0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
CMC1206S-261T

CMC1206S-261T

  • 厂商:

    FH(风华)

  • 封装:

    SMD,3.2x1.6mm

  • 描述:

    共模电感 310mA ±25% 500mΩ 260Ω IND_3.2X1.6MM_SM

  • 数据手册
  • 价格&库存
CMC1206S-261T 数据手册
承 认 书 APPROVAL SHEET 客 户 名 称: / Customer 绕线共模片式电感器 产 品 名 称: Chip Common Mode Choke Coils Part Name 产 品 规 格: CMC0805S 、CMC1206S Series Specification 版 本 号: 18.01 Version No. 日 期: 2018-5-21 DATE 制造 客户 Manufacturer Customer 拟制 审核 确认 检验 审核 批准 Draft by Checked by Approve by Check by Checked by Approval by 林晓华 徐雪枫 区军沛 序号 No 目 录 TABLE OF CONTENTS 1 履 历 表 Resume 2 外形尺寸与内部结构 Dimension & Inner-configuration 3 产品品名构成 Product Spec. Model 4 电性能参数表 Electrical Characteristics List 5 可靠性试验项目 Reliability Testing Items 6 产品包装 Package 7 推荐使用的焊接曲线 Recommended soldering profile 8 清洗 Cleaning 9 存储要求 Storage Requirements 10 ODS(消耗臭氧层物质)的使用情况 Usage Of ODS 11 注意事项 Notes Page 1 of 12 1. 履 历 表 Resume 版本 Version No. 18.01 修 改 明 细 Modify Details 首次发行 Initial issue 日期 Date 2018-5-21 Page 2 of 12 2 外形尺寸与内部结构 Dimension & Inner-configuration: 序号 No. 部位 Component 材料 Material 1 磁芯Core 镍锌铁氧体Ni-Zn ferrite 2 盖板Cover plates 镍锌铁氧体Ni-Zn ferrite 3 电极Electrode 底层 Layout 0 中层 Layout 1 表层 Layout 2 银 Ag 镍Ni 锡 Sn 4 漆包线Wire 铜Cu 5 粘接胶Adhesive 树脂Epoxy 单位Unit:mm 型号 type L W T A B C D E F CMC0805S 2.0±0.2 1.2±0.2 1.2±0.2 0.45 0.45 2.6 0.8 1.2 0.4 CMC1206S 3.2±0.2 1.6±0.2 1.8±0.2 0.6 0.6 3.7 1.6 1.6 0.4 3 产品品名构成 Product Spec. Model CMC 1206 S — 900 T ① ② ③ ④ ⑤ ① 绕线共模片式电感器系列 WIRE WOUND CHIP COMMON MODE CHOKE COILS; ② 外型尺寸代号 DIMENSIONS:0805(2.0×1.2mm),1206(3.2×1.6mm); ③ 设计代号 DESIGN SYMBOL:S—电磁屏蔽型 Magnetically Shielded ④ 标称阻抗 IMPEDANCE: 900=90Ω;371=370Ω;102=1000Ω; ⑤包装类型 PACKAGING TYPE: T—卷盘包装 Tape&Reel;B—散装 Bulk。 Page 3 of 12 4 电性能参数表 Electrical Characteristics List 测试频率 客户料号 误差范围 标称阻抗 Customer Tolerance Impedance P/N (%) (Ω) CMC0805S-670T ±25 67 100 0.25 CMC0805S-700T ±25 70 100 CMC0805S-750T ±25 75 CMC0805S-900T ±25 CMC0805S-121T 型号规格 Test 直流电阻 Rated 额定电流 绝缘电阻 Idc IR (mA)max (MΩ)min 50 400 10 0.30 50 400 10 100 0.30 50 400 10 90 100 0.35 50 330 10 ±25 120 100 0.30 50 370 10 CMC0805S-161T ±25 160 100 0.35 50 330 10 CMC0805S-181T ±25 180 100 0.35 50 330 10 CMC0805S-261T ±25 260 100 0.40 50 300 10 CMC0805S-301T ±25 300 100 0.42 50 290 10 CMC0805S-361T ±25 360 100 0.45 50 280 10 CMC0805S-371T ±25 370 100 0.45 50 280 10 CMC0805S-451T ±25 450 100 0.50 50 250 10 CMC0805S-601T ±25 600 100 0.60 50 220 10 CMC0805S-901T ±25 900 100 0.90 50 150 10 Part NO. frequency (MHz) Page 4 of 12 Rdc 额定电压 (Ω)max Voltage (Vdc)max 测试频率 客户料号 误差范围 标称阻抗 Customer Tolerance Impedance P/N (%) (Ω) CMC1206S-900T ±25 90 100 0.30 CMC1206S-161T ±25 160 100 CMC1206S-261T ±25 260 CMC1206S-371T ±25 CMC1206S-601T 型号规格 Test 直流电阻 Rated 额定电流 绝缘电阻 Idc IR (mA)max (MΩ)min 50 370 10 0.40 50 340 10 100 0.50 50 310 10 370 100 0.50 50 300 10 ±25 600 100 0.80 50 260 10 CMC1206S-801T ±25 800 100 0.90 50 240 10 CMC1206S-102T ±25 1000 100 1.00 50 230 10 CMC1206S-142T ±25 1400 100 1.00 50 220 10 CMC1206S-202T ±25 2000 100 1.20 50 200 10 CMC1206S-222T ±25 2200 100 1.20 50 200 10 Part NO. frequency (MHz) Page 5 of 12 Rdc 额定电压 (Ω)max Voltage (Vdc)max 5 可靠性 Reliability Data 序号 No. 项目 Items 要求 Requirements 试验方法及备注 Test Methods and Remarks ①、除非另有规定,所有试验和测量在下述条件进行。Unless otherwise specified, all tests and measurements shall be carried out in the following conditions. a)温度 Temperature:15℃~+35 ℃; b)相对湿度Relative humidity:25%~75%; 试验用标准条件 1 c)气压 pressure:86 kPa~106 kPa。 Test Standard ②、在上述条件下测定有异议发生场合,按下述条件进行。Under the above conditions, Conditions the conditions for the determination of dissension shall be conducted according to the following conditions. a)温度 Temperature: 20℃±1℃; b)相对湿度 Relative humidity:63%~67%; c)气压 pressure:86 kPa~106 kPa。 2 工作温度范围 Operating Temperature Range / -40℃~+85℃ ①外观无可见损伤痕迹; 3 可焊性 Solder ability No visible mechanical damage. ②端电极表面焊锡覆盖率。 4 Resistance to Soldering CMC series:≥80%。 5±1s. No visible mechanical damage. ② 阻抗变化不超过±20%; Impedance shall not change more CMC series:≥10 MΩ Vibration 在 260±5℃熔融的焊锡(96.5%Sn/ 3.0%Ag/0.5%Cu)中浸置 10±1s。 Dip pads in flux and dip in solder pot(96.5Sn/3.0Ag/0.5Cu)at 260±5℃ for The rated voltage is applied between the two windings for a minute. ①外观无可见损伤痕迹; 6 for 两绕组间施加额定电压,持续一分钟。 Resistance 振动 245±5℃ 10±1s. 绝缘电阻 Insulation Dip pads in flux and dip in solder pot(96.5Sn/3.0Ag/0.5Cu)at than ±20%. 5 3.0%Ag/0.5%Cu)中浸置 5±1s。 Electrode surface solder coverage. ① 外观无可见损伤痕迹; 耐焊接热 在 245±5℃熔融的焊锡(96.5%Sn/ No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more than ±20%. 振幅 1.5mm,频率 10~55Hz,每个方向(X、Y、 Z)保持 2 小时。Inductors shall be subjected to vibration of 1.5mm amplitude frequency 10~55Hz (10Hz to 55Hz to 10Hz in a period of 1 minute) for 2h in each of three(X、Y、 Z) axes. Page 6 of 12 序号 No. 项目 Items 要求 Requirements 试验方法及备注 Test Methods and Remarks 将产品焊在 PCB 板上,按下图、表所示方向 及要求施加作用力。