ECMT1V2023S-300-R

Technical Data ELX1093 Effective September 2021 ECMT1V20 Common mode choke, through-hole Applications Product features • Closed magnetic path reduces conductive EMI emission • High impedance and inductance values • Robust construction • High voltage isolation • Independent winding sections • Rated voltage: 250 Vac • Industrial IoT equipment • Motion controls • Power supplies • Battery backup • Renewable energy products • Smart meters • Solar/wind generators, inverters, charger controllers • Medical equipment • High tech consumer products • Appliances Environmental compliance and general specifications • Storage temperature range (Component): -40 °C to +85 °C • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) • Wave solder temperature: +260 °C maximum HALOGEN Pb HF FREE ECMT1V20 Common mode choke, through-hole  Technical Data ELX1093 Effective September 2021 Product specifications Part number7 OCL1 (mH) minimum (1-2), (4-3) DCR2 (Ω) maximum (1-2), (4-3) @ +25 °C Irms3 (A) (1-4) short 2,3 SRF (kHz) minimum Hi-pot4 (Vac) Hi-pot5 (Vac) Insulation resistance6 (MΩ) minimum ECMT1V2023S-2R0-R 2.0 0.08 1.5 976 1500 1000 100 ECMT1V2017H-2R0-R 2.0 0.08 1.5 976 1500 1000 100 ECMT1V2023S-200-R 20 0.55 1.0 245 1500 1000 100 ECMT1V2017H-200-R 20 0.55 1.0 245 1500 1000 100 ECMT1V2023S-300-R 30 0.9 0.8 160 1500 1000 100 ECMT1V2017H-300-R 30 0.9 0.8 160 1500 1000 100 ECMT1V2023S-600-R 60 2.1 0.4 96 1500 1000 100 ECMT1V2017H-600-R 60 2.1 0.4 96 1500 1000 100 1. Open circuit inductance (OCL) Test parameters: 1 kHz, 0.25 Vrms, 0.0 Adc, +25 °C 2. DCR Test parameters: 4-wire method measured from the root of base, +25 °C 3. Irms: Maximum DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 2 www.eaton.com/electronics 4. Hi-pot: Coil-Coil, 2 seconds, 5 mA 5. Hi-pot: Coil-Core, 2 seconds, 5 mA 6. Insulation Resistance: Coil-Coil and Coil-Core, at 500 Vdc 7. Part Number Definition: ECMT1Vxxxxy-zzz-R ECMT1V = Product code xxxx= Size indicator y= Orientation H= horizontal, S= vertical zzz=Inductance value in mH, R= decimal point, If no R is present last digit indicates number of zeros -R= RoHS compliant Technical Data ELX1093 ECMT1V20  Common mode choke, through-hole Effective September 2021  Mechanical parameters, schematic, pad layout (mm) ECMT1V2023S-xxx-R Recommended PCB layout Schematic ECMT1V2017H-xxx-R Recommended PCB layout Schematic Part number A B C D E F G ECMT1V2023S-xxx-R 17.5 max. 20.0 max. 23.0 max. 3.5 ± 0.5 10.0 ± 0.5 13.0 ± 0.5 0.7 ± 0.1 ECMT1V2017H-xxx-R 19.5 max. 19.5 max. 17.0 max. 3.5 ± 0.5 10.0 ± 0.5 13.0 ± 0.5 0.7 ± 0.1 Part marking: xxx-wwyy, xxx =inductance value in mH, wwyy= lot code Traces or vias underneath the inductor is not recommended www.eaton.com/electronics 3 Technical Data ELX1093 Effective September 2021 ECMT1V20 Common mode choke, through-hole  Packaging information (mm) ECMT1V2023S-xxx-R Supplied in tray, 10 trays per carton. (81 parts per tray x 10 trays per box = 810 parts per carton) (Tray height 22 mm) ECMT1V2017H-xxx-R Supplied in tray, 10 trays per carton. (99 parts per tray x 10 trays per box = 990 parts per carton) (Tray height 24 mm) 4 www.eaton.com/electronics ECMT1V20  Common mode choke, through-hole Technical Data ELX1093 Effective September 2021  Impedance vs frequency Measurement method www.eaton.com/electronics 5 Technical Data ELX1093 Effective September 2021 Inductance vs frequency 6 www.eaton.com/electronics ECMT1V20 Common mode choke, through-hole  ECMT1V20  Common mode choke, through-hole Technical Data ELX1093 Effective September 2021  Wave solder profile Reference EN 61760-1:2006 Profile feature Preheat Standard SnPb solder Lead (Pb) free solder • Temperature min. (Tsmin) 100 °C 100 °C • Temperature typ. (Tstyp) 120 °C 120 °C • Temperature max. (Tsmax) 130 °C 130 °C • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C 4 minutes 4 minutes Manual solder +350 °C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2021 Eaton All Rights Reserved Printed in USA Publication No. ELX1093 BU-ELX21103 September 2021 Eaton is a registered trademark. All other trademarks are property of their respective owners. Follow us on social media to get the latest product and support information.