AS0805KKX7R8BB105

85 DATA SHEET SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS Automotive grade with Soft Termination X7R 16 V to 250 V Product Specification – December 28, 2020 V.2 1 nF to 4.7 uF RoHS compliant & Halogento Free Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 16 V to 250 V 2 15 SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER This specification describes Automotive grade X7R series chip capacitors with flexible leadfree terminations and used for automotive equipments. All part numbers are identified by the series, size, tolerance, TC material, packing style, voltage, process code, termination and capacitance value. GLOBAL PART NUMBER AS XXXX X X XXX X (1) APPLICATIONS All general purpose applications Entertainment applications Comfort / security applications Information applications (2) (3) (4) B (5) X XXX (6) (7) (1) SIZE – INCH BASED (METRIC) 0603 (1608) / 0805 (2012) / 1206 (3216)/ 1210 (3225) (2) TOLERANCE J = ± 5% K = ± 10% FEATURES  AEC-Q200 qualified  MSL class: MSL 1  Soldering is compliant with J-STD-020D  Increased mechanical performance  High component and equipment reliability  The capacitors are 100% performed by automatic optical inspection prior to taping. M = ± 20% (3) PACKING STYLE R = Paper/PE taping reel; Reel 7 inch K = Blister taping reel; Reel 7 inch P = Paper/PE taping reel; Reel 13 inch F = Blister taping reel; Reel 13 inch (4) TC MATERIAL X7R (5) RATED VOLTAGE 7 = 16 V 8 = 25 V 9 = 50 V 0 = 100 V A = 200 V Y = 250 V (6) PROCESS B = Class 2 MLCC (7) CAPACITANCE VALUE 2 significant digits + number of zeros The 3rd digit signifies the multiplying factor, and letter R is decimal point Example: 121 = 12 x 101 = 120 pF www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 3 15 16 V to 250 V CONSTRUCTION The capacitor consists of a rectangular block of ceramic dielectric in which a num ber of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. The inner electrodes are connected to the two end flexible terminations and finally covered with a layer of plated tin (NiSn). The terminations are lead-free. A cross section of the structure is shown in Fig.1 and Fig.2. terminations Copper Soft electrode (Stress relaxation) Ni Plating electrodes Sn Plating YNM0049 MLB457 ceramic material Fig. 1 Surface mounted multilayer ceramic capacitor construction OUTLINES DIMENSION Table 1 For outlines see fig. 3 TYPE L1 (mm) W (mm) T (mm) L2/L3(mm) min L2/L3(mm) max L4(mm) min 0603 1.6 ± 0.2 0.8 ± 0.15 0.8 ± 0.15 0.20 0.65 0.50 0805 2.0 ± 0.3 1.25 ± 0.2 0.25 0.75 0.70 0.25 0.85 1.50 0.25 1.00 1.20 W T 0.85 ± 0.15 1.25 ± 0.20 L2 L4 L1 L3 MBB211 0.85 ± 0.15 1206 3.2 ± 0.4 1.6 ± 0.2 1210 3.2 ± 0.5 2.5 ± 0.3 1.25 ± 0.20 1.60 ± 0.20 2.5 ± 0.3 www.yageo.com Dec. 28, 2020 V.2 4 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 15 16 V to 250 V CAPACITANCE RANGE & THICKNESS FOR X7R Table 2 Size 0805 0603 CAP. 0805 16 V 25 V 50 V 100 V 25 V 50 V 100 V 1.0 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 1.5 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 2.2 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 3.3 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 4.7 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 6.8 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 10 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 15 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 22 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 0.85± 0.15 33 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 1.25± 0.2 47 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.8± 0.15 0.85± 0.15 0.85± 0.15 1.25± 0.2 68 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 1.25± 0.2 1.25± 0.2 1.25± 0.2 100 nF 0.8± 0.15 0.8± 0.15 0.8± 0.15 1.25± 0.2 1.25± 0.2 1.25± 0.2 1 uF 1.25± 0.2 NOTE Values in shaded cells indicate thickness class in mm www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors CAPACITANCE RANGE & THICKNESS FOR X7R Table 3 Size 1206 1206 CAP. 16V 25V 50 V Soft termination X7R 16 V to 250 V 5 15 1210 100 V 200 V / 250 V 22 nF 1.25± 0.2 