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认
书
APPROVAL SHEET
客 户 名 称:
/
Customer
叠层片式铁氧体大电流磁珠
产 品 名 称:
Multilayer Chip Ferrite Large Current Beads
Part Name
产 品 规 格:
CBW201209U Series
Specification
版 本 号:
18.01
Version No.
日
期:
2018-5-21
DATE
制造
客户
Manufacturer
Customer
拟制
审核
确认
检验
审核
批准
Draft by
Checked by
Approve by
Check by
Checked by
Approval by
林晓华
徐雪枫
覃贤
履 历 表 Resume
版本
Version No.
18.01
修 改 明 细
Modify Details
首次发行 Initial issue
日期
Date
2018-5-21
Page 1 of 13
序号
No
目
录
TABLE OF CONTENTS
1
外形尺寸与内部结构 Dimension & Inner-configuration
2
产品品名构成 Product Spec. Model
3
电性能参数表 Electrical Characteristics List
4
可靠性试验项目 Reliability Testing Items
5
产品包装 Packaging
6
推荐焊接条件 Recommend Soldering Conditions
7
清洗 Cleaning
8
存储要求 Storage Requirements
9
ODS(消耗臭氧层物质)的使用情况 Usage Of ODS
10
注意事项 Notes
Page 2 of 13
1 外形尺寸与内部结构 Dimension & Inner-configuration:
外形尺寸图:
内部结构图:
a.银层 Ag layer
b.镀层 Ni/Sn plating
c.内电极 Inner electrode
d.瓷体 Body
e.端电极 Terminal electrode
f.瓷体 ferrite or ceramic
序号 No.
部位 Component
材料 Material
1
瓷体Body
铁氧体电感:镍铜锌体系Ni-Cu-Zn
2
内电极Inner electrode
纯银Ag
3
端电极
Terminal electrode
银层 Ag layer
银Ag
Ni/Sn镀层Ni/Sn plating
镍层-锡层Ni-Sn
单位Unit:mm(inch)
型号 Size
L
W
T
a
201209
2.0±0.20(0.079±0.008)
1.2±0.20(0.047±0.008)
0.9±0.20(0.035±0.008)
0.5±0.3(0.020±0.012)
Page 3 of 13
2 产品品名构成 Product Spec. Model
CBW
201209 U
300 T
包装 Packaging:编带包装: Tape & Reel:T
阻值 Impedance:3×101=30Ω
材料代号 Material code:U
尺寸 Dimensions:(L×W×T ) ( 2.0×1.2×0.9mm)
产品类型 Product Typel:
CBW:叠层片式铁氧体大电流磁珠 Multilayer Chip Ferrite Large Current Beads
注:磁珠阻抗误差范围在型号规格中无显示,
Note:The impedance Tolerance range of the Chip Bead is not mentioned in the model specifications.
000T 误差范围 Tolerance range:0-15Ω;
050T 误差范围 Tolerance range:0-15Ω;
070T 误差范围 Tolerance range:0-11Ω;
090T 误差范围 Tolerance range:5-13Ω;
110T 误差范围 Tolerance range:7-15Ω;
150T 误差范围 Tolerance range:9-21Ω;
190T 误差范围 Tolerance range:12-25Ω;
220T-152T 误差范围 Tolerance range : 控制为±25% controlled by ±25%.
Page 4 of 13
3 电性能参数表 Electrical Characteristics List
误差
范围
Tolerance
标称阻抗
Impedance
(Ω)
直流电阻
RDC
(Ω)max
测试频率
Test
frequency
(MHz)
测试电压
Test voltage
(mV)
额定电流
Rated
current
(mA)max
CBW201209U000T
0~15Ω
0
0.03
100
50
3000
CBW201209U050T
0~15Ω
5
0.03
100
50
3000
CBW201209U070T
0~11Ω
7
0.03
100
50
3000
CBW201209U090T
5~13Ω
9
0.03
100
50
3000
CBW201209U110T
7~15Ω
11
0.03
100
50
3000
CBW201209U150T
9~21Ω
15
0.03
100
50
3000
CBW201209U190T
12~25Ω
19
0.03
100
50
3000
CBW201209U300T
±25%
30
0.05
100
50
3000
CBW201209U310T
±25%
31
0.05
100
50
3000
CBW201209U360T
±25%
36
0.06
100
50
3000
CBW201209U600T
±25%
60
0.06
100
50
3000
CBW201209U700T
±25%
70
0.08
100
50
2500
CBW201209U800T
±25%
80
0.08
100
50
2500
CBW201209U101T
±25%
100
0.10
100
50
2500
CBW201209U121T
±25%
120
0.10
100
50
2000
CBW201209U151T
±25%
150
0.10
100
50
2000
CBW201209U181T
±25%
180
0.15
100
50
2000
CBW201209U201T
±25%
200
0.15
100
50
2000
CBW201209U221T
±25%
220
0.15
100
50
2000
CBW201209U301T
±25%
300
0.20
100
50
2000
CBW201209U501T
±25%
500
0.25
100
50
1500
CBW201209U601T
±25%
600
0.25
100
50
1500
CBW201209U801T
±25%
800
0.30
100
50
800
CBW201209U102T
±25%
1000
0.30
100
50
800
CBW201209U122T
±25%
1200
0.45
100
50
500
CBW201209U152T
±25%
1500
0.50
100
50
300
CBW201209U202T
±25%
2000
0.50
100
50
300
CBW201209U222T
±25%
2200
0.60
100
50
100
CBW201209U252T
±25%
2500
0.60
50
50
100
型号规格
Part NO.