Weld the product on the PCB board, and apply force as shown in the diagram, direction and requirement. 端电极强度 7 Adhesion of electrode ①试验后端电极无脱落; The end electrode did not fall off after the test. ②外观无可见损伤痕迹。 No visible mechanical damage. 尺寸规格 Size 施加力要求 CMC0805 Series 5N CMC1206 Series 10 N Keep time: (10±1)s Speed: 1.0 mm/s. 耐低温 8 Low temperature resistance ①外观无可见损伤痕迹; No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more than ±20%. ①外观无可见损伤痕迹; 9 耐高温 High Temperature No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more than ±20%. +24 在温度-40±2℃的环境中存放 1000 -0 h; Component shall be subjected to -40±2℃ +24 for 1000 -0 h. +24 在温度 85±2℃的环境中存放 1000 -0 h; Component shall be subjected to 85±2℃ +24 for1000 -0 h . ①在以下每个温度保持 4 小时。 In the following each temperature keep the 4 h. a)20±2℃;b) -40±2℃; 阻抗随温度变化率不超过±20%。 c)20±2℃;d) 85±2℃。 Temperature Impedance shall not change more than ②然后以 c)温度为基础下分别与最高温及最 Characteristic ±20%. 低温下阻抗偏差值计算变化率。 温度特性 10 Then based on the temperature of C, the variation rate of the impedance deviation at the highest temperature and the lowest temperature is calculated respectively. Page 7 of 12 序号 No. 项目 Items 要求 Requirements ① +85℃ 60 分钟 ←→ -40℃ 60 分,钟循环 32 ①外观无可见损伤痕迹; 温度循环 11 Thermal Shock No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more than ±20%. 高温负载 High 12 temperature load Static Humidity +85℃60minutes ←→ -40℃ 60minutes 32 Cycles. ②转换时间:2~3 分钟。 ① 施加额定电流; ①外观无可见损伤痕迹; No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more ①外观无可见损伤痕迹; 13 次; Transforming interval: 2~3 min. than ±20%. 恒定湿热 试验方法及备注 Test Methods and Remarks No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more than ±20%. Apply the rated current. +24 ② 在 85±2℃温度条件下存放 1000 -0 h; Component shall be subjected to 85±2℃ +24 for1000 -0 h. 放置在于湿度 90%~95%,温度 60±2℃的环境中 +24 存放 1000 -0 h。 Component shall be subjected to 90% ~ +24 95%RH. at 60±2℃ for1000 -0 h . ①将产品安装于试验基板上;在垂直方向施加力 (如下图所示)。Install the Component on the test substrate; Apply force in the vertical direction (as shown below). ②该板应在(1±0.5) mm/s 的弯曲速率向下弯 曲 2 mm,保持时间≥5 s。 The epoxy plate should 抗弯强度 14 Bending strength bend down to 2 mm at the bending rate of (1 外观无可见损伤痕迹; No visible mechanical damage. ①外观无可见损伤痕迹; 耐溶剂性 15 Solvent Resistance ±0.5) mm/s,Keep time ≧ 5 sec. 将元件浸泡在 23±5℃的异丙醇溶液中,保持 No visible mechanical damage. ②阻抗变化不超过±20%; Impedance shall not change more 5±0.5 分钟。 Soak in the element 23±5℃ in isopropyl alcohol solution, keep 5±0.5 min. than ±20%. 