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Table of Contents
Introduction
Thermal Properties and Testing
Interface Material Selection Guide
Gap Pad Thermally Conductive Materials
Gap Pad Comparison Data
Frequently Asked Questions
Gap Pad VO
Gap Pad VO Soft
Gap Pad VO Ultra Soft
Gap Pad 1000SF
Gap Pad HC1000
Gap Pad 1500
Gap Pad 1500R
Gap Pad A2000
Gap Pad 2000S40
Gap Pad 2500S20
Gap Pad 2500
Gap Pad A3000
Gap Pad 3000S30
Gap Pad 5000S35
Gap Filler 1000 (Two-Part)
Gap Filler 1100SF (Two-Part)
Gap Filler Gel 1500 (One-Part)
Gap Filler 2000 (Two-Part)
Gap Filler 3500S35 (Two-Part)
TIC Thermal Interface Compound
Comparison Data and Frequently Asked Questions
TIC 1000G
TIC 1000A
TIC 4000
Hi-Flow Phase Change Interface Materials
Hi-Flow Comparison Data
Frequently Asked Questions
Hi-Flow 105
Hi-Flow 115-AC
Hi-Flow 225F-AC
Hi-Flow 225FT
Hi-Flow 225UF
Hi-Flow 225UT
Hi-Flow 225U
Hi-Flow 625
Hi-Flow 300P
Hi-Flow 300G
®
®
®
™
®
2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
®
Sil-Pad Thermally Conductive Insulators
Sil-Pad Comparison Data
Frequently Asked Questions
Choosing Sil-Pad Thermally Conductive Insulators
Mechanical, Electrical and Thermal Properties
Sil-Pad Applications
Sil-Pad Selection Table
Sil-Pad 400
Sil-Pad 800
Sil-Pad 900S
Sil-Pad 980
Sil-Pad 1100ST
Sil-Pad A1500
Sil-Pad 1500ST
Sil-Pad 1750
Sil-Pad 2000
Sil-Pad A2000
Sil-Pad K-4
Sil-Pad K-6
Sil-Pad K-10
Q-Pad II
Q-Pad 3
Poly-Pad 400
Poly-Pad 1000
Poly-Pad K-4
Poly-Pad K-10
Sil-Pad Tubes
Sil-Pad Shield
Bond-Ply and Liqui-Bond Adhesives
Bond-Ply and Liqui-Bond Comparison Data
Frequently Asked Questions
Bond-Ply 100
Bond-Ply 400
Bond-Ply 660B
Liqui-Bond SA 1000 (One-Part)
Liqui-Bond SA 2000 (One-Part)
Solutions for Surface Mount Applications
Ordering Information
Sil-Pad Configurations - Imperial
Hi-Flow Configurations - Imperial
Sil-Pad Configurations - Metric
Hi-Flow Configurations - Metric
Sil-Pad Shield Configurations - Imperial
®
®
®
®
45
46
47
48
50
52
52
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
76
77
78
79
80
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83
85
87
90
91
94
95
1
INTRODUCTION
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World Leader in
Thermal Management Through
Technology, Innovation and Service
At Bergquist, developing high quality
components for the electronics
industry is our first priority. As a
world-leading manufacturer with
state-of-the-art facilities, we serve a
multitude of industries worldwide
including automotive, computer,
consumer electronics, military,
motor control, power conversion,
telecommunications and more.
Bergquist Takes
the Heat
Thermal Management Products
Worldwide Locations
We make it our business to know
your business. We understand your
problems. We also know that there
will always be a better way to help
you reach your goals and objectives.
To that end, our company continually
invests considerable time and money
into research and development. The
Bergquist Company is focused on a
single purpose – discovering the
need, then developing and delivering
technologically advanced solutions
backed by superior service.
Bergquist's Thermal Products Group is a worldleading developer and manufacturer of thermal
management materials which provide product
solutions to control and manage heat in
electronic assemblies and printed circuit
boards. Used by many of the world’s largest
OEMs in various industries including automotive, computer, power supply, military and
motor control, these materials include:
In the United States, the Thermal Products
Group’s 90,000 square-foot manufacturing
facility is located in Cannon Falls, Minnesota.
A 40,000 square-foot facility in Prescott,
Wisconsin houses the Thermal Clad printed
circuit board operations. A130,000 squarefoot facility in Chanhassen, Minnesota is the
location for Bergquist’s corporate headquarters
and state-of-the-art research and development
facilities.Worldwide, Bergquist has facilities in
The Netherlands, Germany, the United
Kingdom,Taiwan, South Korea, Hong Kong
and China with sales representatives in 30
countries to support worldwide growth.
2
Sil-Pad ® – Thermally Conductive Insulators
Bond-Ply ® and Liqui-Bond ® – Thermally
Conductive Adhesives
Gap Pad ® – Thermally Conductive
Gap Filling Materials
Hi-Flow ® – Phase Change Interface Materials
TIC™ – Thermal Interface Compounds
Thermal Clad® – Insulated Metal Substrates
World Class Operations
Around the Globe
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INTRODUCTION
A Legacy of IndustryLeading Technology
Page 3
Research and Development
at the Speed of Change
GAP PAD
Keeping pace in today’s aggressive electronics
industry demands continual anticipation of
change and the ability to develop customerdriven solutions quickly and efficiently. Our
Chanhassen headquarters features a
state-of-the-art development laboratory and
engineering department staffed with highly
skilled chemical engineers, laboratory
technicians and manufacturing engineers –
all dedicated to researching, developing and
testing new materials. From such dedication
have come many industry-standard proprietary
products including Thermal Clad, Sil-Pad,
Gap Pad, Bond-Ply and Hi-Flow materials.
SIL-PAD
For over 40 years, outstanding quality,
innovation and engineering have been hallmarks of The Bergquist Company.Today,
developing innovative products for the
electronics industry remains our first priority.
Bergquist has developed over 260 materials
which provide thermal solutions for a wide
variety of electronic applications. Many of our
products were originally developed to satisfy
a customer request for a specific material
designed to perform to their particular
specifications.This “can do” attitude and
customized technology has earned The
Bergquist Company its ISO 9001:2000
certification.
HI--FLOW
R&D Facilities
TIC
New Product Innovation
BOND-PLY
ORDERING
3
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INTRODUCTION
Thermal Properties and Testing
Thermal Conductivity
Thermal Resistance
The time rate of heat flow through a unit area producing a unit
temperature difference across a unit thickness.
The opposition to the flow of heat through a unit area of material
across an undefined thickness.
Thermal conductivity is an inherent or absolute property of the material.
Thermal resistance varies with thickness.
Thermal Impedance
Test Methods – ASTM D5470
A property of a particular assembly measured by the ratio of the
temperature difference between two surfaces to the steady-state heat
flow through them.
Factors affecting thermal impedance include:
Area: Increasing the area of thermal contact decreases
thermal impedance.
Thickness: Increasing the insulator thickness increases
thermal impedance.
Pressure: Increasing mounting pressure under ideal conditions
decreases thermal impedance.
Time: Thermal impedance decreases over time.
Measurement: Thermal impedance is affected by the method of
temperature measurement.
2 in. diameter stack (ref. 3.14 in2) – 10-500 psi, 1 hour per layer
Thermal Impedance Per Bergquist TO-220 Thermal
Performance (25 C Cold Plate Testing)
o
i
4
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Interface Material Selection Guide
INTRODUCTION
Sil-Pad A1500
T = Typical; AS = Application-Specific (contact Bergquist Sales); A = Available; * = Roll stock configurations are limited — contact your Bergquist Sales Representative for more
information. Note: For Hi-Flow 225UT, Hi-Flow 225FT, and Hi-Flow 225F-AC, the adhesive is not a pressure sensitive adhesive (PSA).
5
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Gap Pad Thermally Conductive Materials
®
Solution-Driven Thermal Management Products for Electronic Devices
A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity
The extensive Gap Pad family provides an effective thermal interface
between heat sinks and electronic devices where uneven surface
topography, air gaps and rough surface textures are present. Bergquist
application specialists work closely with customers to specify the proper
Gap Pad material for each unique thermal management requirement.
Features
Benefits
Options
Applications
Each of the many products within
the Gap Pad family is unique in
its construction, properties and
performance. Following is an
overview of the important
features offered by the
Gap Pad family.
Gap Pad thermal products are
designed to improve an assembly’s
thermal performance and reliability
while saving time and money.
Specifically:
Some Gap Pad products have
special features for particular
applications, including:
Gap Pad products are well suited
to a wide variety of electronics,
automotive, medical, aerospace
and military applications such as:
GAP PAD
The Bergquist Company, a world leader in thermal interface materials,
developed the Gap Pad family to meet the electronic industry’s
growing need for interface materials with greater conformability,
higher thermal performance and easier application.
• Low-modulus polymer material
• Available with fiberglass/rubber
carriers or in a non-reinforced
version
• Special fillers to achieve specific
thermal and conformability
characteristics
• Highly conformable to uneven
and rough surfaces
• Electrically isolating
• Natural tack on one or both
sides with protective liner
• Variety of thicknesses and
hardnesses
• Range of thermal conductivities
• Available in sheets and
die-cut parts
6
• Eliminates air gaps to reduce
thermal resistance
• High conformability reduces
interfacial resistance
• Low-stress vibration dampening
• Shock absorbing
• Easy material handling
• Simplified application
• Puncture, shear and tear
resistance
• Improved performance for
high-heat assemblies
• Compatible with automated
dispensing equipment
• Available with or without
adhesive
• Rubber-coated fiberglass
reinforcement
• Thicknesses from 0.010"
to 0.250"
• Available in custom die-cut
parts, sheets and rolls
(converted or unconverted)
• Custom thicknesses and
constructions
• Adhesive or natural
inherent tack
• Silicone-free Gap Pad available
in thicknesses of 0.010" - 0.125"
• Gap Fillers are well suited for
automated dispensing
We produce thousands of specials.
Tooling charges vary depending
on tolerance and complexity of
the part.
• Between an IC and a heat sink
or chassis.Typical packages
include BGA’s, QFP, SMT power
components and magnetics
• Between a semiconductor and
heat sink
• CD-ROM/DVD cooling
• Heat pipe assemblies
• RDRAM memory modules
• DDR SDRAM
• Hard drive cooling
• Power supply
• Signal amplifiers
• Between other heat-generating
devices and chassis
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Gap Pad Comparison Data
®
Conductivity, Hardness and General Overview
GAP PAD
7
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Frequently Asked Questions
Q: What thermal conductivity test method was used to
A:
achieve the values given on the data sheets?
A test fixture is utilized that meets the specifications outlined in
ASTM D5470.
Q: What are the upper processing temperature limits
A:
Q: Is Gap Pad offered with an adhesive?
A: Currently, Gap Pad VO, Gap Pad VO Soft, and Gap Pad VO Ultra
GAP PAD
Soft are offered with or without an adhesive on the Sil-Pad
800/900 carrier-side of the material.The remaining surface has
natural inherent tack. All other Gap Pads have inherent tack.
Q: Is Gap Pad electrically isolating?
A: Yes, all Gap Pad materials are electrically isolating. However,
keep in mind that Gap Pad is designed to FILL gaps and is not
recommended for applications where high mounting pressure is
exerted on the Gap Pad.
Q: Is the adhesive repositionable?
A: Depending on the surface being applied to, if care is taken, the
pad may be repositioned. Special care should be taken when
removing the pad from aluminum or anodized surfaces to avoid
tearing or delamination.
Q: What is meant by “natural tack”?
A: The characteristic of the rubber itself has a natural inherent tack,
without the addition of an adhesive. As with adhesive-backed
products, the surfaces with natural tack may help in the assembly
process to temporarily hold the pad in place while the application
is being assembled. Unlike adhesive-backed products, inherent tack
does not have a thermal penalty since the rubber itself has the
tack.Tack strength varies from one Gap Pad product to the next.
Q: Can Gap Pad with natural tack be repositioned?
A: Again, depending on the material that the pad is applied to, in
most cases they are repositionable. Care should be taken when
removing the pad from aluminum or anodized surfaces as to
avoid tearing or delaminating the pad.The side with natural tack
is always easier to reposition than an adhesive side.
Q: Is Gap Pad reworkable?
A: Depending on the application and the pad being used, Gap Pad
has been reworked in the past. Bergquist has customers that are
currently using the same pad for reassembling their applications
after burn-in processes and after fieldwork repairs. However, this
is left up to the design engineer’s judgment as to whether or not
the Gap Pad will withstand reuse.
Q: Is liquid Gap Filler reworkable?
A: It is highly dependent on the application and its surface topography.
Liquid Gap Filler will cure with low adhesive strength to the
application surfaces.
Q: Will heat make the material softer?
A: From -60°C to 200°C, there is no significant variance in hardness
for silicone Gap Pads and Gap Fillers.
Q: What is the shelf life of Gap Pad?
A: Shelf life for Gap Pad is one (1) year after date of manufacture.
For Gap Pad with adhesive, the shelf life is six (6) months after
the date of manufacture. After these dates, inherent tack and
adhesive properties should be recharacterized.
