CBG100505U220T

承 认 书 APPROVAL SHEET 客 户 名 称: Customer 叠层片式铁氧体磁珠 产 品 名 称: Multilayer Chip Ferrite Beads Part Name 产 品 规 格: CBG100505U220T Specification 版 本 号： 22.01 Version No. 日 期： DATE 制造 客户 Manufacturer Customer 拟制 审核 确认 检验 审核 批准 Draft by Checked by Approve by Check by Checked by Approval by 林晓华 徐雪枫 滕冲 履 历 表 Resume 版本 Version No. 18.01 20.01 21.01 21.02 22.01 修 改 明 细 Modify Details 首次发行 Initial issue 日期 Date 2018-5-21 修改了可靠性试验项目抗弯强度试验方法及要求 Modified the bending strength test method and requirements of reliability test items. 修改了可靠性试验项目抗弯强度试验方法，修改了温度循环为温度冲击. Modified the reliability test item of bending strength test method, changed the temperature cycling items into temperature shocking . 删除了跌落试验内容. Deleted the drop test item. 修改了可靠性试验项目工作温度范围、修改了耐低温/耐高温/温度冲击试验温度条 件， Modified the working temperature range of reliability test items, modified the temperature conditions of low temperature resistance/high temperature resistance/temperature impact test, 修改了电性能参数，修改了存储期限. Modified the electrical characteristics; modified the storage period. Page 1 of 12 2020-5-28 2021-5-6 2021-11-8 2022-3-28 序号 No 目 录 TABLE OF CONTENTS 1 外形尺寸与内部结构 Dimension & Inner-configuration 2 产品品名构成 Product Spec. Model 3 电性能参数表 Electrical Characteristics List 4 可靠性试验项目 Reliability Testing Items 5 产品包装 Packaging 6 推荐焊接条件 Recommend Soldering Conditions 7 清洗 Cleaning 8 存储要求 Storage Requirements 9 ODS（消耗臭氧层物质）的使用情况 Usage Of ODS 10 注意事项 Notes Page 2 of 12 1 外形尺寸与内部结构 Dimension & Inner-configuration： a.镀层 Ni/Sn plating b.银层 Ag layer c.内电极 Inner electrode d.瓷体 Body e.端电极 Terminal electrode f.瓷体 ferrite or ceramic 序号 No. 部位 Component 材料 Material 1 瓷体Body 铁氧体电感：镍铜锌体系Ni-Cu-Zn 2 内电极Inner electrode 纯银Ag 3 端电极 Terminal electrode 银层 Ag layer 银Ag Ni/Sn镀层Ni/Sn plating 镍层-锡层Ni-Sn 单位Unit：mm（inch） 型号 Size L W T a 100505 1.0±0.15（0.040±0.006） 0.5±0.15（0.020±0.006） 0.5±0.15（0.020±0.006） 0.25±0.1（0.010±0.004） Page 3 of 12 2 产品品名构成 Product Spec. Model CBG 100505 U 220 T 包装 Packaging：编带包装: Tape & Reel T 阻值 Impedance：220=22Ω 材料代号 Material code：U 尺寸 Dimensions：(L×W×T ) ( 1.0×0.5×0.5mm) 产品类型 Product Typel： CBG：叠层片式铁氧体磁珠 Multilayer Chip Ferrite Beads normal beads 注：磁珠阻抗误差范围在型号规格中无显示， Note：The impedance Tolerance range of the Chip Bead is not mentioned in the model specifications. Page 4 of 12 3 电性能参数表 Electrical Characteristics List 型号规格 Part NO. CBG100505U220T 客户料号 Customer P/N 误差 范围 Tolerance 25% 标称阻抗 Impedance （Ω） 直流电阻 RDC （Ω）max 测试频率 Test frequency (MHz) 测试电压 Test voltage （mV） 额定电流 Rated current (mA)max 22 0.15 100 50 300 Page 5 of 12 4 可靠性试验项目 Reliability Testing Items 序号 No. 项目 Items 要求 Requirements 试验方法及备注 Test Methods and Remarks 工作温度范围 1 Operating Temperature -55℃～+125℃ 包含产品表面温升 Includes product surface temperature rise Range 预热温度:120℃ ~ 150℃ 预热时间: 60s 焊料：（96.5%Sn/3.0%Ag/0.5%Cu）焊锡 焊锡温度: 245℃±5℃ 浸锡深度:10mm 2 可焊性 Solder ability 至少 95%端电极表面被焊锡覆盖。 浸锡时间 : 5±1s At least 95% of terminal electrode 浸绩到助焊剂约:3 ~ 5 s should be covered with solder Preheating temperature:120℃ to 150℃ Preheating time: 60s Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 245±5℃ Immersion tin depth:10mm Duration : 5±1s Dip performance to a flux of about:3 ~ 5 s 预热温度: 120℃~150℃ 至少 95%的焊锡覆盖在端电极表面，无 预热时间: 60s 可见机械损伤。 