
14.5dBm
294
mA
Peak RX Current
Processing OFDM
75
mA
Input Supply Voltage
VHIO input supply determines Host CMOS
logic levels
Input Supply Current
RX Active, processing OFDM
Power Save Mode
Current
1.65
1.8
Sleep Mode Current
Input Voltage
Levels
VIL
-0.3
VIH
0.625VDDIO
Output Voltage
Levels
VOL
IOL = 100uA
VOH
IOH = -100uA
1.95
V
0.87
mA
25
uA
0.35VDDIO
V
V
VDDIO-0.2
0.2
V
VDDIO
V
RF Characteristics
Parameter
Test Condition / Comment
Antenna Port Impedance
Channel to Channel
De-sensitivity
Maximum Input Signal
1-321-255-0515
Typ.
Max.
Units
50
Ohms
-11
dB
11b, 1Mbps
-96
dBm
11b, 2 Mbps
-93
dBm
11b, 5.5 Mbps
-91
dBm
11b, 11 Mbps
-87
dBm
Antenna Input Return Loss
RX Sensitivity
Min.
CH1 to CH14
11g, 9Mbps
-89.5
dBm
11g, 18Mbps
-86
dBm
11g, 36Mbps
-80
dBm
11g, 54Mbps
-74.5
dBm
11n, MCS1, 13Mbps
-86.5
dBm
11n, MCS3, 26Mbps
-81.5
dBm
11n, MCS5, 52Mbps
-74
dBm
11n, MCS7, 65Mbps
-71
dBm
1
dB
-20
dBm
CH1 to 14
11g, 54Mbps 10% PER
CH7
11g, 54Mbps
WWW.SAGRAD.COM
DOC#: SG914-0029 rev. 0.5
Preliminary
RF Characteristics cont,
Parameter
Adjacent Channel
Rejection
Test Condition / Comment
Typ.
Max.
Units
38
dBc
9Mbps
20
dBc
54Mbps
4
dBc
MCS1
24
dBc
MCS7
3
dBc
18.3
dBm
11b, 1Mbps
@802.11b spectral mask
11b, 11Mbps
TX Output Power
Min.
11Mbps
18.3
dBm
11g, 9Mbps
@802.11g spectral mask
18.3
dBm
11g, 54Mbps
EVM = -27dB, 4.5%
13.7
dBm
802.11n MCS1
@802.11n spectral mask
18.3
dBm
802.11n MCS7
EVM = -27dB
13.5
dBm
Pinout List
SIGNAL NAME
PIN NUMBER
DESCRIPTION
NOTES
RF Pin
2G4_RF
6
Wi-Fi / Bluetooth Antenna Port, 50 ohms
Careful RF design is needed for this and nearby ground
Serial Interface Pins (VDDIO Domain, logic levels compatible with the VDDIO (Pin 18) input voltage)
CMD_MOSI
11
SPI MOSI (input)
SDIO CMD
VDDIO Domain
CLK
10
SPI Clock Input
SDIO CLK
VDDIO Domain
SDD0_MISO
4
SPI MISO (output)
SDIO Data 0
VDDIO Domain
SDD1_IRQ
3
SPI: Interrupt Output
SDIO Data 1
VDDIO Domain
SDD2_HSEL1
1
SDIO Data 2
VDDIO Domain- at reset, low selects SPI, high SDIO
SDD3_CS
13
SDIO Data 3
VDDIO Domain
SPI Chip Select Input
Control Pins
POWERUP
14
Power Up Enable (from Host)
VDDIO Domain with internal pull up High = operating,
Low = off
RSTn
2
Reset Input
VDDIO Domain – Active Low reset
SLEEPCLK
16
32.768 kHz Sleep Clock Input
VDDIO Domain
FEM_CTRL1
12
programmable
diversity switch control
FEM_CTRL2
9
programmable
diversity switch control
DBG_RXD
15
Debug UART
VDDIO Domain
DBG_TXD
17
Debug UART
VDDIO Domain
Power and Ground Pins
VDDIO
18
VBAT
8
GND
5, 7, 19
1-321-255-0515
Supply Voltage for I/O's
1.8V, Internally decoupled with a 0.1uF capacitor
RF supply
2.3 to 4.8V, Internally decoupled with a 4.7uF capacitor
Ground Connections
WWW.SAGRAD.COM
DOC#: SG914-0029 rev. 0.5
Preliminary
Software Support
The 1091 module is supported through highly portable software. The hardware drivers and Wi-Fi stack
as provided is compatible with Linux kernel 2.6. The source code for the hardware abstraction is available
under a GPL license and is available from Sagrad. The licensed Wi-Fi licensed stack available from
Sagrad is provided in binary form without a license. Source code for the Wi-Fi stack is available to the
customer. To obtain source code for the stack contact Sagrad sales at www.sagrad.com. Software and
source code are available free of charge but require a software license agreement for the Wi-Fi stack
source.
In almost all cases the GPL driver will need to be modified for the customer’s specific hardware. The WiFi stack will only need to be modified for compatibility to the customers OS and compiler. In many cases
such as Linux near zero modification of the Wi-Fi stack will be required.
The Wi-Fi module/stack currently is only tested in client mode and is compatible with any access point
that meets 802.11 standards. An access point mode code base is planned in the future.
The complete 802.11 stack requires about 350KB of space for the implementation of the entire
specification. Extremely small versions can be created by knowledgeable customers but is a considerable
task and requires detailed understanding of 802.11.
As a service to customers, Sagrad offers extended technical support on a fee basis.
Software Details:
MAC
■ Comprehensive MAC functionality according to IEEE 802.11-2007, including QoS traffic scheduling
■ Supports the following optional IEEE 802.11n features:
MPDU aggregation
MSDU aggregation
Immediate Block Acknowledgement
PSMP
MTBA
RIFS
L-SIG TXOP protection
Link adaptation using MCS feedback
Encryption
■ Hardware encryption according to IEEE 802.11-2007 and IEEE 802.11w/D10.0:
WEP40/64
WEP104/128
CCMP (AES)
TKIP
BIP
OS Support:
Windows Mobile 7 and 6.x, Windows CE 6.1 and 5, Linux v2.6, Android, Symbian
1-321-255-0515
WWW.SAGRAD.COM
DOC#: SG914-0029 rev. 0.5
Preliminary
Mechanical (Bottom View)
The nominal size of the part is 8.5x9.5mm with a height of 1.3 mm
1-321-255-0515
WWW.SAGRAD.COM
DOC#: SG914-0029 rev. 0.5
Preliminary
Recommended Layout Pads (Top View)
PCB design requires detailed review of the center exposed pad. This pad requires good thermal
conductivity. Soldering coverage should be maximized and checked via x-ray for proper design. There is
a trade off in providing enough solder for conductivity, and too much which allows the module to “float”
on the paddle creating reliability issues. Sagrad recommends two approaches, a large center via that
allows excess soldering to flow down into the host PCB with smaller vias around it. Or many smaller vias
with just enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the
smaller vias. Each of these approaches need to result in 60% or more full contact solder coverage on the
paddle after reflow. Sagrad strongly encourages PCB layout teams to work with their EMS providers to
insure vias and solder paste designs will result in satisfactory performance.
Packaging
The part comes packaged in Tape and Reel or Bulk.
1-321-255-0515
WWW.SAGRAD.COM
DOC#: SG914-0029 rev. 0.5