Q: How is extraction testing performed?
A: The test method used is the Bellcore Extraction method
#TR-NWT-000930; refer to Bergquist Application Note #56.
8
for Gap Pad and for how long can Gap Pad be exposed
to them?
Gap Pad VO materials and Gap Pad A3000 are more stable at
elevated temperatures. Gap Pad in general can be exposed to
temporary processing temperatures of 250°C for five minutes
and 300°C for one minute.
Q: How much force will the pad place on my device?
A: Refer to the Pressure vs. Deflection charts in Bergquist
Application Note #116.
Q: Will Gap Pad and Gap Filler work in my application?
A:
What size gaps will Gap Pad and Gap Filler
accommodate?
Gap Pad and Gap Filler can be used wherever air can be
replaced, such as between a heat-generating device and a heat
sink, heat spreader or housing.This can be done using one sheet
of Gap Pad or individual pieces of appropriate thicknesses, or by
using Gap Filler if stack-up tolerances and height variations
are significant.
Q: What is meant by “compliance” and “conformability,”
and why is this important?
A: The better a Gap Pad complies and conforms to a rough or
stepped surface, the less interfacial resistance will be present due
to air voids and air gaps.This leads to a lower overall thermal
resistance of the pad between the two interfaces.
Q: Is anything given off by the material
(e.g. extractables, outgassing)?
A: 1) Silicone Gap Pad and Gap Fillers, like all soft silicone materials,
can extract silicone fluid (refer to Bergquist Application Note
#56). Also note that Gap Pad and Gap Filler have some of the
lowest extraction values for silicone-based gap filling products on
the market and if your application requires no silicone, see our
line of Sil-Free material.
2) Primarily for aerospace applications, outgassing data is detailed
in Bergquist Application Note #117, tested per ASTM E595.
Q: Why does the data sheet describe the hardness rating
as a bulk rubber hardness?
A: A reinforcement carrier is generally utilized in Bergquist Gap Pads
for ease of handling.When testing hardness, the reinforcement
carrier can alter the test results and incorrectly depict thinner
materials as being harder.To eliminate this error, a 250 mil rubber
puck is molded with no reinforcement carrier.The puck is then
tested for hardness.The Shore hardness is recorded after a 30
second delay.
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Gap Pad VO
®
Conformable,Thermally Conductive Material for Filling Air Gaps
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD VO
• Thermal conductivity: 0.8 W/m-K
• Enhanced puncture, shear and tear resistance
• Conformable gap filling material
• Electrically isolating
PROPERTY
Color
IMPERIAL VALUE
Gold/Pink
Sil-Pad
Sil-Pad
—
Thickness (inch) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
Inherent Surface Tack (1- or 2-sided)
1
1
—
Density (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
100
689
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
250
200
>6000
ASTM D149
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.8
0.8
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
• Between heat-generating magnetic components and a heat sink
150
Configurations Available:
100
• Sheet form and die-cut parts
50
Building a Part Number
GPVO
–
0.040
– AC – 0816 –
Standard Options
NA
Section E
13
Section D
3
5
7
9
11
Thermal Resistance (C-in2/W)
Section C
1
Section B
0
Section A
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad VO
>6000
Dielectric Constant (1000 Hz)
GAP PAD
Note: Resultant thickness is defined as the final gap
thickness of the application.
TEST METHOD
Visual
Reinforcement Carrier
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Gap Pad VO is a cost-effective, thermally
conductive interface material.The material is a
filled, thermally conductive polymer supplied
on a rubber-coated fiberglass carrier allowing
for easy material handling.The conformable
nature of Gap Pad VO allows the pad to fill in
air gaps between PC boards and heat sinks
or a metal chassis.
METRIC VALUE
Gold/Pink
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16" or
00 = custom configuration
AC = Adhesive, one side
00 = No pressure sensitive adhesive
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
GPVO = Gap Pad VO Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
9
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Gap Pad VO Soft
®
Highly Conformable,Thermally Conductive Material for Filling Air Gaps
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD VO SOFT
GAP PAD
• Thermal conductivity: 0.8 W/m-K
• Conformable, low hardness
• Enhanced puncture, shear and tear resistance
• Electrically isolating
PROPERTY
Color
IMPERIAL VALUE
Mauve/Pink
Note: Resultant thickness is defined as the final gap
thickness of the application.
Sil-Pad
Sil-Pad
—
Thickness (inch) / (mm)
0.020 to 0.200
0.508 to 5.080
ASTM D374
Inherent Surface Tack (1- or 2-sided)
1
1
—
Density (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
25
25
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
40
275
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
200
180
160
140
120
100
80
60
40
20
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.8
0.8
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number
00
–
Standard Options
ACME10256 Rev. a
Section E
10
– AC –
Section D
3 4 5 6 7 8 9
Thermal Resistance (C-in2/W)
0.060
Section C
2
–
Section B
1
GPVOS
Section A
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad VO Soft
TEST METHOD
Visual
Reinforcement Carrier
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Gap Pad VO Soft is recommended for
applications that require a minimum amount
of pressure on components. Gap Pad VO
Soft is a highly conformable, low-modulus,
filled-silicone polymer on a rubber-coated
fiberglass carrier.The material can be used
as an interface where one side is in contact
with a leaded device.
METRIC VALUE
Mauve/Pink
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
AC = Pressure sensitive adhesive, one side
00 = No pressure sensitive adhesive
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200"
GPVOS = Gap Pad VO Soft Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
10
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Gap Pad VO Ultra Soft
®
Ultra Conformable,Thermally Conductive Material for Filling Air Gaps
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT
PROPERTY
Color
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Designed for low-stress applications
• Puncture, shear and tear resistant
IMPERIAL VALUE
Mauve/Pink
Sil-Pad
Sil-Pad
—
Thickness (inch) / (mm)
0.020 to 0.250
0.508 to 6.350
ASTM D374
1
1
—
Density (g/cc)
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
5
5
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
8
55
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
>6000
ASTM D149
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
Thickness vs. Thermal Resistance
Gap Pad VO Ultra Soft
• Sheet form and die-cut parts
250
Building a Part Number
0
1
2
3 4 5 6 7 8 9
Thermal Resistance (C-in2/W)
10
Standard Options
NA
Section E
50
0.100
– AC – 0816 –
Section D
GPVOUS
100
–
Section C
150
Section B
200
Section A
Resultant Thickness (mils)
>6000
Dielectric Constant (1000 Hz)
GAP PAD
Hardness, Bulk Rubber (Shore 00) (1)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Note: Resultant thickness is defined as the final gap
thickness of the application.
TEST METHOD
Visual
Reinforcement Carrier
Inherent Surface Tack (1- or 2-sided)
Gap Pad VO Ultra Soft is recommended for
applications that require a minimum amount
of pressure on components.The viscoelastic
nature of the material also gives excellent
low-stress vibration dampening and shock
absorbing characteristics. Gap Pad VO Ultra
Soft is an electrically isolating material, which
allows its use in applications requiring
isolation between heat sinks and high-voltage,
bare-leaded devices.
METRIC VALUE
Mauve/Pink
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200", 0.250"
GPVOUS = Gap Pad VO Ultra Soft Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
11
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Gap Pad 1000SF
®
Thermally Conductive, Silicone-Free Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD 1000SF
PROPERTY
Color
• Thermal conductivity: 0.9 W/m-K
• No silicone outgassing
• No silicone extraction
• Reduced tack on one side to aid in
application assembly
IMPERIAL VALUE
Green
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
GAP PAD
Inherent Surface Tack (1- or 2-sided)
2
2
—
Density (g/cc)
2.0
2.0
ASTM D792
Heat Capacity (J/g-K)
1.1
1.1
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
34
234
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 257
-60 to 125
—
>6000
ASTM D149
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-1
V-1
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
Typical Applications Include:
• Digital disk drives / CD-ROM
• Automotive modules
• Fiber optics modules
Configurations Available:
• Sheet form
• Die-cut parts
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad 1000SF
Building a Part Number
50
25
– 02
– 0816 –
0
Standard Options
NA
Section E
75
0.010
Section D
100
–
Section C
GP1000SF
Section B
125
Section A
Resultant Thickness (mils)
>6000
Dielectric Constant (1000 Hz)
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
The new Gap Pad 1000SF is a thermally
conductive, electrically insulating, siliconefree polymer specially designed for
silicone-sensitive applications.The material
is ideal for applications with high standoff
and flatness tolerances. Gap Pad 1000SF is
reinforced for easy material handling and
added durability during assembly.The
material is available with a protective liner
on both sides of the material.
1
2
3
4
Thermal Resistance (C-in2/W)
TEST METHOD
Visual
Reinforcement Carrier
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
0
METRIC VALUE
Green
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0806: = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
5
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
GP1000SF = Gap Pad 1000SF Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
12
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Page 13
Gap Pad HC1000
®
“Gel-Like” Modulus Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD HC1000
PROPERTY
Color
• Thermal conductivity: 1.0 W/m-K
• Highly conformable, low hardness
• “Gel-like” modulus
• Fiberglass reinforced for puncture,
shear and tear resistance
IMPERIAL VALUE
Gray
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.020
0.254 to 0.508
ASTM D374
2
—
1.6
1.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
25
25
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
40
275
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
20
18
16
>5000
ASTM D149
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2 and 0.020 inches thick. For more
information on Gap Pad modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Computer and peripherals
• Telecommunications
• Heat interfaces to frames, chassis, or other heat spreading devices
• RDRAM™ memory modules / chip scale packages
• CDROM / DVD cooling
• Areas where irregular surfaces need to make a thermal interface to a heat sink
• DDR SDRAM memory modules
• FBDIMM modules
14
Configurations Available:
12
• Sheet form, die-cut parts, and roll form (converted or unconverted)
Building a Part Number
–
0.015
– 02
– 0816 –
Standard Options
NA
Section E
HC1000
Section D
0.55
Section C
0.30 0.35 0.40 0.45 0.50
Thermal Resistance (C-in2/W)
Section B
10
0.25
Section A
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad HC100
>5000
Dielectric Constant (1000 Hz)
GAP PAD
2
Density (g/cc)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Note: Resultant thickness is defined as the final gap
thickness of the application.
TEST METHOD
Visual
Reinforcement Carrier
Inherent Surface Tack (1- or 2-sided)
Gap Pad HC 1000 is an extremely conformable,
low-modulus polymer that acts as a thermal
interface and electrical insulator between
electronic components and heat sinks.The
“gel-like” modulus allows this material to fill
air gaps to enhance the thermal performance
of electronic systems. Gap Pad HC1000 is
offered with removable protective liners on
both sides of the material.
METRIC VALUE
Gray
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020"
HC1000 = High Compliance 1000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
13
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10/20/2006
10:19 AM
Page 14
Gap Pad 1500
®
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD 1500
PROPERTY
Color
• Thermal conductivity: 1.5 W/m-K
• Unreinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating
IMPERIAL VALUE
Black
—
—
—
Thickness (inch) / (mm)
0.020 to 0.200
0.508 to 5.080
ASTM D374
GAP PAD
2
2
—
Density (g/cc)
2.1
2.1
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
45
310
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Note: Resultant thickness is defined as the final gap
thickness of the application.
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.5
1.5
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
Configurations Available:
150
• Sheet form and die-cut parts
100
Building a Part Number
6
GP1500
–
0.100
– 02
– 0816 –
Standard Options
NA
Section E
1
2
3
4
5
Thermal Resistance (C-in2/W)
Section D
0
Section C
0
Section B
50
Section A
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad 1500
200
TEST METHOD
Visual
Reinforcement Carrier
Inherent Surface Tack (1- or 2-sided)
Gap Pad 1500 has an ideal filler blend that
gives it a low-modulus characteristic that
maintains optimal thermal performance yet
still allows for easy handling.The natural tack
on both sides of the material allows for
good compliance to adjacent surfaces of
components, minimizing interfacial resistance.
METRIC VALUE
Black
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200"
GP1500 = Gap Pad 1500 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
14
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Page 15
Gap Pad 1500R
®
Thermally Conductive, Reinforced Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD 1500R
PROPERTY
Color
• Thermal conductivity: 1.5 W/m-K
• Fiberglass reinforced for puncture, shear
and tear resistance
• Easy release construction
• Electrically isolating
IMPERIAL VALUE
Black
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.020
0.254 to 0.508
ASTM D374
2
—
2.1
2.1
ASTM D792
Heat Capacity (J/g-K)
1.3
1.3
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
40
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
45
310
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ASTM D149
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.5
1.5
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
• Sheet form, die-cut parts, and roll form (converted or unconverted)
20
18
Building a Part Number
0.55
0.020
– 02
–
00
–
Standard Options
ACME10256 Rev. A
Section E
0.30 0.35 0.40 0.45 0.50
Thermal Resistance (C-in2/W)
–
Section D
GP1500R
12
Section C
14
Section B
16
Section A
Resultant Thickness (mils)
>6000
6.0
Configurations Available:
Thickness vs. Thermal Resistance
Gap Pad 1500R
10
0.25
>6000
Dielectric Constant (1000 Hz)
GAP PAD
2
Density (g/cc)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Note: Resultant thickness is defined as the final gap
thickness of the application.