33 nF 1.25± 0.2 47 nF 1.25± 0.2 68 nF 1.25± 0.2 50V 100V 200 V 250 V 1.25± 0.2 1.25± 0.2 1.25± 0.2 100 nF 0.85± 0.15 0.85± 0.15 1.25± 0.2 150 nF 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 220 nF 1.25± 0.2 4.7 uF 1.6± 0.2 2.5± 0.3 NOTE Values in shaded cells indicate thickness class in mm www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 16 V to 250 V 6 15 THICKNESS CLASSES AND PACKING QUANTITY Table 5 SIZE CODE 0603 0805 1206 1210 Ø 180 MM / 7 INCH Paper Blister Ø 330 MM / 13 INCH Paper Blister 8 mm 4,000 --- 15,000 --- 0.85 ± 0.15 mm 8 mm 4,000 --- 15,000 --- 1.25 ± 0.2 mm 8 mm --- 3,000 --- 10,000 0.6 ± 0.1 mm 8 mm 4,000 --- 20,000 --- 0.85 ± 0.1 mm 8 mm 4,000 --- 15,000 --- 1.25 ± 0.2 mm 8 mm --- 3,000 --- 10,000 1.6 ± 0.2 mm 8 mm --- 2,000 --- 10,000 2.5 ± 0.3 mm 8 mm --- 1,000 --- --- THICKNESS CLASSIFICATION TAPE WIDTH QUANTITY PER REEL 0.8 ± 0.15 mm www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 7 15 16 V to 250 V ELECTRICAL CHARACTERISTICS NP0/X7R DIELECTRIC CAPACITORS; NI/SIN TERMINATIONS Unless otherwise specified, all test and measurements shall be made under standard atmospheric conditions for testing as given in 5.3 of IEC 60068-1: Temperature: 15 °C to 35 °C Relative humidity: 25% to 75% - Air pressure: 86 kPa to 106 kPa Before the measurements are made, the capacitor shall be stored at the measuring temperature for a time sufficient to allow the entire capacitor to reach this temperature. The period as prescribed for recovery at the end of a test is normally sufficient for this purpose. - Table 6 VALUE DESCRIPTION Capacitance range 1 nF to 4.7 uF Capacitance tolerance X7R ± 5% (1), ± 10%, ± 20% Dissipation factor (D.F.) X7R 0603 16V 1nF to 100nF 25V 1nF to 39nF 0805 1206 1210 220nF ≤ 3.5% 1nF to 100nF 100nF to 220nF ≤ 2.5% 47nF to 100nF ≤ 3.5% 1µF 50V 1nF to 39nF 1nF to 100nF ≤ 5% 100nF to 220nF ≤ 2.5% 47nF to 100nF ≤ 3.5% 4.7 uF 100V 1nF to 10nF 1nF to 100nF 100nF to 220nF ≤ 2.5% 12nF to 47nF 200V / 250V Insulation resistance after 1 minute at Ur (DC) ≤ 5% ≤ 5% 22nF to 100nF ≤ 2.5% IR ≥ 10 GΩ or I.R x C ≥ 500Ω.F whichever is less Maximum capacitance change as a function of temperature (temperature characteristic/coefficient): X7R Operating temperature range: X7R ± 15% –55 °C to +125 °C NOTE 1. Capacitance tolerance ±5% doesn't available for X7R full product range, please contact local sales force before order www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 8 15 16 V to 250 V SOLDERING RECOMMENDATION Table 7 SOLDERING METHOD SIZE 0402 0603 0805 1206 ≥ 1210 Reflow ≥ 0.1 µF ≥ 1.0 µF ≥ 2.2 µF ≥ 4.7 µF Reflow only Reflow/Wave < 0.1 µF < 1.0 µF < 2.2 µF < 4.7 µF --- SOLDERING CONDITIONS The lead free MLCCs are able to stand the reflow soldering conditions as below:    Temperature: above 220 °C Endurance: 95 to 120 seconds Cycles: 3 times The test of "soldering heat resistance" is carried out in accordance with the schedule of "MIL-STD-202G-method 210F", "The robust construction of chip capacitors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds". Therefore, it is possible to mount MLCCs on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Capacitors are tested for solderability at 245 °C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds. TESTS AND REQUIREMENTS Table 8 Test procedures and requirements TEST Mounting TEST METHOD PROCEDURE REQUIREMENTS IEC 60384- 4.3 The capacitors may be mounted on printed-circuit boards or ceramic substrates No visible damage 4.5.1 At 20°C, 24 hours after annealing f = 1 KHz, measuring at voltage 1 Vrms at 20°C Within specified tolerance 4.5.2 At 20 °C, 24 hours after annealing f = 1 KHz, measuring at voltage 1 Vrms at 20°C In accordance with specification 4.5.3 At Ur (DC) for 1 minute In accordance with specification 21/22 Capacitance IEC 6038421/22 Dissipation Factor (D.F.) IEC 60384- Insulation Resistance IEC 60384- 21/22 21/22 www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination 16 V to 250 V X7R TEST TEST METHOD PROCEDURE REQUIREMENTS High Temperature Exposure AEC-Q200 Unpowered ; 1000hours @ T=150°C No