Technical Data Sheet
ASSEMBLY
MATERIALS
Product Type: Flux
Product Name: NC5070
Description
Key Benefits
No clean tacky flux for bumping, BGA, CSP,
surface mount and hybrid applications.
Compliant Products
Applications
TF 38
SF 64
ROL0
Printing
Dispensing
Halogen Content
Flux Activity
Activity Level
(J-STD 004)
Suitable for lead free and lead
containing bumps
Excellent wetting behaviour
Perfect cleaning properties
Halogen-Zero
(No halogen added in the flux)
Classification
Tolerances: Halogen < 50 ppm; measured according to
BS EN 14582
No Clean/
Solvent Clean
Cleaning Instructions
Flux residues may remain on the circuit and do not need to be washed. For cleaning of flux residues, Zestron
and Vigon cleaners can be used – see separate cleaning recommendations.
Storage
Flux Conditioning
Store the flux in tightly-sealed cartridges
and avoid exposure to sunlight and high
humidity
Max expiration date: please refer to the
expiry date on the label of the packaged
product
Storage condition in the refrigerator at 2 –
10 °C
Store cartridges with tip pointing
downwards
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12 – 14
63450 Hanau, Germany
www.heraeus-electronics.com
The flux is used as supplied and the fresh
flux is applied to the board directly from a
cartridge
Americas
China
Phone +1 610 825 6050
electronics.americas@heraeus.com
Phone +86 21 3357 5457
electronics.china@heraeus.com
Asia Pacific
Europe, Middle East and Africa
Phone +65 6571 7677
electronics.apac@heraeus.com
Phone +49 6181 35 3069, +49 6181 35 3627
electronics.emea@heraeus.com
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
HET22006-0516-1
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