TEST METHOD
Visual
Reinforcement Carrier
Inherent Surface Tack (1- or 2-sided)
Gap Pad 1500R has the same highly
conformable, low-modulus polymer as the
standard Gap Pad 1500.The fiberglass
reinforcement allows for easy material handling
and enhances puncture, shear and tear
resistance.The natural tack on both sides of
the material allows for good compliance to
mating surfaces of components, further
reducing thermal resistance.
METRIC VALUE
Black
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020"
GP1500R = Gap Pad 1500R Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
15
SEL_SP_0906_Chpt1.qxp
10/20/2006
10:19 AM
Page 16
Gap Pad A2000
®
High Performance,Thermally Conductive Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD A2000
PROPERTY
Color
• Thermal conductivity: 2.0 W/m-K
• Fiberglass reinforced for puncture, shear
and tear resistance
• Electrically isolating
IMPERIAL VALUE
Gray
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.040
0.254 to 1.016
ASTM D374
GAP PAD
2
2
—
Density (g/cc)
2.9
2.9
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
80
80
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
55
379
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Note: Resultant thickness is defined as the final gap
thickness of the application.
>4000
ASTM D149
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Computer and peripherals; between CPU and heat spreader
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• CDROM / DVD cooling
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
• DDR SDRAM memory modules
Configurations Available:
• Sheet form, die-cut parts and roll form (converted or unconverted)
Building a Part Number Standard Options
–
0.010
– 02
– 0816 –
NA
Section E
GPA2000
Section D
0.80
Section C
0.30 0.40 0.50 0.60 0.70
Thermal Resistance (C-in2/W)
Section B
40
35
30
25
20
15
10
0.20
>4000
Dielectric Constant (1000 Hz)
Section A
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad A2000
TEST METHOD
Visual
Reinforcement Carrier
Inherent Surface Tack (1- or 2-sided)
Gap Pad A2000 acts as a thermal interface
and electrical insulator between electronic
components and heat sinks. In the thickness
range of 10 to 40 mil, Gap Pad A2000 is
supplied with natural tack on both sides,
allowing for excellent compliance to the
adjacent surfaces of components.The 40 mil
material thickness is supplied with lower tack
on one side, allowing for burn-in processes
and easy rework.
METRIC VALUE
Gray
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020"
0.040"
GPA2000 = Gap Pad A2000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
16
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Page 17
Gap Pad 2000S40
®
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP PAD 2000S40
PROPERTY
Color
• Thermal conductivity: 2.0 W/m-K
• Low “S-Class” thermal resistance at very
low pressures
• Highly conformable, low hardness
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear
and tear resistance
IMPERIAL VALUE
Gray
METRIC VALUE
Gray
TEST METHOD
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1- or 2-sided)
2
—
2.9
2.9
ASTM D792
Heat Capacity (J/g-K)
0.6
0.6
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
30
30
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
45
310
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
GAP PAD
2
Density (g/cc)
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number
0.020
– 02
– 0816 –
NA
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Thickness vs. Thermal Resistance
Gap Pad 2000S40
Resultant Thickness (mils)
Standard Options
Section E
–
Section D
GP2000S40
Section C
Note: Resultant thickness is defined as the final gap
thickness of the application.
• Power electronics DC/DC; 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls
Section B
Gap Pad 2000S40 is electrically isolating, and
well suited for applications requiring electrical
isolation between heat sinks and high-voltage,
bare-leaded devices. Gap Pad 2000S40 is a
filled, thermally conductive polymer reinforced
with a fiberglass carrier on one side, allowing
for easy material handling and enhanced
puncture, shear and tear resistance.
Typical Applications Include:
Section A
Gap Pad 2000S40 is recommended for lowstress applications that require a mid to high
thermally conductive interface material.The
highly conformable nature of the material
allows the pad to fill in air voids and air gaps
between PC boards and heat sinks or metal
chassis with stepped topography, rough
surfaces and high stack-up tolerances.
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125"
125
100
GP2000S40 = Gap Pad 2000S40 Material
75
Note: To build a part number, visit our website at www.bergquistcompany.com.
50
Gap Pad ®: U.S. Patent 5,679,457 and others.
25
0
0
0.50
1.00
1.50
2.00
Thermal Resistance (C-in2/W)
2.50
17
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Page 18
Gap Pad 2500S20
®
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Features and Benefits
• Thermal conductivity: 2.4 W/m-K
• Low “S-Class” thermal resistance at
ultra-low pressures
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
• Ultra conformable,“gel-like” modulus
Inherent Surface Tack (1- or 2-sided)
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear
and tear resistance
IMPERIAL VALUE
Light Yellow
METRIC VALUE
Light Yellow
TEST METHOD
Visual
2
2
—
Density (g/cc)
3.1
3.1
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
20
20
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
5
35
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>3000
>3000
ASTM D149
Dielectric Constant (1000 Hz)
6.6
6.6
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.4
2.4
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad 2500S20
130
110
90
70
50
30
10
0.18 0.43 0.68 0.93 1.18 1.43 1.68 1.93 2.18
Thermal Resistance (C-in2/W)
18
• Between processors and heat sinks
• Between graphics chips and heat sinks
• DVD and CDROM electronics cooling
• Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number
– 02
–
00
–
Standard Options
ACME 89302 Rev a
Section E
0.100
Section D
–
Section C
GP2500S20
Section B
Gap Pad 2500S20 is offered with inherent
natural tack on both sides of the material
allowing for stick-in-place characteristics during
application assembly.The material is supplied
with protective liners on both sides.
Typical Applications
Section A
Gap Pad 2500S20 is a thermally conductive,
reinforced material rated at a thermal
conductivity of 2.4 W/m-K.The material is a
filled-polymer material yielding extremely soft,
elastic characteristics.The material is reinforced
to provide easy handling, converting, added
electrical isolation and tear resistance. Gap
Pad 2500S20 is well suited for low-pressure
applications that typically use fixed standoff or
clip mounting.The material maintains a
conformable, yet elastic nature that allows for
excellent interfacing and wet-out
characteristics, even to surfaces with high
roughness and/or topography.
Resultant Thickness (mils)
GAP PAD
TYPICAL PROPERTIES OF GAP PAD 2500S20
PROPERTY
Color
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
GP2500S20 = Gap Pad 2500S20 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
SEL_SP_0906_Chpt1.qxp
10/20/2006
10:19 AM
Page 19
Gap Pad 2500
®
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
• Thermal conductivity: 2.7 W/m-K
• High thermal performance, cost-effective
solution
• Unreinforced construction for additional
compliancy
• Medium compliancy and conformability
TYPICAL PROPERTIES OF GAP PAD 2500
PROPERTY
Color
IMPERIAL VALUE
Light Brown
—
—
—
Thickness (inch) / (mm)
0.020 to 0.125
0.508 to 3.175
ASTM D374
Inherent Surface Tack (1- or 2-sided)
2
2
—
Density (g/cc)
3.1
3.1
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
80
80
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
113
779
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
>6000
ASTM D149
6.8
6.8
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.7
2.7
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Multiple heat-generating components to a common heat sink
• Graphics chips to heat sinks
• Processors to heat sinks
• Mass storage drives
• Wireline / wireless communications hardware
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number
–
00
–
ACME 89302 Rev a
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad 2500
120
100
80
60
40
20
0
0.20
Standard Options
Section E
– 02
Section D
0.100
Section C
–
Section B
GP2500
Section A
Note: Resultant thickness is defined as the final gap
thickness of the application.
>6000
Dielectric Constant (1000 Hz)
GAP PAD
Gap Pad 2500 is offered with inherent
natural tack on both sides of the material
allowing for stick-in-place characteristics
during application assembly.The material is
supplied with protective liners on both sides.
TEST METHOD
Visual
Reinforcement Carrier
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Gap Pad 2500 is a thermally conductive,
electrically insulating, unreinforced gap filling
material. Gap Pad 2500 is a filled-polymer
material yielding an elastic polymer that allows
for easy handling and converting without the
need for reinforcement.These properties also
allow for good wet-out and interfacing characteristics to surfaces with roughness
and/or topography. All these characteristics
make this material ideal for applications using
either clip or screw-mounted assemblies.
METRIC VALUE
Light Brown
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125"
GP2500 = Gap Pad 2500 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
0.60
1.00
1.40
1.80
Thermal Resistance (C-in2/W)
19
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Gap Pad A3000
®
Thermally Conductive, Reinforced Gap Filling Material
Features and Benefits
GAP PAD
• Thermal conductivity: 2.6 W/m-K
• Fiberglass reinforced for puncture, shear
and tear resistance
• Reduced tack on one side to aid in
application assembly
• Electrically isolating
TYPICAL PROPERTIES OF GAP PAD A3000
PROPERTY
Color
IMPERIAL VALUE
Gold
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.015 to 0.125
0.381 to 3.175
ASTM D374
Inherent Surface Tack (1- or 2-sided)
1
1
—
Density (g/cc)
3.2
3.2
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
80
80
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
50
344
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ASTM D149
7.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.6
2.6
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Typical Applications Include:
• Computer and peripherals
• Telecommunications
• Heat pipe assemblies
• RDRAM™ memory modules
• CDROM / DVD cooling
• Between CPU and heat spreader
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Configurations Available:
• Sheet form, die-cut parts and roll form (converted or unconverted)
Building a Part Number
0.015
– 01
– 0816 –
Standard Options
NA
Section E
–
Section D
GPA3000
Section C
125
115
105
95
85
75
65
55
45
35
25
15
>5000
7.0
Section B
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad A3000
>5000
Dielectric Constant (1000 Hz)
Section A
Note: Resultant thickness is defined as the final gap
thickness of the application.
TEST METHOD
Visual
Reinforcement Carrier
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Gap Pad A3000 is a thermally conductive,
filled-polymer laminate, supplied on a
reinforcing mesh for added electrical isolation,
easy material handling and enhanced puncture,
shear and tear resistance. Gap Pad A3000
has a reinforcement layer on the dark gold
side of the material that assists in burn-in
and rework processes while the light gold
and soft side of the material allows for
added compliance.
METRIC VALUE
Gold
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
01 = Natural tack, one side
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70
Thermal Resistance (C-in2/W)
Standard thicknesses available: 0.015", 0.020", 0.040",
0.060", 0.080", 0.100", 0.125"
GPA3000 = Gap Pad A3000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
20
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Gap Pad 3000S30
®
Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material
Features and Benefits
• Thermal conductivity: 3.0 W/m-K
• Low “S-Class” thermal resistance at very
low pressures
• Highly conformable,“S-Class” softness
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear
and tear resistance
TYPICAL PROPERTIES OF GAP PAD 3000S30
PROPERTY
Color
IMPERIAL VALUE
Light Blue
METRIC VALUE
Light Blue
TEST METHOD
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
Inherent Surface Tack (1- or 2-sided)
2
2
—
Density (g/cc)
3.2
3.2
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
30
30
ASTM D2240
Young’s Modulus (psi) / (kPa) (2)
26
180
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>3000
>3000
ASTM D149
Dielectric Constant (1000 Hz)
7.0
7.0
ASTM D150
Volume Resistivity (Ohm-meter)
10 9
10 9
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
3.0
3.0
ASTM D5470
GAP PAD
Hardness, Bulk Rubber (Shore 00) (1)
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.
Note: Resultant thickness is defined as the final gap
thickness of the application.
• Processors
• Notebook computers
• Server S-RAMs
• BGA packages
• Mass storage drives
• Power conversion
• Wireline / wireless communications hardware
Configurations Available:
• Sheet form and die-cut parts available
Building a Part Number
– 0816 –
Standard Options
ACME 89302 Rev a
Section E
0.020 – 02
Section D
–
Section C
GP3000S30
Section B
Gap Pad 3000S30 is offered with natural
inherent tack on both sides of the material,
eliminating the need for thermally-impeding
adhesive layers.The material’s natural inherent
tack allows for stick-in-place characteristics
during assembly. Gap Pad 3000S30 is supplied
with protective liners on both sides.
Typical Applications:
Section A
Gap Pad 3000S30 is a soft gap filling material
rated at a thermal conductivity of 3 W/m-K.
