SFH 4240-Z

www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4240   SFH 4240 Power TOPLED ® High Power Infrared Emitter (940 nm) Applications ——White Goods ——Electronic Equipment ——Industrial Automation (Machine Controls, Light Barriers, Vision Controls) Features: ——Package: clear epoxy ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——High Power Infrared LED ——Short switching times ——High forward current allowed at high temperature  Ordering Information  Type Radiant intensity  1)2) IF = 100 mA; tp = 20 ms Ie 11 ... 28 mW/sr  SFH 4240-Z 1 Version 1.5 | 2020-08-26 Radiant intensity 1) typ. IF = 100 mA; tp = 20 ms Ie 18 mW/sr Ordering Code Q65110A7513 SFH 4240   Maximum Ratings  3) TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Forward current IF max. 100 mA Surge current tp ≤ 100 µs; D = 0  IFSM max. 1A Reverse voltage 4) VR max. 5V Power consumption Ptot max. 180 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV   2 Version 1.5 | 2020-08-26 Values SFH 4240   Characteristics  5) IF = 100 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 42 nm Half angle φ typ. 60 ° Dimensions of active chip area LxW typ. 0.3 x 0.3 mm x mm Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω tf typ. 12 ns Forward voltage 6) VF typ. max. 1.5 V 1.8 V Forward voltage 6) IF = 1 A; tp = 100 µs VF typ. max. 2.3 V 3V Reverse current 4) VR = 5 V IR max. 10 µA Radiant intensity 1) IF = 1 A; tp = 25 µs Ie typ. 135 mW/sr Total radiant flux 5) Φe typ. 55 mW Temperature coefficient of voltage TCV typ. -1.3 mV / K Temperature coefficient of brightness TCI typ. -0.5 % / K Temperature coefficient of wavelength TCλ typ. 0.3 nm / K Thermal resistance junction solder point real 7) RthJS real max. 140 K / W Thermal resistance junction ambient real 8) RthJA max. 300 K / W   3 Version 1.5 | 2020-08-26 Values SFH 4240   Brightness Groups  TA = 25 °C Group Radiant intensity 1)2) IF = 100 mA; tp = 20 ms min. Ie Radiant intensity 1)2) IF = 100 mA; tp = 20 ms max. Ie R 11 mW/sr 18 mW/sr S 18 mW/sr 28 mW/sr Only one group in one packing unit (variation lower 2:1) Relative Spectral Emission 9), 10) Ie,rel = f (λ); IF = 100 mA; tp = 20 ms OHF04134 100 I rel %  80 60 40 20 0 800 850 900 950 nm 1025  λ 4 Version 1.5 | 2020-08-26 SFH 4240   Radiation Characteristics 9), 10) Ie,rel = f (φ) 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 0˚ 20˚ 40˚ 80˚ 100˚ 120˚ 9), 10) Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs OHF03822 100 A OHF03821 101 Ie I e (100 mA)  10-1 5 100 5 10-2 10-1 5 5 10-3 10-2 5 5 10-4 60˚ Relative Radiant Intensity 9), 10) IF = f (VF); single pulse; tp = 100 µs IF 0.4 0 0.5 1 1.5 2 V 2.5  VF 5 Version 1.5 | 2020-08-26 10-3 0 10 5 10 1 5 10 2 mA 10 3 IF SFH 4240   Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); Rthja = 300K / W; single pulse IF = f (tp); D = parameter; TA = 25°C OHL01716 120 mA IF I F 100 1.2 A 1.0 OHF05438 t tP D = TP IF T D= 80 0.8 60 0.6 40 0.4 20 0.2 0 0 20 40 60 ˚C 120 80 Permissible Pulse Handling Capability IF = f (tp); D = parameter; TA = 85°C IF OHF05708 t D = TP 0.9 0.8 0.7 0.6 0.5 0.4 0.3 D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 tP IF  T 0.2 0.1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102  tp 6 Version 1.5 | 2020-08-26 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp TA 1.1 A 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 SFH 4240   Dimensional Drawing 11) Further Information: Approximate Weight: 31.0 mg Package marking: Cathode Pin Description 1 Cathode 2 3  4  7 Version 1.5 | 2020-08-26 Anode Anode Anode SFH 4240   Recommended Solder Pad   8 Version 1.5 | 2020-08-26 11) SFH 4240   Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature  60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 Time 25 °C to TP  All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version 1.5 | 2020-08-26 °C 480 s K/s s SFH 4240   Taping 11)   10 Version 1.5 | 2020-08-26 SFH 4240   Tape and Reel 12) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000 330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 8000   11 Version 1.5 | 2020-08-26 SFH 4240   Barcode-Product-Label (BPL) Dry Packing Process and Materials 11) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539  Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 12 Version 1.5 | 2020-08-26 SFH 4240   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes   13 Version 1.5 | 2020-08-26 SFH 4240   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer.   14 Version 1.5 | 2020-08-26 SFH 4240   Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Brightness: The brightness values are measured with a tolerance of ±11%. 3) Temperature Coefficient: Measurement limits describe actual setting and do not include measurement uncertainties. Each wafer and fragment of a wafer is subject to final testing. The wafer or its pieces are individually attached on foils (rings). All el. values are referenced to the vendor’s measurement system (correlation to customer product(s) is required). Measurement uncertainty +/- 15% for brightness, +/- 1nm for wavelength and +/- 0.1V for voltage. 4) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED. 5) Total radiant flux: Measured with integrating sphere. 6) Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V. 7) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 8) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 9) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 10) Testing temperature: TA = 25°C (unless otherwise specified) 11) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 12) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.   15 Version 1.5 | 2020-08-26 SFH 4240   Revision History Version Date Change 1.5 2020-08-26 Schematic Transportation Box Dimensions of Transportation Box   16 Version 1.5 | 2020-08-26 SFH 4240     Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 17 Version 1.5 | 2020-08-26