焊料：（96.5%Sn/3.0%Ag/0.5%Cu）焊锡 阻抗变化率小于±30%。 浸锡温度: 260℃±5℃ At least 95% of terminal electrode 浸锡深度:10mm should be covered with solder. 浸锡时间 : 10±1s No mechanical damage. 浸绩到助焊剂约:3 ~ 5 s Resistance Inductance ： Preheating temperature: 120℃ to 150℃ to Soldering Impedance change: within ±30% Preheating time: 60s 耐焊接热 3 Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder. Solder temperature: 260℃±5℃ Immersion tin depth:10mm Duration : 10±1s Dip performance to a flux of about:3 ~ 5 s Page 6 of 12 序号 No. 项目 Items 要求 Requirements 试验方法及备注 Test Methods and Remarks 施加力：1005 系列为 5N。 保持时间：10±1S 4 端电极强度 端电极与磁体不应受损，无可见机械损 Adhesion of 伤。 electrode Applied force: 5N force for 1005 series. Keep time ：10±1S The termination and body should be no damage. 耐低温 5 Low temperature resistance 测试温度:-55±2℃ 24 测试时间:1000 －0 h 无可见机械损伤， 阻抗变化率小于±30%。 No mechanical damage. Impedance change: within ±30% Temperature:-55±2℃ 24 － Testing time:1000 0 h 测试基板:玻璃环氧树脂基板 加压速度为 0.5mm/s,弯度:2mm,保持时间 20s±1s Testing board: glass epoxy-resin substrate For 0.5 mm/s compression speed, curvature: 抗弯强度 6 Bending strength 2mm, hold time 20s±1s 无可见机械损伤， No mechanical damage 振幅:1.5mm 振动 7 Vibration 无可见机械损伤， 测试时间:沿三个垂直方向各做 2 小时 阻抗变化率小于±30%。 频率范围:10Hz～55Hz～10Hz （1 分钟） No mechanical damage. Amplitude modulation: 1.5mm Impedance change: within ±30% Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. Page 7 of 12 序号 No. 项目 Items 耐高温 8 High temperature resistance 要求 Requirements 试验方法及备注 Test Methods and Remarks 24 无可见机械损伤， 测试时间:1000 －0 h 阻抗变化率小于±30%。 No mechanical damage. 测试温度:125±2℃ Impedance change: within ±30% Testing time: 1000 －0 h 24 Temperature: 125±2℃ 湿度:90%～95% RH，温度:60℃±2℃ 恒定湿热 9 Static Humidity 无可见机械损伤， 24 － 测试时间:1000 0 h 阻抗变化率小于±30%。 No mechanical damage. Impedance change: within ±30% Humidity: 90% to 95% RH Temperature: 60℃±2℃ 24 Testing time: 1000 －0 h 施加电流：额定电流 高温负载 10 无可见机械损伤， High 阻抗变化率小于±30%。 temperature No mechanical damage. load 24 测试时间:1000 －0 h 测试温度:85℃±2℃ Impedance change: within ±30% impose current: at room 24 Testing time: 1000 －0 h Temperature: 85±2℃ 温度：-55℃，30±3 分钟 +125℃，30±3 分钟 温度冲击 11 Temperature 无可见机械损伤， 循环次数：100 阻抗变化率小于±30%。 Temperature: -55℃ for 30±3min No mechanical damage. +125℃ for 30±3min Impedance change: within ±30% Number of cycles: 100 Shock 注：以上要求测试电性能的项目，应试验后在标准条件下放置 24 小时后测试。 Note: When there are questions concerning, measurement shall be made after 24±2hrs of recovery under the standard condition. Page 8 of 12 5 产品包装 Packaging 1）编带图 Taping drawings 2）卷盘尺寸 Reel dimensions (Unit: mm) 型号 Size A B C N G CF-8 178±2.0 22.0±2.0 12.5±1.5 57±2.0 8 3）导带及空格部分 Leader and blank portion 4）编带尺寸 Taping dimensions (Unit: mm) 纸带 Paper tape 纸带 Paper tape Page 9 of 12 型号 Size A0 B0 W F E P1 P2 P0 D0 T 100505 0.65±0.1 1.15±0.1 8.0±0.2 3.5±0.1 1.75±0.2 2.0±0.1 2.0±0.1 4.0±0.2 1.55±0.1 0.60±0.1 5）剥离力检验 Peeling off force ① 盖带的剥离力：沿面胶移动方向拉时要求剥离力为 0.1N～0.7N。 