The material offers exceptional thermal
performance at low pressures due to an allnew 3 W/m-K filler package and low-modulus
resin formulation. It is reinforced to enhance
material handling, puncture, shear and tear
resistance. It is well suited for high performance, low-stress applications that typically use
fixed standoff or clip mounting. Gap Pad
3000S30 maintains a conformable yet elastic
nature that allows for excellent interfacing
and wet-out characteristics, even to surfaces
with high roughness and/or topography.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
GP3000S30 = Gap Pad 3000S30 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
Resultant Thickness (mils)
Thickness vs. Thermal Resistance
Gap Pad 3000S30
130
110
90
70
50
30
10
0.10 0.30 0.50 0.70 0.90 1.10 1.30 1.50 1.70
Thermal Resistance (C-in2/W)
21
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Gap Pad 5000S35
®
High thermal conductivity plus “S-Class” softness and conformability
Features and Benefits
• High thermal conductivity: 5 W/m-K
PROPERTY
• Highly conformable,“S-Class” softness
Color
• Natural inherent tack reduces interfacial
thermal resistance
GAP PAD
TYPICAL PROPERTIES OF GAP PAD 5000S35
• Conforms to demanding contours
and maintains structural integrity with
little or no stress applied to fragile
component leads
• Fiberglass reinforced for puncture, shear
and tear resistance
• Excellent thermal performance at
low pressures
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Light Green
Light Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.02 to 0.125
0.508 to 3.175
ASTM D374
2
2
—
Density (g/cc)
3.6
3.6
ASTM D792
Heat Capacity (J/g-K)
1.0
1.0
ASTM C351
Hardness Bulk Rubber (Shore 00) (1)
35
35
ASTM D2240
Inherent Surface Tack (1or 2 sided)
Young’s Modulus (psi) / (kPa) (2)
17.5
121
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
>5000
>5000
ASTM D149
Dielectric Constant (1000 Hz)
7.5
7.5
ASTM D150
Volume Resistivity (Ohm-meter)
10
10
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
5.0
5.0
ASTM D5470
9
9
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE
VS.
PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (ºC/W) (20 mil)
1.18
1.10
0.99
0.84
0.72
Thermal Impedance (ºC-in2/W) (3)
0.21
0.18
0.15
0.14
0.12
TO-220 Thermal Performance (ºC/W) (40 mil)
1.54
1.34
1.15
1.00
0.90
Thermal Impedance (ºC-in /W) (3)
0.30
0.28
0.25
0.22
0.13
2
Gap Pad 5000S35 is a fiberglass-reinforced
filler and polymer featuring a high thermal
conductivity. The material yields extremely
soft characteristics while maintaining elasticity
and conformability.The fiberglass reinforcement
provides easy handling and converting, added
electrical isolation and tear resistance.The
inherent natural tack on both sides assists in
application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. Gap Pad 5000S35 is ideal
for high-performance applications at low mounting pressures.
1) One second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample
size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. 3) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications
• CDROM / DVD ROM
• Voltage Regulator Modules ( VRMs) and POLs
• Thermally-enhanced BGAs
Configurations Available:
• Die-cut parts are available in any shape or size, separated or in sheet form
• Standard material thicknesses of 20, 40, 60, 80, 100 and 125 mil
• Custom thicknesses available upon request
Building a Part Number
Note: Resultant thickness is defined as the final gap thickness of
the application.
Gap Pad ®: U.S. Patent 5,679,457 and others.
22
• Memory packages / modules
• PC Board to chassis
• ASICs and DSPs
Standard Options
SEL_SP_0906_Chpt1.qxp
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Gap Filler 1000 (Two-Part)
Thermally Conductive, Liquid Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.0 W/m-K
• Ultra-conforming, designed for fragile and
low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
TYPICAL PROPERTIES OF GAP FILLER 1000
PROPERTY
Color / Part A
IMPERIAL VALUE
Gray
Color / Part B
White
Visual
100,000
ASTM D2196
Density (g/cc)
1.6
1.6
ASTM D792
Mix Ratio
1:1
1:1
—
6
6
—
PROPERTY AS CURED
Color
Gray
Gray
Visual
Hardness (Shore 00) (2)
30
30
ASTM D2240
Shelf Life @ 25°C (months)
1.0
1.0
ASTM E1269
-76 to 347
-60 to 175
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
500
500
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
15
15
—
Cure @ 25°C (min) (4)
60 - 120
60 - 120
—
Cure @ 100°C (min) (4)
5
5
—
GAP PAD
White
Continuous Use Temp (°F) / (°C)
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
Typical Applications Include:
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Configurations Available:
• For smaller quantity packaging, please contact Bergquist Sales
Building a Part Number
– 50cc –
Standard Options
NA
Section E
– 15
Section D
00
Section C
–
Section B
Section A
GF1000
Note: Resultant thickness is defined as the final gap
thickness of the application.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
Cartridges: 50cc = 50.0cc, 400cc = 400.0cc
Kits: 1200cc = 1200.0cc, or 10G = 10 gallon
Pot Life: 15 = 15 minutes
Thickness vs. Thermal Resistance
Gap Filler 1000
Resultant Thickness (mils)
TEST METHOD
Visual
100,000
Viscosity as Mixed (cps) (1)
Heat Capacity (J/g-K)
Gap Filler 1000 is a thermally conductive, liquid
gap filling material. It is supplied as a twocomponent, room or elevated temperature
curing system.The material is formulated to
provide a balance of cured material properties
highlighted by “gel-like” modulus and good
compression set (memory).The result is a
soft, thermally conductive, form-in-place
elastomer ideal for coupling “hot” electronic
components mounted on PC boards with an
adjacent metal case or heat sink. Before cure,
Gap Filler 1000 flows under pressure like a
grease. After cure, it does not pump from the
interface as a result of thermal cycling. Unlike
thermal grease, the cured product is dry to
the touch. Unlike cured gap filling materials,
the liquid approach offers infinite thickness
with little or no stress during displacement
and eliminates the need for specific pad thickness and die-cut shapes for individual applications. Gap Filler 1000 is intended for use in
thermal interface applications when a strong
structural bond is not required.
METRIC VALUE
Gray
00 = No spacer beads
07 = 0.007" spacer beads
300
GF1000 = Gap Filler 1000 Material
250
Note: To build a part number, visit our website at www.bergquistcompany.com.
200
150
Gap Pad ®: U.S. Patent 5,679,457 and others.
50
0
0
1
2 3 4 5 6 7 8 9 10 11
Thermal Resistance (C-in2/W)
23
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Page 24
Gap Filler 1100SF (Two-Part)
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material
TEMPERATURE DEPENDENCE OF VISCOSITY
The viscosity of the Gap Filler 1100SF material is temperature dependent.The table below provides the multiplication
factor to obtain viscosity at various temperatures.To obtain
the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25°C.
Temperature
°C
20
25
35
45
50
Multiplication Factor
Part A
Part B
1.43
1.57
1.00
1.00
0.58
0.50
0.39
0.30
0.32
0.24
Example - Viscosity of Part A @ 45°:
Viscosity of Part A at 25°C is 450,000 cp. The multiplication factor for part A at 45°C is 0.39. Therefore:
(450,000) x (0.39) = 175,500 cps
24
TEST METHOD
Visual
Red
Red
Visual
450,000
ASTM D2196
Density (g/cc)
2.0
2.0
ASTM D792
Mix Ratio
1:1
1:1
—
6
6
—
PROPERTY AS CURED
Color
Orange
Orange
Visual
Hardness (Shore 00) (2)
60
60
ASTM D2240
Shelf Life @ 25°C (months)
Heat Capacity (J/g-K)
0.9
0.9
ASTM E1269
-76 to 257
-60 to 125
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
400
400
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.1
1.1
ASTM D5470
Continuous Use Temp (°F) / (°C)
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
10-15
10-15
—
Cure @ 25°C (hrs) (4)
4
4
—
Cure @ 100°C (min) (4)
45
45
—
1) Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
Typical Applications Include:
• Silicone-sensitive optic components
• Hard disk assemblies
• Silicone-sensitive electronics
• Dielectric for bare-leaded devices
• Filling various gaps between heat-generating devices to heat sinks and housings
• Mechanical switching relay
Configurations Available:
• Supplied in cartridge or kit form
Building a Part Number
GF1100SF
–
00
– 15
– 400cc –
Standard Options
NA
Section E
Gap Filler 1100SF can be mixed and dispensed
using dual-tube cartridge packs with static
mixers and manual or pneumatic gun or high
volume mixing and dispensing equipment
(application of heat may be used to
reduce viscosity).
METRIC VALUE
Yellow
450,000
Viscosity as Mixed (cps) (1)
Section D
Application
Color / Part B
Section C
The two components are colored to assist
as a mix indicator (1:1 by volume).The mixed
system will cure at ambient temperature.
Unlike cured thermal pad materials, the liquid
approach offers infinite thickness variations with
little or no stress during assembly displacement.
Gap Filler 1100SF, although exhibiting some
natural tack characteristics, is not intended for
use in thermal interface applications requiring
a mechanical structural bond.
IMPERIAL VALUE
Yellow
Section B
• Thermal conductivity: 1.1 W/m-K
• No silicone outgassing or extraction
• Ultra-conforming, designed for fragile and
low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
Gap Filler 1100SF is the thermal solution for
silicone-sensitive applications.The material is
supplied as a two-part component, curing at
room or elevated temperatures.The material
exhibits “gel-like” properties then cures to a
soft, flexible elastomer, helping reduce thermal
cycling stresses during operation and virtually
eliminating stress during assembly of lowstress applications.
TYPICAL PROPERTIES OF GAP FILLER 1100SF
PROPERTY
Color / Part A
Section A
GAP PAD
Features and Benefits
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
Cartridges: 400cc = 400.0cc
Kits: 1200cc = 1200.0cc, or 10G = 10 gallon
Pot Life: 15 = 15 minutes
00 = No spacer beads
07 = 0.007" spacer beads
GF1100SF = Gap Filler 1100SF Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Gap Pad ®: U.S. Patent 5,679,457 and others.
SEL_SP_0906_Chpt1.qxp
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Page 25
Gap Filler Gel 1500
The first in a new family of highly-conformable gels requiring no curing, mixing or refrigeration
Features and Benefits
TYPICAL PROPERTIES OF GAP FILLER GEL 1500
PROPERTY
IMPERIAL VALUE
METRIC VALUE
Gray
Gray
Visual
1000 - 10,000
1000 - 10,000
ASTM D4473
Viscosity (Pa-sec) (2)
200
200
ASTM D5099
Density (g/cc)
1.8
1.8
ASTM D792
Color
Shear Modulus (Pa) (1)
Heat Capacity (J/g-K)
Continuous Use Temp (°F) / (°C)
Shelf Life at 25ºC (months)
TEST METHOD
1.3
1.3
ASTM E1269
-76 to 347
-60 to 175
_
12
12
_
250
250
ASTM D149
GAP PAD
• Highly conformable and requires no curing,
mixing or refrigeration
• Excellent high and low temperature
mechanical and chemical stability
• Storage stability of up to one year without
filler settling issues
• Reworkable
• Good thermal performance: 1.4 W/mK
• Stress conforming through low modulus
ELECTRICAL
Dielectric Strength (V/mil)
Dielectric Constant (1000 Hz)
6
6
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
1.4
1.4
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
1) Parallel plate rheometer at 1 Hz and 0.1% strain.
2) Capillary rheometer at 900 sec-1.
Typical Applications Include:
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Configurations Available:
• 30cc, 310cc and 600cc tubes
• 5-gallon containers
• 7 mil spacer beads
Gap Filler Gel 1500 is the first member in
Bergquist’s new family of pre-cured gap filling
materials.The product is a highly conformable
gel which requires no curing, mixing or refrigeration. It’s unique formulation assures excellent thermal conductivity, stress conformance
through low modulus, excellent high and low
temperature chemical storage and storage
stability up to one year. Gap Filler Gel 1500 is
ideal for thermal interface applications where
highly variable gaps and tolerances exist in
electronic components, where only minimal
stress on components is permissible and rework may be required.
Building a Part Number
Standard Options
Gap Pad ®: U.S. Patent 5,679,457 and others.
25
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Gap Filler 2000 (Two-Part)
High Thermally Conductive, Liquid Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP FILLER 2000
PROPERTY
Color / Part A
• Thermal conductivity: 2.0 W/m-K
• Ultra-conforming, designed for fragile and
low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
• Excellent low and high temperature
mechanical and chemical stability
IMPERIAL VALUE
Pink
Color / Part B
White
White
Visual
300,000
ASTM D2196
Density (g/cc)
2.9
2.9
ASTM D792
Mix Ratio
1:1
1:1
—
6
6
—
PROPERTY AS CURED
Color
Pink
Pink
Visual
Hardness (Shore 00) (2)
70
70
ASTM D2240
GAP PAD
Shelf Life @ 25°C (months)
Heat Capacity (J/g-K)
1.0
1.0
ASTM E1269
-76 to 392
-60 to 200
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
500
500
ASTM D149
Dielectric Constant (1000 Hz)
7.0
7.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
Continuous Use Temp (°F) / (°C)
15
15
—
Cure @ 25°C (min) (4)
60 - 120
60 - 120
—
Cure @ 100°C (min) (4)
5
5
—
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
Typical Applications Include:
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Configurations Available:
• For smaller quantity packaging, please contact Bergquist Sales
Building a Part Number
– 60
– 10G –
Note: Resultant thickness is defined as the final gap
thickness of the application.
Resultant Thickness (mils)
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
Cartridges: 50cc = 50.0cc, 400cc = 400.0cc
Kits: 1200cc = 1200.0cc, or 10G = 10 gallon
Pot Life: 15 = 15 minutes, 60 = 60 minutes
Thickness vs. Thermal Resistance
Gap Filler 2000
00 = No spacer beads
07 = 0.007" spacer beads
300
GF2000 = Gap Filler 2000 Material
250
Note: To build a part number, visit our website at www.bergquistcompany.com.