visual damage Measurement at 24± 2 hours after test conclusion. ΔC/C： 3 9 15 X7R: ± 10% D.F.: within initial specified value IR: within initial specified value Temperature Cycling AEC-Q200 4 Preconditioning; 150 +0/–10°C for 1 hour, then keep for 24 ± 1 hours at room temperature 1000 cycles with following detail: 30 minutes at lower category temperature 30 minutes at upper category temperature No visual damage ∆C/C X7R: ± 10% D.F. meet initial specified value IR meet initial specified value Recovery time 24 ± 2 hours Destructive Physical Analysis AEC-Q200 5 Note: Only applies to SMD ceramics. Electrical test not required. Moisture Resistance AEC-Q200 6 T=24 hrs/per cycle; 10 continuous cycles unpowered. Measurement at 24 ± 2 hours after test condition. No visual damage ∆C/C X7R: ± 10% D.F. Within initial specified value IR X7R: Meet initial specified value Fig. 4 Moisture resistant www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST Biased Humidity Soft termination TEST METHOD PROCEDURE REQUIREMENTS AEC-Q200 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp No visual damage after recovery 7 2. Initial measure: Parameter: IR Measuring voltage: 1.5V ± 0.1 VDC Note: Series with 100 KΩ 3. Test condition: 85 °C, 85% R.H. connected with 100 KΩ resistor, applied 1.5V/Ur for 1,000 hours. 4. Recovery: Class2: 24 ± 2 hours 5. Final measure: IR Operational Life AEC-Q200 8 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Spec: refer to initial spec C, D, IR 3. Endurance test: Temperature: X7R: 125 °C Specified stress voltage applied for 1,000 hours: Applied 2.0 x Ur for general products Applied 1.5 x Ur for high cap. Products High voltage series follows with below stress condition: 10 16 V to 250 V X7R 15 Initial requirement: - Connected to 100 KΩ: C ≤ 25 nF: I.R ≥ 4,000 MΩ or C > 25 nF: (I.R-100 KΩ) x C ≥ 100s. Final measurement: The insulation resistance shall be greater than 0.1 time initial value. No visual damage ∆C/C X7R: ± 15% D.F. X7R: ≤ 16V: ≤ 7% ≥ 25V: ≤ 5% IR X7R: ≥ 1,000 MΩ or IRx Cr ≥ 50s whichever is less Applied 1.5 x Ur for 200V, 250V series 4. Recovery time: 24 ± 2 hours 5. Final measure: C, D, IR Note: If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be preconditioned according to “IEC 60384 4.1” and then the requirement shall be met. External Visual AEC-Q200 9 Any applicable method using × 10 magnification In accordance with specification Physical Dimension AEC-Q200 10 Verify physical dimensions to the applicable device specification. In accordance with specification Mechanical Shock AEC-Q200 13 Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) ∆C/C X7R: ± 10% Peak value: 1,500 g’s Duration: 0.5 ms D.F. Velocity change: 15.4 ft/s Within initial specified value Waveform: Half-sin IR Within initial specified value www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST Vibration Soft termination X7R TEST METHOD PROCEDURE REQUIREMENTS AEC-Q200 5 g’s for 20 minutes, 12 cycles each of 3 orientations. ∆C/C X7R: ± 10% 14 Note: Resistance to Soldering Heat 16 V to 250 V AEC-Q200 15 11 15 Use 8” x 5” PCB. 0.31” thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2” from any secure point. Test from 10-2000 Hz. D.F: meet initial specified value Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ± 5 °C Dipping time: 10 ± 0.5 seconds Recovery time: 24 ± 2 hours IR meet initial specified value ∆C/C Class2: X7R: ± 10% D.F. within initial specified value IR within initial specified value Thermal Shock AEC-Q200 16 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: No visual damage ∆C/C X7R: ± 15% Spec: refer to initial spec C, D, IR 3. Rapid change of temperature test: -55 °C to +125 °C; 300 cycles 15 minutes at lower category temperature; 15 minutes at upper category temperature. D.F: meet initial specified value IR meet initial specified value 4. Recovery time: Class 2: 24 ± 2 hours 5. Final measure: C, D, IR www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST ESD Soft termination 16 V to 250 V X7R 12 15 TEST METHOD PROCEDURE REQUIREMENTS AEC-Q200 Per AEC-Q200-004 A component passes a voltage level if all components stressed at that voltage level pass. 17 YNM0053 6 kV DC FAIL PASS 2 kV DC FAIL 12 kV AD PASS 1 kV DC FAIL FAIL < 500 V DC 4 kV DC PASS 500 V DC FAIL FAIL 1 kV DC 2 kV DC PASS 8 kV DC PASS 4 kV DC FAIL 6 kV DC 16 kV AD PASS 8 kV DC FAIL 12 kV DC 25 kV AD PASS 500 V DC PASS FAIL Note: Classify the components according to the highest ESD voltage level survived during ESD testing. 