客户料号
Customer
P/N
Page 5 of 13
4 可靠性试验项目 Reliability Testing Items
序
号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
工作温度范围
1
Operating
Temperature
-40℃~+85℃
Range
预热温度:120℃ ~ 150℃
预热时间: 60s
焊料:(96.5%Sn/3.0%Ag/0.5%Cu)焊锡
焊锡温度: 245℃±5℃
浸锡深度:10mm
2
可焊性
Solder ability
至少 95%端电极表面被焊锡覆盖。
浸锡时间 : 5±1s
At least 95% of terminal electrode
浸绩到助焊剂约:3 ~ 5 s
should be covered with solder
Preheating temperature:120℃ to 150℃
Preheating time: 60s
Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn
solder.
Solder temperature: 245±5℃
Immersion tin depth:10mm
Duration : 5±1s
Dip performance to a flux of about:3 ~ 5 s
预热温度: 120℃~150℃
至少 95%的焊锡覆盖在端电极表面,无
预热时间: 60s
可见机械损伤。
焊料:(96.5%Sn/3.0%Ag/0.5%Cu)焊锡
阻抗变化率小于±30%。
浸锡温度: 260℃±5℃
At least 95% of terminal electrode
浸锡深度:10mm
should be covered with solder.
浸锡时间 : 10±1s
No mechanical damage.
浸绩到助焊剂约:3 ~ 5 s
Resistance
Inductance :
Preheating temperature: 120℃ to 150℃
to Soldering
Impedance change: within ±30%
Preheating time: 60s
耐焊接热
3
Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn
solder.
Solder temperature: 260℃±5℃
Immersion tin depth:10mm
Duration : 10±1s
Dip performance to a flux of about:3 ~ 5 s
Page 6 of 13
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
施加力:2012 系列为 10N。
保持时间:10±1S
Applied force: 10N force for 2012 series.
4
端电极强度
端电极与磁体不应受损,无可见机械损
Adhesion of
伤。
electrode
Keep time :10±1S
The termination and body should be
no damage.
无可见机械损伤,
5
耐低温
阻抗变化率小于±30%。
Low
No mechanical damage.
测试温度:-40±2℃
+24
测试时间:1000 -0 h
Impedance change: within ±30%
Temperature:-40±2℃
temperature
resistance
+24
-
Testing time:1000 0 h
测试基板:玻璃环氧树脂基板
加压速度为 0.5mm/s,弯度:2mm,保持时间≥30s
Testing board: glass epoxy-resin substrate
抗弯强度
6
Bending
strength
无可见机械损伤,
For 0.5mm/s compression speed, curvature:
阻抗变化率小于±30%。
2mm, hold time 30 s
No mechanical damage.
Impedance change: within ±30%
无可见机械损伤,
7
跌落
Drop
从高度为 1 米的空中自由落到混凝土地板重复
阻抗变化率小于±30%。
10 次。
No mechanical damage.
Impedance change: within ±30%
Page 7 of 13
Drop 10 times on a concrete floor from a high
of 1m.
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
振幅:1.5mm
振动
8
Vibration
无可见机械损伤,
测试时间:沿三个垂直方向各做 2 小时
阻抗变化率小于±30%。
频率范围:10Hz~55Hz~10Hz (1 分钟)
No mechanical damage.
Amplitude modulation: 1.5mm
Impedance change: within ±30%
Test time: A period of 2h in each of 3
mutually perpendicular directions.