200
150
Gap Pad ®: U.S. Patent 5,679,457 and others.
50
0
0
26
Standard Options
NA
Section E
00
Section D
–
Section C
GF2000
Section B
Gap Filler 2000 is intended for use in thermal
interface applications when a strong structural
bond is not required. Gap Filler 2000 is formulated for low-modulus,“gel-like” properties.
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
Section A
Unlike cured Gap Filling materials, the liquid
approach offers infinite thickness with little or no
stress during displacement and assembly. It also
eliminates the need for specific pad thickness
and die-cut shapes for individual applications.
TEST METHOD
Visual
300,000
Viscosity as Mixed (cps) (1)
Gap Filler 2000 is a high performance, thermally
conductive, liquid gap filling material supplied
as a two-component, room or elevated
temperature curing system.The material
provides a balance of cured material properties
and good compression set (memory).The
result is a soft, form-in-place elastomer ideal
for coupling “hot” electronic components
mounted on PC boards with an adjacent
metal case or heat sink. Before cure, it flows
under pressure like grease. After cure, it won't
pump from the interface as a result of thermal
cycling and is dry to the touch.
METRIC VALUE
Pink
1
2
3
4
5
Thermal Resistance (C-in2/W)
6
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Gap Filler 3500S35 (Two-Part)
Thermally Conductive Liquid Gap Filling Material
Features and Benefits
TYPICAL PROPERTIES OF GAP FILLER 3500S35
• Thermal Conductivity: 3.6 W/m-K
• Thixotropic nature makes it easy to
dispense
• Two-part formulation for easy storage
• Ultra-conforming - designed for fragile and
low stress applications
• Ambient or accelerated cure schedules
PROPERTY
Color / Part A
IMPERIAL VALUE
White
Color / Part B
TEST METHOD
Visual
Blue
Visual
150,000
ASTM D2196
Density (g/cc)
1.0
1.0
ASTM D792
Mix Ratio
1:1
1:1
—
5
5
—
PROPERTY AS CURED
Color
Blue
Blue
Visual
Hardness (Shore 00) (2)
32
32
ASTM D2240
Shelf Life @ 25°C (months)
-76 to 392
-60 to 200
—
ELECTRICAL AS CURED
Dielectric Strength (V/mil)
275
275
ASTM D149
Dielectric Constant (1000 Hz)
8.0
8.0
ASTM D150
Volume Resistivity (Ohm-meter)
109
109
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
3.6
3.6
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (min) (3)
60
60
—
Cure @ 25°C (min) (4)
15
15
—
Cure @ 100°C (min) (4)
30
30
—
1) Brookfield RV, Heli-Path, Spindle TF @ 20 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
Typical Applications Include:
• Automotive electronics
• Discrete components to housing
• PCBA to housing
• Fiber optic telecommunications equipment
Configurations Available:
• Supplied in cartridge or kit form
Building a Part Number
Standard Options
Thickness vs.Thermal Resistance
Gap Filler 3500S35
Thickness (inch)
0.25
0.20
0.15
Gap Pad ®: U.S. Patent 5,679,457 and others.
0.10
0.05
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Thermal Resistance (C-in2/W)
27
GAP PAD
Blue
150,000
Viscosity as Mixed (cps) (1)
Continuous Use Temp (°F) / (°C)
Gap Filler 3500S35 is the technology leader
in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance
and superior softness.The material is twocomponent, cured either at room or elevated
temperature. Prior to curing, the material
maintains good thixotropic characteristics as
well as low viscosity.The result is a gel-like
liquid material designed to fill air gaps and
voids yet flow when acted upon by an
external force (e.g. dispensing or assembly
process).The material is an excellent solution
for interfacing fragile components with high
topography and/or stack-up tolerances to a
universal heat sink or housing. Once cured, it
remains a low modulus elastomer designed
to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to
prevent pump-out from the interface. Gap
Filler 3500S35 will lightly adhere to surfaces,
thus improving surface area contact. Gap
Filler 3500S35 is not designed to be a
structural adhesive.
METRIC VALUE
White
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TIC - Thermal Interface Compound
™
TIC
Thermally Conductive Grease Compounds
Bergquist’s line of thermally conductive thermal interface compounds
will flow under assembly pressure to wet-out the thermal interface
surfaces and produce very low thermal impedance. TIC products are
designed for use between a high-end computer processor and a heat
sink or other high watt density applications.
Features
Benefits
Options
Applications
The TIC portfolio has diverse
thermal and electrical
characteristics. Key criteria when
selecting TIC products include:
TIC products are ideal for high
watt density applications. Primary
benefits include:
TIC products can be obtained
with application-specific options
such as:
TIC has a variety of applications
such as:
• Low interfacial resistance
• Low thermal impedance
• Resists dripping
• Ideally suited to screen printing
applications
• No post “cure” conditioning
required
• Containers
• Viscosity
• Volume resistivity
• Thermal conductivity
• Thermal performance
• Filler size
• CPU
• GPU
• IGBT
• High power density applications
Comparison Data and FAQ’s
Q: What is the best fastening method for a TIC interface?
A: A constant-pressure fastener is preferred when using TIC for high
performance applications.The constant pressure from a clip or
spring washer will ensure adequate pressure is being applied with
varying bond line thickness.
Q: How should the TIC be applied?
A: Screenprinting the TIC is a fast, low-cost method that delivers
a consistent and accurate amount of material on each application.
Alternate methods include stenciling, pin transfer and needle
dispensing.
Q: Will the grease stay in the interface?
A: All the TIC materials were specifically designed to resist pump-out
of the interface, even after many hours of thermal and power
cycling.
28
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TIC 1000G
™
High Performance,Value Compound for High-End Computer Processors
Features and Benefits
• Thermal performance: 0.29°C/W (@ 50 psi)
• Excellent screenability
• No post “cure” required
• Cost vs. performance leader
TYPICAL PROPERTIES OF TIC 1000G
PROPERTY
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
TEST METHOD
Visual
Density (g/cc)
1.2
1.2
ASTM D792
Continuous Use Temp (°F) / (°C)
302
150
—
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1)
N/A
N/A
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
0.7
0.7
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
TO-220 Thermal Performance (°C/W) (2)
10
25
50
100
200
0.32
0.30
0.29
0.27
0.26
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare material thermal performance.
Application Cleanliness
Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or repair.
Be sure heat sink is dry before applying TIC 1000G.
TIC 1000G compound wets-out the thermal
interface surfaces and flows to produce the
lowest thermal impedance.The compound
requires pressure of the assembly to cause
flow.The compound will resist dripping.
Application Methods
1. Dispense and/or screenprint TIC 1000G compound onto the processor or heat sink surface
like thermal grease (see a Bergquist Representative for application information).
2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners.
Typical Applications Include:
• High performance CPU's
• High performance GPU's
Building a Part Number
Standard Options
For microprocessor applications, traditional
screw fastening or spring clamping methods
will provide adequate force to optimize the
thermal performance of TIC 1000G.
An optimized application would utilize the
minimum volume of TIC 1000G compound
necessary to ensure complete wet-out of
both mechanical interfaces.
TIC™: U.S. Patents 6,797,758; 6,624,224; 6,339,120.
Note: TIC 1000G is ideally suited for screenprinting applications. Please contact Bergquist
Sales for application notes related to screenprinting.
Assembly – No Post Screen Cure
TIC 1000G has excellent screenability. No
solvent is used to reduce the viscosity, so no
post “cure” conditioning is required.
29
TIC
TIC 1000G is a high performance, thermally
conductive compound intended for use as a
thermal interface material between a highend computer processor and a heat sink.
Other high watt density applications will
benefit from the extremely low thermal
impedance of TIC 1000G.
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TIC 1000A
™
High Performance,Value Compound for High-End Computer Processors
Features and Benefits
• High thermal performance:
0.32°C/W (@ 50 psi)
• Good screenability
• Room temperature storage
• No post “cure” required
• Exceptional value
TYPICAL PROPERTIES OF TIC 1000A
PROPERTY
Color
IMPERIAL VALUE
Gray
METRIC VALUE
Gray
TEST METHOD
Visual
Density (g/cc)
2.1
2.1
ASTM D792
Continuous Use Temp (°F) / (°C)
302
150
—
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1)
N/A
N/A
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
1.5
1.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
TO-220 Thermal Performance (°C/W) (2)
10
25
50
100
200
0.32
0.32
0.32
0.31
0.28
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare material thermal performance.
Application Cleanliness
TIC
1. Pre-clean heat sink and component interface with isopropyl alcohol prior to assembly or
repair. Ensure heat sink is dry before applying TIC 1000A.
Application Methods
TIC 1000A is a high performance, thermally
conductive compound intended for use as a
thermal interface material between a highend computer processor and a heat sink.
Other high watt density applications will also
benefit from the extremely low thermal
impedance of TIC 1000A.
TIC 1000A compound wets-out the thermal
interface surfaces and flows to produce the
lowest thermal impedance.The compound
requires pressure of the assembly to cause
flow.The TIC 1000A compound will resist
dripping.
1. Dispense and/or screenprint TIC 1000A compound onto the processor or heat sink surface
like thermal grease (see a Bergquist Representative for application information).
2. Assemble the processor and heat sink with spring clips or constant-pressure fasteners.
Typical Applications Include:
• High performance CPUs
• High performance GPUs
Building a Part Number
For microprocessor applications, traditional
screw fastening or spring clamping methods
will provide adequate force to optimize the
thermal performance of TIC 1000A.
An optimized application would utilize the
minimum volume of TIC 1000A material
necessary to ensure complete wet-out of
both mechanical interfaces.
Assembly – No Post Screen Cure
TIC 1000A has good screenability. No
solvent is used to reduce the viscosity, so
no post “cure” conditioning is required.
30
TIC™: U.S. Patents 6,797,758; 6,624,224; 6,339,120.
Standard Options
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TIC 4000
™
High Performance Thermal Interface Compound for Copper-Based Heat Sinks
Features and Benefits
• Thermal conductivity: 4.0 W/m-K
• Exceptional thermal performance:
0.19°C/W @ 50 psi
TYPICAL PROPERTIES OF TIC 4000
PROPERTY
Color
IMPERIAL VALUE
Gray
METRIC VALUE
Gray
TEST METHOD
Visual
Density (g/cc)
4.0
4.0
ASTM D792
Continuous Use Temp (°F) / (°C)
302
150
—
ELECTRICAL
Electrical Resistivity (Ohm-meter) (1)
N/A
N/A
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
4.0
4.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
TO-220 Thermal Performance (°C/W) (2)
10
25
50
100
200
0.21
0.20
0.19
0.19
0.18
1) The compound contains an electrically conductive filler surrounded by electrically non-conductive resin.
2) TO-220 performance data is provided as a reference to compare material thermal performance.
Application Methods
1. Pre-clean heat sink and component interface with isopropyl alcohol prior to
assembly or repair. Ensure heat sink is dry before applying TIC 4000.
2. Dispense TIC 4000 compound onto the processor or heat sink surface like thermal grease.
3. Assemble the processor and heat sink with clip or constant-pressure fasteners.
TIC 4000 compound wets-out the thermal
interface surfaces and flows to produce low
thermal impedance.The compound requires
pressure of the assembly to cause flow.
TIC 4000 compound will not drip.
• High performance computer processors (traditional screw fastening or clamping methods will
provide adequate force to optimize the thermal performance of TIC 4000)
• High watt density applications where the lowest thermal resistance interface is required
Typical Applications Include:
Building a Part Number
Standard Options
For a typical 0.5" x 0.5" application at 0.005"
thick, Bergquist estimates approximately
0.02 ml (cc) of TIC 4000.
Although Bergquist estimates a 0.02 ml (cc)
volumetric requirement for a 0.5" x 0.5"
component interface, dispensed at a thickness
of 0.005", Bergquist also recognizes that an
optimized application would utilize the
minimum volume of TIC 4000 material
necessary to ensure complete wet-out of
both mechanical interfaces.
TIC™: U.S. Patents 6,797,758; 6,624,224; 6,339,120.
31
TIC
TIC 4000 is a thermally conductive grease
compound designed for use as a thermal interface material between a computer processor
and a copper-based heat sink. Other high
watt density applications will benefit from the
extremely low thermal impedance of TIC 4000.
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Hi-Flow Phase Change Interface Materials
®
Solutions-Driven Thermal Management Products for Electronic Devices
HI-FLOW
Use phase change materials for excellent thermal performance without the mess of grease.
Hi-Flow phase change materials are an excellent replacement for
grease as a thermal interface between a CPU or power device and a
heat sink.The materials change from a solid at specific phase change
temperatures and flow to assure a total wet-out of the interface
without overflow.The result is a thermal interface comparable to
grease, without the mess, contamination and hassle.
The Hi-Flow family of phase change thermal interface materials covers a
wide range of applications.The Bergquist Company is a leader in thermal
management solutions and works closely with customers to ensure
that the proper Hi-Flow material is specified.