Peeling force should be 0.1~0.7N pulling in the direction of arrow. ② 剥离速度：300mm/min Speed of peeling off: 300mm/min. ③ 在纸带剥落时，面胶不能有破损，不能粘纸带。 The cover bond should not be damaged and bond the tape when it peeled off. 6）包装数量（单位：粒）Packaging number (Unit: Pcs ) 型号 Size 100505 每卷数量 REEL 10000 每盒数量 BOX 100000 每箱数量 CASE 600000 7) 标签粘贴位置 Label stick station 卷盘标签 Reel label 纸盒标签 Carton label 纸盒标签 Carton label Page 10 of 12 外箱标签 Outer box label 6 推荐焊接条件 Recommend Soldering Conditions 1） 焊接条件 Soldering Conditions 产品适用于回流焊 Products can be applied to reflow soldering. ① 焊接要求 Soldering conditions  预热时，产品表温与焊料温度的温差最大不允许超出 150℃，焊接完冷却时，产品表温与溶剂温度 之间的温差最大不超过 100℃。预热不足有可能引发产品表面裂纹，从而导致产品品质下降。 Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such way that the temperature difference is limited to 100℃ max. Un-enough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.  产品要在以下画出的曲线允许的范围内进行焊接。其它焊接条件可能引起产品电极的腐蚀。当焊接 重复时，允许的时间为第一次做的累计时间。 Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. 2） 回流焊曲线 Reflow soldering profile 3）手工焊接 Iron soldering 烙铁温度：350℃ Perform soldering at 350℃ on 30W max 功率：最大为 30W Time: < 5S 烙铁停留时间：< 5S（注意不要将烙铁碰到产品端电极）Take care not to apply the tip of the soldering iron to the terminal electrodes 7 清洗 Cleaning 1）清洗条件 Cleaning Conditions 清洗温度：60℃（最高） Cleaning temperature : 60℃ max 清洗时间：1 分钟（最少） Cleaning time: 1 minute min. 超声波功率：最大为 200W Ultrasonic output power: 200W 8 存储要求 Storage Requirements Page 11 of 12 max 1）存储期限 Storage period 距电感公司出厂检验时间 1 年内，产品可以使用检验时间可以通过包装外侧标记的检验号确认。若时间 超过 1 年，应检查焊接性能后方可使用。 Products which inspected inductor company over 1 yeah ago should be examined and used, which can be Confirmed with inspection No. marked on the container. Solder ability should be checked if this period is exceeded. 2）存储条件 Storage conditions ⑴ 存放货物的库房应满足以下条件：温度：-10 ～ +40℃，相对湿度：30 ～ 70%。 ⑵ 禁止将产品保管在腐蚀性物质中，如硫磺、氯气或酸，否则将引起端头氧化，导致降低焊接性。 ⑶ 为了避免受潮气、灰尘等物质的影响，产品应保管于货架上。 ⑷ 产品保管在库房中，应避免热冲击、振动以及直接光照等等。 ⑸ 产品应密封包装。 ⑴ Products should be storage in the warehouse on the following conditions: Temperature : -10~+40℃ Humidity: 30~70% relative humidity ⑵ Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid , or it may case oxidization of Electrodes resulting in poor solder ability. ⑶ Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on. ⑷ Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on. ⑸ Products should be storaged under the airtight packaged condition. 9 ODS（消耗臭氧层物质）的使用情况 Usage Of ODS 1）对于以下所列物质，我公司在生产过程中绝不使用。 ODS：CCl4（四氯化碳）、HCFC 等。 1）For ODS listed below , we don’t use in process。 ODS: CCl4, HCFC, etc. 10 注意事项 Notes （1）若本次承认的为“整体无铅”产品，则表明该产品符合 RoHS 指令的要求。 （2）本承认书保证我司产品作为一个单体时的质量情况，当我司产品被安装到贵司产品上时请保证贵司 的产品已根据贵司的规范进行了有效评价和确认。 （3）如果贵司对我司产品的试用已超过了本测试规范所界定的产品功能，对于此所引发的失效我司将不 予保证。 （1）If the parcel label on product is "Unitary lead free" that indicate the products in accord with ROHS appointed requests. （2）This product specification guarantees the quality of our product as a single unit, Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. （3）We can’t warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification. 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