Technical Data ELX1094
Effective September 2021
ECMT1V24
Common mode choke, through-hole
Applications
Product features
•
Closed magnetic path reduces conductive
EMI emission
•
High impedance and inductance values
•
Robust construction
•
High voltage isolation
•
Independent winding sections
•
Rated voltage: 250 Vac
•
Industrial IoT equipment
•
Motion controls
•
Power supplies
•
Battery backup
•
Renewable energy products
•
Smart meters
•
Solar/wind generators, inverters,
charger controllers
•
Medical equipment
•
High tech consumer products
•
Appliances
Environmental compliance and general
specifications
•
Storage temperature range (Component):
-40 °C to +85 °C
•
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•
Wave solder temperature: +260 °C maximum
HALOGEN
Pb HF
FREE
ECMT1V24
Common mode choke, through-hole
Technical Data ELX1094
Effective September 2021
Product specifications
Part number7
OCL1 (mH)
minimum
(1-2), (4-3)
DCR2 (Ω)
maximum
(1-2), (4-3)
@ +25 °C
Irms3 (A)
(1-4) short 2,3
SRF (kHz)
minimum
Hi-pot4
(Vac)
Hi-pot5
(Vac)
Insulation resistance6
(MΩ) minimum
ECMT1V2429S-5R0-R
5.0
0.3
1.4
712
1500
1000
100
ECMT1V2429S-100-R
10
0.6
1.2
423
1500
1000
100
ECMT1V2429S-150-R
15
0.6
1.0
408
1500
1000
100
ECMT1V2429S-300-R
30
1.6
0.6
276
1500
1000
100
1. Open circuit inductance (OCL) Test parameters: 1 kHz, 0.25 Vrms, 0.0 Adc, +25 °C
2. DCR Test parameters: 4-wire method measured from the root of base, +25 °C
3. Irms: Maximum DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for
AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will
affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case
operating conditions verified in the end application.
4. Hi-pot: Coil-Coil, 2 seconds, 5 mA
5. Hi-pot: Coil-Core, 2 seconds, 5 mA
6. Insulation Resistance: Coil-Coil and Coil-Core, at 500 Vdc
7. Part Number Definition: ECMT1Vxxxxy-zzz-R
ECMT1V = Product code
xxxx= Size indicator
y= Orientation H= horizontal, S= vertical
zzz=Inductance value in mH, R= decimal point, If no R is present last digit indicates number of zeros
-R= RoHS compliant
Mechanical parameters, schematic, pad layout (mm)
ECMT1V2429S-xxx-R
Recommended PCB layout
Part number
A
B
C
D
E
F
G
ECMT1V2429S-xxx-R
20.0 max.
29.0 max.
24.0 max.
3.5 ± 0.5
10.0 ± 0.5
13.0 ± 0.5
0.7 ± 0.1
Part marking: xxx-wwyy, xxx =inductance value in mH, wwyy= lot code
Traces or vias underneath the inductor not recommended
2
www.eaton.com/electronics
Schematic
ECMT1V24
Common mode choke, through-hole
Technical Data ELX1094
Effective September 2021
Packaging information (mm)
ECMT1V2429S-xxx-R
Supplied in tray, 8 trays per carton. (56 parts per tray x 8 trays per box = 448 parts per carton)
(Tray height 25 mm)
www.eaton.com/electronics
3
Technical Data ELX1094
Effective September 2021
Impedance vs frequency
Measurement method
4
www.eaton.com/electronics
ECMT1V24
Common mode choke, through-hole
ECMT1V24
Common mode choke, through-hole
Technical Data ELX1094
Effective September 2021
Inductance vs frequency
www.eaton.com/electronics
5
ECMT1V24
Common mode choke, through-hole
Technical Data ELX1094
Effective September 2021
Wave solder profile
Reference EN 61760-1:2006
Profile feature
Preheat
Standard SnPb solder
Lead (Pb) free solder
• Temperature min. (Tsmin)
100 °C
100 °C
• Temperature typ. (Tstyp)
120 °C
120 °C
• Temperature max. (Tsmax)
130 °C
130 °C
• Time (Tsmin to Tsmax) (ts)
70 seconds
70 seconds
D preheat to max Temperature
150 °C max.
150 °C max.
Peak temperature (TP)*
235 °C – 260 °C
250 °C – 260 °C
Time at peak temperature (tp)
10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25 °C to 25 °C
4 minutes
4 minutes
Manual solder
+350 °C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used
in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2021 Eaton
All Rights Reserved
Printed in USA
Publication No. ELX1094 BU-ELX21104
September 2021
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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