Features
Benefits
Options
Applications
Hi-Flow handles like Bergquist’s
famed Sil-Pad materials at room
temperature, but flows like grease
at its designed phase change
temperature.The following is an
overview of the important features
shared by the Hi-Flow family:
Using Hi-Flow materials instead
of grease can save time and money
without sacrificing thermal
performance. Here are some
other benefits:
The broad Hi-Flow family offers
a variety of choices to meet the
customer’s performance, handling
and process needs. Some of the
choices include:
Hi-Flow materials are suited for
consumer and industrial
electronics, automotive, medical,
aerospace and telecommunications applications such as:
• No mess – thixotropic characteristics of the materials keep it
from flowing out of the interface
• Easier handling – tackified or
tack-free at room temperature
• Does not require protective
liner
• High thermal performance
helps ensure CPU reliability
• Does not attract contaminants
• Easier material handling and
shipping
• Simplified application process
• Some Hi-Flows are available
with or without adhesive
• Aluminum carrier for
applications not requiring
electrical isolation
• Film or fiberglass carrier for
electrical isolation
• Dry, non-reinforced material
• Tackified or tack-free at room
temperature
• Tabbed parts, die-cut parts,
sheets or bulk rolls
• Adhesive specifically for cold
application without preheating
heat sink
We produce thousands of specials.
Tooling charges vary depending
on the complexity of the part.
• UPS and SMPS AC/DC, DC/DC
or linear power supplies
• Between a CPU and heat sink
• Power conversion devices
• Fractional and integral motor
control
• Leaded, surface mount and
power module assemblies
• Comparable thermal
performance to grease in
most applications
• Thermally conductive phase
change compound
• Aluminum, film or fiberglass
carriers and non-reinforced
versions
• Low volatility
• Easy to handle and apply in the
manufacturing environment
• Tackified or tack-free at room
temperature
U.S. Patent 5,679,457 and others.
32
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Hi-Flow Comparison Data
®
TO-220 Thermal Performance
HI-FLOW
33
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Frequently Asked Questions
Q: How is the ASTM D5470 test modified to characterA:
ize phase change thermal performance?
ASTM classifies a phase change as a Type 1, viscous liquid that
exhibits unlimited deformation when a stress is applied. Bergquist
utilizes test equipment that is designed to meet ASTM D5470
specifications for Type 1, which requires a shim or mechanical
stop to precisely control the thickness.The phase change material
is conditioned at 5oC over the stated phase change temperature.
Understanding that time is also a key variable for material flow,
the over-temperature condition is limited to 10 minutes and then
allowed to cool, prior to initiating the actual test at the given
pressure.The 10 minute time has been demonstrated to be an
acceptable time period for the thermal mass inherent in the test
setup. Note: Actual application testing may require more or
less time to condition, depending upon the heat transfer and
associated thermal mass.The performance values are recorded
and published at 10, 25, 50, 100 and 200 psi to give the designer a broad-based understanding of Hi-Flow’s performance.
Q: What is the minimum pressure required to optimize
the thermal performance of the Hi-Flow material?
A: Upon achieving phase change temperature (e.g. pre-conditioning),
HI-FLOW
Bergquist has demonstrated that 10 psi provides adequate
pressure to achieve exceptional thermal performance. Bergquist
continues to research lower pressure wet-out characteristics in
an effort to minimize interfacial losses associated with ultra-thin
material interfaces.
Q: Will the Hi-Flow replace a mechanical fastener?
A: Mechanical fasteners are required. Bergquist recommends the
use of spring clips to maintain consistent pressure over time.
Q: Can I use screw-mount devices with Hi-Flow material?
A: Hi-Flow works best with a clip or spring washer-mounted
assembly.The continuous force applied by these devices allows
the Hi-Flow material to flow and reduce the cross sectional gap.
Bergquist suggests that design engineers evaluate whether a
screw-mount assembly will have acceptable performance. See
TO-220 Technical Note.
Q: Is the adhesive in Hi-Flow 225F-AC repositionable?
A: The adhesive in the current construction does adhere more to
the heat sink aluminum than to the Hi-Flow material.There is the
potential that the adhesive will be removed by the heat sink
surface when it is removed to reposition on the heat sink.Time
and/or pressure will increase the bond to the aluminum increasing
the potential for the adhesive to adhere to the heat sink.
Q: Is there any surface preparation required before
A:
34
applying the adhesive-backed Hi-Flow to the heat sink?
Standard electronics industry cleaning procedures apply. Remove
dirt or other debris. Best results are attained when the Hi-Flow
material is applied to a heat sink at a temperature of 25° +/- 10°C.
If the heat sink has been surface treated (e.g. anodized or
chromated), it is typically ready for assembly. For bare aluminum,
mild soap and water wash cleaning processes are typically used
to eliminate machine oils and debris.
Q: Is Hi-Flow material reworkable?
A: If the material has not gone through phase change, the material
will readily release from the device surface. For this situation, the
Hi-Flow material will not likely have to be replaced.
If the material has gone through the phase change, it will adhere
very well to both surfaces. In this case, Bergquist suggests warming
the heat sink to soften the Hi-Flow compound for easier removal
from the processor. Replace with a new piece of Hi-Flow material.
Q: What is meant by “easy to handle” in manufacturing?
A: Insulated Hi-Flow products are manufactured with inner film
support.This film stiffens the material, allowing parts to be more
readily die-cut as well as making the material easier to handle in
manual or automated assembly.
Q: What is meant by “tack free” and why is this important?
A: Many Hi-Flow materials have no surface tack at room temperature.
The softer materials will pick up dirt more readily. Softer resins
are more difficult to clean if any dirt is on the surface. If you try
to rub the dirt away, the dirt is easily pushed into the soft phase
change materials. Hi-Flow coatings are typically hard at room
temperature rendering them easier to clean off without
embedding dirt.
Q: What does “more scratch resistance” mean on
Hi-Flow 625?
A: Hi-Flow 625 does not require a protective film during shipment.
There are two issues with competitors’ materials:
1) Melt point of the material is low enough that it can go
through phase change in shipment and be very tacky.
Hi-Flow has a higher phase change temperature and
remains hard to a higher temperature.
2) The Hi-Flow material is harder and is not as easy to
scratch or dent in shipping and handling.
Q: Why is Hi-Flow phase change temperature 65oC?
A: The 65oC phase change temperature was selected for two reasons.
First, it was a low enough temperature for the phase change to
occur in applications. Second, it would not phase change in
transport. Bergquist studies show that shipping containers can
reach 60oC in domestic and international shipments.The higher
phase change temperature eliminates the possibility of a product
being ruined in shipment.We offer a standard line of Hi-Flow 225
and 300 series products with 55oC phase change for those
customers wanting the lower phase change temperature.
Q: In which applications should I avoid using Hi-Flow?
A: Avoid using Hi-Flow in applications in which the device will
not reach operation at or above phase change temperature. Also
avoid applications in which the operating temperature exceeds the
maximum recommended operating temperature of the compound.
SPDG_Chapter2_10.06.qxp
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Hi-Flow 105
®
Phase Change Coated Aluminum
Features and Benefits
• Thermal impedance:
0.37°C-in2/W (@25 psi)
• Used where electrical isolation is
not required
• Low volatility – less than 1%
• Easy to handle in the manufacturing
environment
• Flows but doesn’t run like grease
TYPICAL PROPERTIES OF HI-FLOW 105
PROPERTY
Color
IMPERIAL VALUE
Dark Gray
METRIC VALUE
Dark Gray
TEST METHOD
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.0055
0.139
ASTM D374
Continuous Use Temp (°F) / (°C)
266
130
—
Phase Change Temp (°F) / (°C)
149
65
ASTM D3418
ELECTRICAL
Dielectric Constant (1000 (Hz)
3.2
3.2
ASTM D150
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
0.9
0.9
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
0.95
0.80
0.74
0.69
0.64
Thermal Impedance (°C-in2/W) (2)
0.39
0.37
0.36
0.33
0.30
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
Standard Options
NA
Section E
Section D
– 0.0055 – AC – 12/250 –
Section C
HF105
Section B
Hi-Flow 105 has thermal performance equal
to grease with 0.10°C-in2/W contact thermal
resistance.
• Power semiconductors
• Microprocessors mounted on a heat sink
• Power conversion modules
• Spring or clip mount applications where thermal grease is used
Section A
At 65°C (phase change temperature),
Hi-Flow 105 changes from a solid and flows,
thereby assuring total wet-out of the interface.
The thixotropic characteristics of Hi-Flow 105
reduce the pump-out from the interface.
Typical Applications Include:
HI-FLOW
Hi-Flow 105 is a phase change material coated
on both sides of an aluminum substrate. It is
designed specifically to replace grease as a
thermal interface, eliminating the mess,
contamination and difficult handling associated
with grease. Hi-Flow 105 is tack-free and
scratch resistant at room temperature and
does not require a protective liner in shipment
when attached to a heat sink.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.0055"
HF105 = Hi-Flow 105 Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patents 6,197,859 and 5,950,066.
35
SPDG_Chapter2_10.06.qxp
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11:25 AM
Page 34
Hi-Flow 115-AC
®
Fiberglass-Reinforced, Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance:
0.37°C-in2/W (@25 psi)
• Can be applied directly to a cold heat sink
• One side adhesive-coated to aid
in positioning
• Fiberglass reinforced
TYPICAL PROPERTIES OF HI-FLOW 115-AC
PROPERTY
Color
IMPERIAL VALUE
Gray
METRIC VALUE
Gray
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.0055
0.139
ASTM D374
Elongation (%45° to Warp and Fill)
40
40
ASTM D882A
Tensile Strength (psi) / (MPa)
900
6
ASTM D882A
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
149
65
ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
300
300
ASTM D149
Dielectric Constant (1000 Hz)
3.5
3.5
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
0.8
0.8
ASTM D5470
Bergquist Hi-Flow 115-AC is a thermally
conductive fiber reinforced phase change
material.The product consists of a thermally
conductive 65°C phase change compound
coated on a fiberglass web, and an adhesive
coating on one side for attachment to a cold
heat sink.There is no need to preheat the
heat sink to apply the Hi-Flow 115-AC.
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
1.28
1.16
1.04
0.94
0.85
Thermal Impedance (°C-in2/W) (2)
0.44
0.37
0.35
0.27
0.15
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Typical Applications Include:
Hi-Flow 115-AC is designed as a thermal
interface material between a computer
processor and a heat sink.The pressure
sensitive adhesive makes it simple to apply in
high volume to heat sinks and the 65°C phase
change temperature eliminates shipping and
handling problems.
• Computer and peripherals
• As a thermal interface where bare die is exposed and needs to be heat sinked
Hi-Flow 115-AC requires no protective liner
for shipping or handling.The Hi-Flow coating
has excellent handling characteristics at room
temperature, and can withstand the handling
and shipping process without protection.
Building a Part Number
Configurations Available:
• Sheet form, die-cut parts and roll form
• With pressure sensitive adhesive
Standard Options
NA
Section E
Section D
Section C
– 0.0055 – AC – 12/250 –
Section B
HF115AC
Section A
HI-FLOW
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
TEST METHOD
Visual
Hi-Flow 115-AC handles like a Sil-Pad at
room temperature and flows like high-quality
grease at elevated temperatures.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.0055"
HF115AC = Hi-Flow 115-AC Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patents 6,197,859 and 5,950,066.
36
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Hi-Flow 225F-AC
®
Reinforced, Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance:
0.10°C-in2/W (@25 psi)
• Can be manually or automatically applied
to the surfaces of room-temperature
heat sinks
• Foil reinforced, adhesive-coated
• Soft, thermally conductive 55°C phase
change compound
TYPICAL PROPERTIES OF HI-FLOW 225F-AC
PROPERTY
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
TEST METHOD
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.004
0.102
ASTM D374
Carrier Thickness (inch) / (mm)
ASTM D374
0.0015
0.038
Continuous Use Temp (°F) / (°C)
248
120
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
0.87
0.68
0.57
0.50
0.45
Thermal Impedance (°C-in2/W) (2)
0.12
0.10
0.09
0.08
0.07
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
The material includes a base carrier liner with
differential release properties to facilitate
simplicity in roll form packaging and application
assembly. Please contact Bergquist Product
Management for applications that are less than
0.07" square.
Configurations Available:
• Roll form, kiss-cut parts, and sheet form
Building a Part Number
– AC – 11/250 –
Standard Options
NA
Section E
0.004
Section D
–
Section C
HF225FAC
Section B
Hi-Flow 225F-AC requires pressure from the
assembly to cause material flow.The Hi-Flow
coatings resist dripping in vertical orientation.
• Computer and peripherals
• Power conversion
• High performance computer processors
• Power semiconductors
• Power modules
Section A
Above the 55°C phase change temperature,
Hi-Flow 225F-AC wets-out the thermal
interface surfaces and flows to produce low
thermal impedance.