Frequency range: 10Hz to 55Hz to 10Hz for
1min.
+24
无可见机械损伤,
测试时间:1000 -0 h
High
阻抗变化率小于±30%。
测试温度:85±2℃
temperature
No mechanical damage.
耐高温
9
resistance
+24
Impedance change: within ±30%
Testing time: 1000 -0 h
Temperature: 85±2℃
湿度:90%~95% RH,温度:60℃±2℃
恒定湿热
10
+24
无可见机械损伤,
Static
阻抗变化率小于±30%。
Humidity
No mechanical damage.
测试时间:1000 -0 h
Impedance change: within ±30%
Humidity: 90% to 95% RH
Temperature: 60℃±2℃
+24
-
Testing time: 1000 0 h
施加电流:额定电流
高温负载
11
无可见机械损伤,
High
阻抗变化率小于±30%。
temperature
No mechanical damage.
load
+24
测试时间:1000 -0 h
测试温度:85℃±2℃
Impedance change: within ±30%
impose current: at room
+24
Testing time: 1000 -0 h
Temperature: 85±2℃
Page 8 of 13
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
温度:-40℃,30±3 分钟
+85℃,30±3 分钟
循环次数:32
无可见机械损伤,
温度循环
12
Thermal
Shock
Temperature: -40℃ for 30±3min
阻抗变化率小于±30%。
+85℃ for 30±3min
Number of cycles: 32
No mechanical damage.
Impedance change: within ±30%
注:以上要求测试电性能的项目,应试验后在标准条件下放置 24 小时后测试。
Note: When there are questions concerning, measurement shall be made after 24±2hrs of recovery
under the standard condition.
5 产品包装 Packaging
1)编带图 Taping drawings
2)卷盘尺寸 Reel dimensions (Unit: mm)
型号 Size
A
B
C
N
G
CF-8
178±2.0
22.0±2.0
12.5±1.5
57±2.0
8
Page 9 of 13
3) 导带及空格部分 Leader and blank portion
4)编带尺寸 Taping dimensions (Unit: mm)
纸带 Paper tape
Part
NO.
A0
B0
W
F
E
P1
P2
P0
D0
T
201209
1.50±0.2
2.30±0.2
8.0±0.2
3.5±0.1
1.75±0.2
4.0±0.2
2.0±0.1
4.0±0.2
1.55±0.1
0.95±0.1
5)剥离力检验 Peeling off force
① 盖带的剥离力:沿面胶移动方向拉时要求剥离力为 0.1N~0.7N。
Peeling force should be 0.1~0.7N pulling in the direction of arrow.
② 剥离速度:300mm/min
Speed of peeling off: 300mm/min.
③ 在纸带剥落时,面胶不能有破损,不能粘纸带。
The cover bond should not be damaged and bond the tape when it peeled off.
Page 10 of 13
6)包装数量(单位:粒)Packaging number (Unit: Pcs )
类型 SIZE
201209
每卷数量 REEL
4000
每盒数量 BOX
40000
每箱数量 CASE
240000
7) 标签粘贴位置 Label stick station
卷盘标签 Reel label
纸盒标签 Carton label
纸盒标签 Carton label
外箱标签 Outer box label
6 推荐焊接条件 Recommend Soldering Conditions
1) 焊接条件 Soldering Conditions
产品适用于回流焊 Products can be applied to reflow soldering.
① 焊接要求 Soldering conditions
z
预热时,产品表温与焊料温度的温差最大不允许超出 150℃,焊接完冷却时,产品表温与溶剂温度
之间的温差最大不超过 100℃。预热不足有可能引发产品表面裂纹,从而导致产品品质下降。
Pre-heating should be in such a way that the temperature difference between solder and ferrite
surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such way
that the temperature difference is limited to 100℃ max. Un-enough pre-heating may cause
cracks on the ferrite, resulting in the deterioration of product quality.
z
产品要在以下画出的曲线允许的范围内进行焊接。其它焊接条件可能引起产品电极的腐蚀。当焊接
重复时,允许的时间为第一次做的累计时间。
Products should be soldered within the following allowable range indicated by the slanted line.
The excessive soldering conditions may cause the corrosion of the electrode. When soldering is
repeated, allowable time is the accumulated time.
2) 回流焊曲线 Reflow soldering profile
Page 11 of 13
3)手工焊接 Iron soldering
烙铁温度:350℃ (Max)
功率:最大为 30W
烙铁停留时间:
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