ANT1608LL14R2400A

DATA SHEET WIRELESS COMPONENTS Ceramic Chip Antenna ANT1608LL14R2400A 2.4 - 2.5GHZ Product Specification – February 14, 2017 V.1 1608 Series Product specification WIRELESS COMPONENTS FEATURES  Compact size  Omni-directional Radiation  Tape & reel automaic mounting  Reflow process compatible  RoHS compliant APPLICATIONS  2.4GHz WiFi device  Bluetooth gadget  Zigbee device  ISM band equipment Ceramic Chip Antenna 2 10 ORDERING INFORMATION All part numbers are identified by the series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 1608 L L14 R 2400A (1) (2) (3) (4) (5) (6) (1) PRODUCT ANT = Antenna (2) SIZE 1608 = 1.6 × 0.8 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L14 (5) PACKING STYLE R = Tape and Reel (6) WORKING FREQUENCY 2400 = 2.4GHz www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS Ceramic Chip Antenna 3 10 SPECIFICATION Table 1 VALUE DESCRIPTION Working Frequency 2.4 ~ 2.484 GHz Bandwidth 150 MHz(Typ.) VSWR 6.0 dB Max Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 2.0 dBi(Typ.) Impedance 50 Ω Operating Temperature - 40~105 ℃ Maximum Power 1W Termination Ag (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 5sec. NOTE 1. The specification is defined on Yageo evaluation board DIMENSIONS Table 2 Mechanical Dimension L (mm) W (mm) T (mm) A1 (mm) A2 (mm) B1 (mm) B2 (mm) C1 (mm) C2 (mm) G1 (mm) G2 (mm) DIMENSION 1.6 ±0.15 0.8 ±0.15 0.4(max) 0.70 ±0.15 0.25 ±0.15 0.30 ±0.15 0.25 ±0.15 0.70 ±0.15 0.25 ±0.15 0.20 ±0.05 0.10 ±0.05 OUTLINES Table 3 Termination configuration TERMINAL NAME FUNCTION A1, A2 Soldering Pad C1, C2 Feeding Pad Fig. 1 Antenna outlines www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS 4 10 Ceramic Chip Antenna REFERENCE DESIGN OF EVALUATION BOARD ◇SCENARIO 1 20mm 50mm Fig. 2 Outlook and dimension of evaluation board (Scenario 1) 0.15 0.15 0.8 0.8 0.35 0.66 0.35 Unit:mm Footprint for radiator electrode Footprint for feeding Antenna Outline Fig. 3 Footprint www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS Ceramic Chip Antenna 5 10 Fig. 4 Details of soldering Pad of Scenario 1 www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS 6 10 Ceramic Chip Antenna ELECTRICAL PERFORMANCES ◇SCENARIO 1 Fig. 5 Return loss of Scenario 1 Evaluation board and XYZ direction Max Gain = 2.03dBi Efficiency = -2.08dB, 61.88% Fig. 6 Radiation pattern of Scenario 1 www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS 7 10 Ceramic Chip Antenna REFERENCE DESIGN OF EVALUATION BOARD ◇SCENARIO 2 50mm 10mm Fig. 7 Outlook and dimension of evaluation board (Scenario 2) www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS Ceramic Chip Antenna 8 10 Clearance size : 6 * 2.5 mm Antenna placement Frequency Tuning Matching Tuning 50 ohm Line Top layer Bottom layer Fig. 8 Details of soldering Pad of Scenario 2 www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS 9 10 Ceramic Chip Antenna ELECTRICAL PERFORMANCES ◇SCENARIO 2 Fig. 9 Return loss of Scenario 2 Evaluation board and XYZ direction Max Gain = 3.38dBi Efficiency = -2.17dB, 60.64% Fig. 10 Radiation pattern of Scenario 2 www.yageo.com Feb. 14, 2017 V1 Product specification WIRELESS COMPONENTS 10 10 Ceramic Chip Antenna REVISION HISTORY REVISION DATE CHANGE NOTIFICATION Version 1 Feb. 14, 2017 - Version 0 Oct. 03, 2016 - DESCRIPTION - Add EV Board Scenario 2 layout and performance data. - New data sheet for SMD type antenna, 2.45GHz application, 1608 series PIFA mode www.yageo.com Feb. 14, 2017 V1