Typical Applications Include:
HI-FLOW
Hi-Flow 225F-AC is a high performance,
thermal interface material for use between a
computer processor and a heat sink. Hi-Flow
225F-AC consists of a soft, thermally
conductive 55°C phase change compound
coated to the top surface of an aluminum
carrier with a soft, thermally conductive
adhesive compound coated to the bottom
surface to improve adhesion to the heat sink.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
Standard thicknesses available: 0.004"
HF225FAC = Hi-Flow 225F-AC Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patent 6,197,859 and others
37
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Page 36
Hi-Flow 225FT
®
Reworkable, Pressure Sensitive Phase Change Material
Features and Benefits
• Thermal impedance:
0.10°C-in2/W (@25 psi)
• Reworkable pressure sensitive
• Tabbed parts for easy application
• Compliant foil allows easy release
and rework
TYPICAL PROPERTIES OF HI-FLOW 225FT
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Black
Black
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.004
0.102
ASTM D374
Carrier Thickness (inch) / (mm)
ASTM D374
Color
0.001
0.025
Continuous Use Temp (°F) / (°C)
248
120
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
V-O
V-O
U.L. 94
0.7
0.7
ASTM D5470
ELECTRICAL
Flame Rating
THERMAL
Thermal Conductivity (W/m-K) (1)
THERMAL PERFORMANCE vs PRESSURE
200
0.52
0.42
Thermal Impedance (°C-in2/W) (2)
0.13
0.10
0.09
0.07
0.06
Typical Applications Include:
• Computer and peripherals
• High performance computer processors
• Burn-in testing
• Heat pipes
• Mobile processors
HF 225FT
Roll Form,
Kiss-Cut Parts
Compliant Foil
Protects Hi-Flow
Low Adhesion to the Liner
for Ease of Removal
Clear Polyester
Carrier Liner
Configurations Available:
• Roll form with tabs and kiss-cut parts – no holes
• Custom thicknesses available
Hi-Flow 225FT is limited to a square or rectangular part design. Dimensional tolerance is
+/- 0.020 inch (0.5mm).
Building a Part Number
–
0.004
– 01
– 1112 –
Standard Options
NA
Section E
HF225FT
Section D
1. Hi-Flow 225FT pads are easily removed
from the carrier liner and can be handapplied to a room temperature heat sink,
foil-side exposed.To reposition the heat
sink assembly, simply lift gently to remove
and reapply.
100
0.63
Section C
Application Methods
50
0.74
Section B
Above the 55°C phase change temperature,
Hi-Flow 225FT wets-out the heat sink
interface and flows to produce exceptional
thermal performance.The thixotropic design
of Hi-Flow 225FT requires pressure of the
assembly to cause displacement and/or flow.
25
0.93
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Section A
HI-FLOW
Pressure (psi)
Bergquist reworkable Hi-Flow 225FT thermal
interface material provides a low thermal
resistance path between hot components
such as high performance processors and
heat sinks.The material consists of a 55°C
phase change compound bonded to one side
of a conformable metal foil.This pressure
sensitive material is easily applied to the heat
sink and securely conforms to many mounting
surfaces. Its compliant foil allows for easy
release and reworking without leaving residue
on CPU surfaces.
10
TO-220 Thermal Performance (°C/W)
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard Hi-Flow 225FT configuration,
11/250 = 11" x 250' rolls, or 00 = custom configuration
01 = Reworkable adhesive, one side
Standard thicknesses available: 0.004"
HF225FT = Hi-Flow 225FT Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patent 6,197,859 and others
38
SPDG_Chapter2_10.06.qxp
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Page 37
Hi-Flow 225UF
®
Unsupported,Thermally Conductive Phase Change Material
Features and Benefits
• Thermal impedance:
0.08°C-in2/W (@25 psi)
• Reworkable
• Easy release from CPU
• Easy to handle / assemble
TYPICAL PROPERTIES OF HI-FLOW 225UF
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Black
Black
Visual
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.0045
0.114
ASTM D374
Carrier Thickness (inch) / (mm)
ASTM D374
Color
0.001
0.025
Continuous Use Temp (°F) / (°C)
248
120
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
1.0
1.0
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K) (1)
THERMAL PERFORMANCE vs PRESSURE
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
Pressure (psi)
0.70
0.58
0.52
0.43
0.37
Thermal Impedance (°C-in2/W) (2)
0.10
0.08
0.07
0.06
0.05
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Configurations Available:
• Sheet form, kiss-cut or bulk
- Preferred form: squares / rectangles
• Singulated die-cut parts
- Preferred form: squares / rectangles
• Bulk roll form
Building a Part Number
Standard Options
NA
Section E
– 11/250 –
Section D
– 0.0045 – 00
Section C
HF225UF
Section B
Above the 55°C phase change temperature,
Hi-Flow 225UF wets-out the heat sink
interface and flows to produce exceptional
thermal performance. Hi-Flow 225UF’s
thixotropic design requires pressure of the
assembly to cause displacement and/or flow.
• Spring / clip mounted:
- Digital / high power CPU’s
- Power modules
HI-FLOW
Hi-Flow 225UF consists of a 55°C phase
change compound bonded to one side of a
conformable aluminum foil.This phase change
material is easily applied to a nominal 45°C
heat sink and securely conforms to many
mounting surfaces.The compliant foil allows
for easy release from the CPU/socket
assembly, leaving the surface clean and
residue-free. Hi-Flow 225UF is supplied in
kiss-cut form with a carrier liner protecting the
phase change material from contaminants.
Typical Applications Include:
Section A
Bergquist’s reworkable Hi-Flow 225UF thermal
interface material provides a low thermal
resistance path between hot components
such as high-performance processors and
heat sinks.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or
00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.0045"
HF225UF = Hi-Flow 225UF Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patent 6,197,859 and others
39
SPDG_Chapter2_10.06.qxp
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Page 38
Hi-Flow 225UT
®
Non-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance:
0.08°C-in2/W (@25 psi)
• 55°C phase change composite with
inherent tack characteristics
• High-visibility protective tabs
• Pressure sensitive phase change thermal
interface material
TYPICAL PROPERTIES OF HI-FLOW 225UT
PROPERTY
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
Reinforcement Carrier
None
None
—
Thickness (inch) / (mm)
0.003
0.077
ASTM D374
Continuous Use Temp (°F) / (°C)
248
120
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
0.7
0.7
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
TEST METHOD
Visual
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
0.60
0.53
0.46
0.40
0.35
Thermal Impedance (°C-in2/W) (2)
0.09
0.08
0.07
0.06
0.05
HI-FLOW
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Hi-Flow 225UT is designed as a pressure
sensitive thermal interface material for use
between a high performance processor and
a heat sink. Hi-Flow 225UT is a thermally
conductive 55°C phase change composite
with inherent tack.The material is supplied on
a polyester carrier liner and is available with
high-visibility protective tabs.
Above its phase change temperature, Hi-Flow
225UT wets-out the thermal interface surfaces
and flows to produce the lowest thermal
impedance.The material requires pressure of
the assembly to cause flow. Hi-Flow 225UT
coatings will resist dripping.
Typical Applications Include:
• Computer and peripherals
• High performance computer processors
• Graphic cards
• Power modules
Configurations Available:
Clear/Colored
Protective Tab
"Quick-Snap" High Visibility
Tab for Removal
Adhesive Strip
Clear Polyester
Carrier Liner
• Roll form with tabs and kiss-cut parts – no holes
Hi-Flow 225UT is limited to a square or rectangular part design. Dimensional tolerance is
+/- 0.020 inch (0.5mm).
Building a Part Number
Application Methods:
1. Hand-apply Hi-Flow 225UT to a roomtemperature heat sink.The Hi-Flow 225UT
pad exhibits inherent tack and can be
hand-applied similar to an adhesive pad.
The tab liner can remain on the heat sink
and pad throughout shipping and handling
until is it is ready for final assembly.
Hi- Flow®: U.S. Patent 6,197,859 and others
40
HF 225UT
Roll Form,
Kiss-Cut Parts
Standard Options
SPDG_Chapter2_10.06.qxp
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Page 39
Hi-Flow 225U
®
Non-Reinforced Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance: 0.07°C-in /W (@25 psi)
• Hi-Flow coating will resist dripping
• Thermally conductive 55°C phase change
compound
• Available in roll form with kiss-cut parts
2
TYPICAL PROPERTIES OF HI-FLOW 225U
PROPERTY
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
Reinforcement Carrier
None
None
—
Thickness (inch) / (mm)
0.0015
0.036
ASTM D374
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K) (1)
1.0
1.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
100
200
0.39
0.34
0.32
Thermal Impedance (°C-in2/W) (2)
0.08
0.07
0.06
0.05
0.04
Typical Applications Include:
• Computer and peripherals
• High performance computer processors
• Graphic cards
• Power modules
Configurations Available:
• Roll form with tabs and kiss-cut parts – no holes
Hi-Flow 225U is limited to a square or rectangular part design. Dimensional tolerance is
+/- 0.020 inch (0.5mm).
Building a Part Number
– 11/500 –
Standard Options
NA
Section E
– 0.0015 – 00
Section D
HF225U
Section C
1. Hand-apply to 35°- 45°C heat sink.The heat
sink is heated in an oven or via heat gun to
between 35°- 45°C.The Hi-Flow 225U part
is then applied like an adhesive pad.The heat
sink is cooled to room temperature and
packaged. A protective tab liner remains in
place until the unit is ready for final assembly.
The protective tab can be readily removed
from the applied Hi-Flow 225U pad at a
maximum temperature of 28°C.
2. Automated equipment with 30-psi pressure.
A pick-and-place automated dispensing unit
can be used to apply the Hi-Flow 225U
pad to a room-temperature heat sink.The
placement head should have a silicone
rubber pad, and should apply approximately
30-psi pressure to the pad on transfer to
the 25° – 35°C heat sink. Once applied,
the protective tab can be readily removed
from the Hi-Flow 225U pad at a maximum
temperature of 28°C.
50
0.47
Section B
Application Methods:
25
0.53
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Section A
Above its phase change temperature, Hi-Flow
225U wets-out the thermal interface surfaces
and flows to produce low thermal impedance.
Hi-Flow 225U requires pressure of the
assembly to cause flow.
10
TO-220 Thermal Performance (°C/W)
HI-FLOW
Hi-Flow 225U is designed for use as a thermal
interface material between a computer
processor and a heat sink.The product
consists of a thermally conductive 55°C
phase change compound coated on a release
liner and supplied on a carrier.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard Hi-Flow 225U configuration,
11/500 = 11" x 500' rolls, or 00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.0015"
HF225U = Hi-Flow 225U Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patent 6,197,859 and others
41
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Page 40
Hi-Flow 625
®
Electrically Insulating,Thermally Conductive Phase Change Material
Features and Benefits
• Thermal impedance:
0.71°C-in2/W (@25 psi)
• Electrically isolating
• 65°C phase change compound coated
on PEN film
• Tack-free and scratch-resistant
TYPICAL PROPERTIES OF HI-FLOW 625
PROPERTY
Color
IMPERIAL VALUE
Green
METRIC VALUE
Green
Reinforcement Carrier
PEN Film
PEN Film
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Elongation (%45° to Warp and Fill)
TEST METHOD
Visual
60
60
ASTM D882A
30,000
206
ASTM D882A
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
149
65
ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Tensile Strength (psi) / (MPa)
4000
4000
ASTM D149
Dielectric Constant (1000 Hz)
3.5
3.5
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
0.5
0.5
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K) (1)
25
50
100
200
2.26
2.10
2.00
1.93
1.87
Thermal Impedance (°C-in2/W) (2)
0.79
0.71
0.70
0.67
0.61
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Typical Applications Include:
• Spring / clip mounted
• Power semiconductors
• Power modules
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
0.005
Standard Options
– AC – 1212 –
NA
Section E
–
Section D
HF625
Section C
Hi-Flow 625 is tack-free and scratch-resistant at
production temperature and does not require
a protective liner in most shipping situations.
The material has the thermal performance of
2-3 mil mica and grease assemblies.
10
TO-220 Thermal Performance (°C/W)
Section B
Hi-Flow 625 is a film-reinforced phase change
material.The product consists of a thermally
conductive 65°C phase change compound
coated on PEN film. Hi-Flow 625 is designed
to be used as a thermal interface material
between electronic power devices that
require electrical isolation and a heat sink.The
reinforcement makes Hi-Flow 625 easy to
handle, and the 65°C phase change
temperature of the coating material eliminates
shipping and handling problems.The PEN film
has a continuous use temperature of 150°C.
Section A
HI-FLOW
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.005"
HF625 = Hi-Flow 625 Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patents 6,197,859 and 5,950,066.