16 kV AD PASS 25 kV AD Fig. 5 Passive component HBM ESD test flow diagram (DC = Direct Contact Discharge, AD = Air Discharge) Solderability AEC-Q200 18 1. Preheat at 155°C for 4 hours. After preheating, immerse the capacitor in a solution of ethanol and rosin (25% rosin in weight proportion). Immerse in eutectic solder solution for 5+0/-0.5 seconds at 235± 5°C. The solder should cover over 95% of the critical area of each termination. 2. Should be placed into steam aging for 8 hours± 15 minutes. After preheating, immerse the capacitor in a solution of ethanol and rosin (25% rosin in weight proportion). Immerse in eutectic solder solution for 5+0/-0.5 seconds at 235± 5°C. 3. Should be placed into steam aging for 8 hours± 15 minutes. After preheating, immerse the capacitor in a solution of Ethanol and rosin (25% rosin in weight proportion). Immerse in eutectic solder solution for 120± 5 seconds at 260± 5°C. Electrical Characterization AEC-Q200 19 Parametrically test per lot and sample size requirements, summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures. ∆C/C Class2: X7R: ± 15% X7R: -55 °C to +125 °C Normal temperature: 20 °C www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 15 TEST TEST METHOD PROCEDURE REQUIREMENTS Board Flex AEC-Q200 Part mounted on a 100 mm X 40 mm FR4 PCB board, which is 1.6 ± 0.2 mm thick and has a layer-thickness 35 µm ± 10 µm. Part should be mounted using the following soldering reflow profile. No visible damage 21 13 16 V to 250 V ∆C/C Class2: X7R: ± 10% Conditions: Class2: Bending 5 mm at a rate of 1 mm/s, radius jig 230 mm Test Substrate: b Dimension(mm) 4.5 C YNSC147 40 a 100 unit: mm Terminal Strength AEC-Q200 22 With the component mounted on a PCB obtained with the device to be tested, apply a 17.7N (1.8Kg) force to the side of a device being tested. This force shall be applied for 60+1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. * Apply 2N force for 0402 size. Beam Load Test AEC-Q200 23 Place the part in the beam load fixture. Apply a force until the part breaks or the minimum acceptable force level required in the user specification(s) is attained. Type a b c 0201 0.3 0.9 0.3 0402 0.4 1.5 0.5 0603 1.0 3.0 1.2 0805 1.2 4.0 1.65 1206 2.2 5.0 1.65 1210 2.2 5.0 2.0 1808 3.5 7.0 3.7 Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body, terminals and body/terminal junction. Before and after the test, the device shall comply with all electrical requirements stated in this specification. ≤ 0805 Thickness > 0.5 mm: 20N Thickness ≤ 0.5 mm: 8N ≥ 1206 Thickness ≥1.25 mm: 54N Thickness < 1.25 mm: 15N Voltage Proof IEC 60384-1 4.6 Specified stress voltage applied for 1~5 seconds Ur ≤ 100 V: series applied 2.5 Ur 100 V < Ur ≤ 200 V series applied (1.5 Ur + 100) 200 V < Ur ≤ 500 V series applied (1.3 Ur + 100) Charge/Discharge current is less than 50mA No breakdown or flashover www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 16 V to 250 V 14 15 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 2 Dec. 21, 2020 - - Add X7R product range, 0603, 1nF to 15nF, 16 to 100V Version 1 Dec. 04, 2018 - - Add 0603/ 22nF to 100nF Version 0 Oct. 05, 2017 - - New www.yageo.com Dec. 28, 2020 V.2 Product specification Surface-Mount Ceramic Multilayer Capacitors Soft termination X7R 16 V to 250 V 15 15 LEGAL DISCLAIMER Yageo, its distributors and agents (collectively, “Yageo”), hereby disclaims any and all liabilities for any errors, inaccuracies or incompleteness contained in any product related information, including but not limited to product specifications, datasheets, pictures and/or graphics. 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