注:以上要求测试电性能的项目,在室温下放置至少 2 h 后在 48 h 内进行测试。 Note:When there are questions concerning, test within 48 h after placing at room temperature for at least 2 h. Page 8 of 12 6 包装 Package 1)编带图 Taping drawings 2)卷盘尺寸 Reel dimensions (Unit:mm) Part NO. ΦA typ. ΦB typ. ΦC typ. D typ. 0805~1206 178 60 13 8.4 3)导带及空格部分 Leader and blank portion 4)编带尺寸 Taping dimensions (Unit: mm) z 塑料胶带 Embossed tape Part NO. W E F D0 D1 P0 P1 P2 P0×10 t A0 B0 K0 0805 8.00 1.75 3.50 1.50 0.65 4.00 4.00 2.00 40.00 0.23 1.50 2.25 1.40 1206 8.00 1.75 3.50 1.50 0.65 4.00 4.00 2.00 40.00 0.23 1.90 3.55 2.00 Page 9 of 12 5)剥离力检验 Peeling off force ①盖带的剥离力要求 Peeling required 0805~1206 series :20g~80g 0805~1206 系列 :20 克~80 克 ②测试条件 Test condition 盖带剥离速度:300mm/min±10% Speed of peeling off : 300mm/min±10% 盖带剥离角度:165°~180° Angle of peeling off: 165°~180° 6)包装数量(单位:粒)Packaging number (Unit: Pcs ) 类型 Size 每卷数量 Per Reel 1206 2000 0805 3000 3 卷盒 6000 9000 5 卷盒 10000 15000 10 卷盒 20000 30000 1.5 盒箱 30000 45000 3 盒箱 60000 90000 4 盒箱 80000 120000 5 盒箱 120000 180000 每盒数量 Per Box 每箱数量 Per Case 7) 标签粘贴位置 Label stick station 卷盘标签 Reel label 纸盒标签 Carton label 纸盒标签 Carton label 外箱标签 Outer box label 7 推荐使用的焊接曲线 Recommended soldering profile 1) 焊接条件 Soldering Conditions 本产品建议使用回流焊接法。 Applicable soldering process to the products is reflow soldering. ① 焊剂要求 Flux, Solder z 使用松香基助焊剂,禁止使用卤化物含量超过 0.2(wt)%的强酸性助焊剂。 Don’t use highly acidic flux with halide content exceeding 0.2(wt)%(chlorine conversion value). z 使用无铅焊料(96.5Sn /3.0Ag/0.5Cu)。 Using lead-free solder (96.5Sn /3.0Ag/0.5Cu)。 Page 10 of 12 ② 焊接要求 Soldering conditions z 预热时,产品表温与焊料温度的温差最大不允许超出 150℃,焊接完冷却时,产品表温与溶剂温度 之间的温差最大不超过 100℃。预热不足有可能引发产品表面裂纹,从而导致产品品质下降。 Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such way that the temperature difference is limited to 100℃ max. Un-enough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. z 产品要在以下画出的曲线允许的范围内进行焊接。其它焊接条件可能引起产品电极的腐蚀。当焊接 重复时,允许的时间为第一次做的累计时间。 Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. 2) 回流焊曲线 Reflow soldering profile 3) 手工焊接 Iron soldering 烙铁温度:350℃ (Max) 功率:最大为 30W 烙铁停留时间:
CMC1206S-261T 价格&库存

很抱歉,暂时无法提供与“CMC1206S-261T”相匹配的价格&库存,您可以联系我们找货

免费人工找货
CMC1206S-261T
  •  国内价格
  • 10+0.49676
  • 100+0.45293
  • 500+0.40910
  • 1000+0.36527
  • 2000+0.33605
  • 4000+0.32728

库存:5

CMC1206S-261T
  •  国内价格
  • 20+0.53500
  • 100+0.46210
  • 200+0.38920
  • 500+0.29180
  • 2000+0.24320
  • 10000+0.23100

库存:173