HF300P-0.0015-00-4/4

Hi-Flow 300P ® Electrically Insulating,Thermally Conductive Phase Change Material Features and Benefits • Thermal impedance: 0.13°C-in2/W (@25 psi) • Field-proven polyimide film - excellent dielectric performance - excellent cut-through resistance • Outstanding thermal performance in an insulated pad TYPICAL PROPERTIES OF HI-FLOW 300P PROPERTY Color IMPERIAL VALUE Green METRIC VALUE Green TEST METHOD Visual Reinforcement Carrier Polyimide Polyimide — Thickness (inch) / (mm) 0.004 - 0.005 0.102 - 0.127 ASTM D374 Film Thickness (inch) / (mm) 0.001 - 0.002 0.025 - 0.050 ASTM D374 40 40 ASTM D882A ASTM D882A Elongation (%45° to Warp and Fill) Tensile Strength (psi) / (MPa) 7000 48 Continuous Use Temp (°F) / (°C) 302 150 — Phase Change Temp (°F) / (°C) 131 55 ASTM D3418 ELECTRICAL Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149 Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150 Volume Resistivity (Ohm-meter) 1012 1012 ASTM D257 Flame Rating V-O V-O U.L. 94 1.6 1.6 ASTM D5470 THERMAL Thermal Conductivity (W/m-K) (1) THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 100 200 0.92 0.91 0.90 TO-220 Thermal Performance (°C/W) 0.0015" 1.19 1.17 1.16 1.14 1.12 TO-220 Thermal Performance (°C/W) 0.0020" 1.38 1.37 1.35 1.33 1.32 Thermal Impedance (°C-in2/W) 0.0010" (2) 0.13 0.13 0.12 0.12 0.12 Thermal Impedance (°C-in2/W) 0.0015" (2) 0.17 0.16 0.16 0.16 0.15 Thermal Impedance (°C-in /W) 0.0020" (2) 0.19 0.19 0.19 0.18 0.18 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: • Spring / clip mounted • Discrete power semiconductors and modules Configurations Available: • Roll form, die-cut parts and sheet form, with or without pressure sensitive adhesive Building a Part Number 0.001 – 00 – 00 – Standard Options ACME10256 Rev a Section E – Section D HF300P Section C Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application. 50 0.94 Section B Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition. The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. 25 0.95 2 Section A Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems. 10 TO-220 Thermal Performance (°C/W) 0.0010" NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. _ _ _ = Standard configuration dash number, 1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or 00 = custom configuration AC = Adhesive, one side 00 = No adhesive Standard polyimide thicknesses available: 0.001", 0.0015", 0.002" HF300P = Hi-Flow 300P Phase Change Material Note: To build a part number, visit our website at www.bergquistcompany.com. We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. Hi- Flow®: U.S. Patent 6,197,859 and others www.bergquistcompany.com The Bergquist Company North American Headquarters 18930 West 78th Street Chanhassen, MN 55317 Phone: 800-347-4572 Fax: 952-835-0430 The Bergquist Company European Headquarters Bramenberg 9a, 3755 BT Eemnes Netherlands Phone: 31-35-5380684 Fax: 31-35-5380295 The Bergquist Company - Asia Room 15, 8/F Wah Wai Industrial Centre No. 38-40, Au Pui Wan Street Fotan, Shatin, N.T. Hong Kong Ph: 852.2690.9296 Fax: 852.2690.2344 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer. PDS_HF_300P_12.08