42
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Hi-Flow 300P
®
Electrically Insulating,Thermally Conductive Phase Change Material
Features and Benefits
• Thermal impedance:
0.13°C-in2/W (@25 psi)
• Field-proven polyimide film
- excellent dielectric performance
- excellent cut-through resistance
• Outstanding thermal performance in an
insulated pad
TYPICAL PROPERTIES OF HI-FLOW 300P
PROPERTY
Color
IMPERIAL VALUE
Green
METRIC VALUE
Green
TEST METHOD
Visual
Reinforcement Carrier
Polyimide
Polyimide
—
Thickness (inch) / (mm)
0.004 - 0.005
0.102 - 0.127
ASTM D374
Film Thickness (inch) / (mm)
0.001 - 0.002
0.025 - 0.050
ASTM D374
40
40
ASTM D882A
Tensile Strength (psi) / (MPa)
7000
48
ASTM D882A
Continuous Use Temp (°F) / (°C)
302
150
—
Phase Change Temp (°F) / (°C)
131
55
ASTM D3418
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Elongation (%45° to Warp and Fill)
5000
5000
ASTM D149
Dielectric Constant (1000 Hz)
4.5
4.5
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
1.6
1.6
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K) (1)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
100
200
0.92
0.91
0.90
TO-220 Thermal Performance (°C/W) 0.0015"
1.19
1.17
1.16
1.14
1.12
TO-220 Thermal Performance (°C/W) 0.0020"
1.38
1.37
1.35
1.33
1.32
Thermal Impedance (°C-in2/W) 0.0010" (2)
0.13
0.13
0.12
0.12
0.12
Thermal Impedance (°C-in2/W) 0.0015" (2)
0.17
0.16
0.16
0.16
0.15
Thermal Impedance (°C-in2/W) 0.0020" (2)
0.19
0.19
0.19
0.18
0.18
Typical Applications Include:
• Spring / clip mounted
• Discrete power semiconductors and modules
Configurations Available:
• Roll form, die-cut parts and sheet form, with or without pressure sensitive adhesive
Building a Part Number
– 00
–
00
–
Standard Options
ACME10256 Rev a
Section E
0.001
Section D
–
Section C
HF300P
Section B
Bergquist suggests the use of spring clips to
assure constant pressure with the interface
and power source. Please refer to thermal
performance data to determine nominal
spring pressure for your application.
50
0.94
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Section A
Hi-Flow 300P achieves superior values in
voltage breakdown and thermal performance when compared to its competition.The
product is supplied on an easy release liner
for exceptional handling in high volume
manual assemblies. Hi-Flow 300P is designed
for use as a thermal interface material
between electronic power devices requiring
electrical isolation to the heat sink.
25
0.95
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard polyimide thicknesses available: 0.001", 0.0015",
0.002"
HF300P = Hi-Flow 300P Phase Change Material
We produce thousands of specials. Tooling charges vary
depending on tolerances and complexity of the part.
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patent 6,197,859 and others
43
HI-FLOW
Hi-Flow 300P consists of a thermally
conductive 55°C phase change compound
coated on a thermally conductive polyimide
film.The polyimide reinforcement makes the
material easy to handle and the 55°C phase
change temperature minimizes shipping and
handling problems.
10
TO-220 Thermal Performance (°C/W) 0.0010"
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Hi-Flow 300G
®
Fiberglass-Reinforced, Phase Change Thermal Interface Material
Features and Benefits
• Thermal impedance:
0.20°C-in2/W (@25 psi)
• Will not drip or run like grease
• Phase change compound coated on
a fiberglass carrier
TYPICAL PROPERTIES OF HI-FLOW 300G
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Green
Green
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Elongation (%45° to Warp and Fill)
40
40
ASTM D882A
Tensile Strength (psi) / (MPa)
400
3
ASTM D882A
Continuous Use Temp (°F) / (°C)
212
100
—
Phase Change Temp (°F) / (°C)
131
55
ASTM 3418
Dielectric Breakdown Voltage (Vac)
300
300
ASTM D149
Dielectric Constant (1000 Hz)
3.5
3.5
ASTM D150
Volume Resistivity (Ohm-meter)
108
108
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
1.6
1.6
ASTM D5470
Color
ELECTRICAL
THERMAL
Thermal Conductivity (W/m-K) (1)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
Above the phase change temperature,
Hi-Flow 300G wets-out the thermal interface
surfaces and flows to produce low thermal
impedance.The material requires pressure of
the assembly to cause flow. Hi-Flow 300G will
not drip or run like grease.
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
0.96
0.92
0.88
0.85
0.84
Thermal Impedance (°C-in2/W) (2)
0.27
0.20
0.16
0.15
0.14
1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The
Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity
of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is
not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required.
2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes
interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
Typical Applications Include:
• Computer and peripherals
• As a thermal interface where bare die is exposed and needs to be heat sinked
Application Methods
44
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
– 00
– 1012 –
Standard Options
NA
Section E
0.005
Section D
–
Section C
HF300G
Section B
1. Hand-apply to 40°- 50°C heat sink.The heat
sink is heated in an oven or by a heat gun
to between 40°- 50°C allowing the Hi-Flow
300G pad to be applied like an adhesive
pad.The heat sink is then cooled to room
temperature and packaged.
2. Hand-apply to 20°- 35°C heat sink.
Hi-Flow 300G can be applied to a room
temperature heat sink with the assistance
of a foam roller.The pad is positioned on
the heat sink and a hand roller is used to
apply pressure of 30 psi.
3. Automated equipment with 30 psi pressure.
A pick-and-place automated dispensing unit
can be used to apply Hi-Flow 300G to a
room temperature heat sink.The placement
head should have a soft silicone rubber
pad, and apply 30 psi pressure to the pad
on transfer to the 20°- 35°C heat sink.
Section A
HI-FLOW
Hi-Flow 300G consists of a thermally conductive
55°C phase change compound coated on a
fiberglass web. Hi-Flow 300G is designed as a
thermal interface material between a computer
processor and a heat sink.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.005"
HF300G = Hi-Flow 300G Phase Change Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Hi- Flow®: U.S. Patent 6,197,859 and others
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Sil-Pad Thermally Conductive Insulators
®
Solutions-Driven Thermal Management Products for Electronic Devices
Comprehensive choices for a cleaner and more efficient thermal interface
More than 25 years ago, Bergquist set the standard for elastomeric
thermal interface materials with the introduction of Sil-Pad.Today,
Bergquist is a world leader with a complete family of Sil-Pad materials
to meet the critical needs of a rapidly changing electronics industry.
Sil-Pad thermally conductive insulators, in their many forms, continue
to be a clean and efficient alternative to mica, ceramics or grease for a
wide range of electronic applications. Bergquist application specialists
work closely with customers to specify the proper Sil-Pad material for
each unique thermal management requirement.
Features
Benefits
Options
Applications
The Sil-Pad family encompasses
dozens of products, each with its
own unique construction, properties and performance. Here are
some of the important features
offered by the Sil-Pad family:
Choosing Sil-Pad thermal products
saves time and money while maximizing an assembly’s performance
and reliability. Specifically:
Some Sil-Pad products have special
features for particular applications.
Options include:
The large family of Sil-Pad
thermally conductive insulators is
extremely versatile. In today’s
marketplace, Sil-Pads are used in
virtually every component of the
electronics industry, including:
• Available with or without
adhesive
• Some configurations are well
suited for automated
dispensing and/or placement
• Aluminum foil or imbedded
graphite construction for
applications not requiring
electrical insulation
• Copper shield layer
• Polyester binder material for
silicone-sensitive applications
• Polyimide film carrier for
increased voltage breakdown
• Materials with reduced moisture
sensitivity
• Available in rolls, sheets, tubes
and custom die-cut parts
• Custom thicknesses and
constructions
We produce thousands of specials.
Tooling charges vary depending
on the complexity of the part.
• Interface between a power
transistor, CPU or other heatgenerating component and a
heat sink or rail
• Isolate electrical components
and power sources from heat
sink and/or mounting bracket
• Interface for discrete semiconductors requiring low-pressure
spring-clamp mounting
• Consumer electronics
• Automotive systems
• Telecommunications
• Aerospace
• Military
• Medical devices
• Industrial controls
45
SIL-PAD
• Proven silicone rubber binders
• Fiberglass, dielectric film or
polyester film carriers
• Special fillers to achieve specific
performance characteristics
• Flexible and conformable
• Reinforcements to resist
cut-through
• Variety of thicknesses
• Wide range of thermal
conductivities and dielectric
strengths
• Excellent thermal performance
• Eliminates the mess of grease
• More durable than mica
• Less costly than ceramic
• Resistant to electrical shorting
• Easier and cleaner to apply
• Under time and pressure,
thermal resistance will decrease
• Better performance for today’s
high-heat compacted assemblies
• A specific interfacial performance
that matches the need
• Efficient “total applied cost” that
compares favorably with other
alternatives
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Sil-Pad Comparison Data
®
TO-220 Thermal Performance
Q-Pad Materials
Non-Electrically Isolating
Sil-Pad High Value Materials
2.75
9.25
Q-Pad 3
Q-Pad II
2.50
Sil-Pad 400, 9 mil
Sil-Pad 400, 7 mil
Sil-Pad 980
Sil-Pad 900S
Sil-Pad 800
Sil-Pad 1100ST
8.25
Thermal Performance (C/W)
Thermal Performance (C/W)
2.25
2.00
1.75
1.50
1.25
1.00
0.75
7.25
6.25
5.25
4.25
3.25
0.50
2.25
0.25
0.00
1.25
0
50
100
150
200
0
50
Interface Pressure (psi)
Sil-Pad High Performance Materials
Sil-Pad Polyimide-Based Materials
Sil-Pad 1750
Sil-Pad A1500, 10 mil
Sil-Pad 2000, 10 mil
Sil-Pad A2000, 20 mil
Sil-Pad 1500ST, 12 mil
Sil-Pad A2000, 15 mil
Sil-Pad 1500ST, 8 mil
2.65
Sil-Pad K-4
Sil-Pad K-6
Sil-Pad K-10
4.00
3.75
Thermal Performance (C/W)
2.85
Thermal Performance (C/W)
200
4.25
3.05
SIL-PAD
150
Interface Pressure (psi)
3.25
2.45
2.25
2.05
1.85
1.65
3.50
3.25
3.00
2.75
2.50
2.25
2.00
1.75
1.45
1.50
1.25
1.25
0
50
100
150
Interface Pressure (psi)
46
100
200
0
50
100
150
Interface Pressure (psi)
200
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Frequently Asked Questions
Q: What is the primary difference between
A:
Sil-Pad A2000 and Sil-Pad 2000 products?
Sil-Pad A2000 utilizes a different filler package than Sil-Pad 2000.
This change results in a more compliant Sil-Pad A2000 material
that inherently lowers interfacial resistance losses.This reduction
in interfacial resistance results in improved overall thermal
performance when measured at lower pressures in standard
ASTM D5470 and TO-220 testing.
Q: When should I choose Sil-Pad 980
versus Sil-Pad 900S for my application?
A: Sil-Pad 980 is specifically formulated to provide superior cutthrough and crush resistance in combination with excellent heat
transfer and dielectric properties. Sil-Pad 980 has a proven history
of reliability in high-pressure applications where surface
imperfections such as burrs and dents are inherently common.
These applications often include heavily machined metal surfaces
manufactured from extrusions or castings. Sil-Pad 900S carries a
high level of crush resistance and is more likely to be used in
burr-free or controlled-surface finish applications.
Q: When should I choose Sil-Pad A2000
versus Sil-Pad 2000 for my application?
A: The answer is based on the assumption that the primary design
intent is to increase thermal performance. If your application
utilizes lower clamping pressures (e.g. 10 to 75 psi) you will find
the Sil-Pad A2000 to provide excellent thermal performance. In
contrast, if you are designing for higher clamping pressures (e.g.
100 psi or greater), it is likely that you will require the thermal
performance characteristics of the Sil-Pad 2000.
Q: Is there an adhesive available for Sil-Pad 1500ST and
Sil-Pad 1100ST?
A: Sil-Pad 1500ST and Sil-Pad 1100ST have an inherent tack on
both sides of the material.This inherent tack is used instead of
an adhesive.The tack provides sufficient adhesive for dispensing
from the carrier liner and placement on the component. Sil-Pad
1500ST and Sil-Pad 1100ST can be repositioned after the initial
placement.
Q: Are there differences in electrical characteristics
between Sil-Pad A2000 and Sil-Pad 2000?
A: Yes. Bergquist evaluates and publishes voltage breakdown,
dielectric constant and volume resistivity data per ASTM
standards for these materials. Due to differences between
ASTM lab testing and actual application performance, for best
results, these characteristics should be evaluated within the
actual customer system.
Q: Can I get Sil-Pad A2000 in roll form?
A: Yes.With the new environmentally “green” process improvements
added with the introduction of Sil-Pad A2000 products, the
materials are now available in roll form.The original Sil-Pad 2000
material cannot be produced in continuous roll form.
Q: When should I choose Sil-Pad 800
versus Sil-Pad 900S for my application?
performance for discrete semiconductor applications that utilize
low clamping pressures (e.g. spring clips at 10 to 50 psi). In contrast, if you are designing for higher clamping pressure applications
using discrete semi-conductors (e.g. 50 to 100 psi), it is likely that
you will prefer the combination of high thermal performance and
cut-through resistance inherent in Sil-Pad 900S material.
A:
1500ST and Sil-Pad 1100ST so flat when compared to
other Sil-Pads?
Sil-Pad 1500ST and Sil-Pad 1100ST wet-out the application
surfaces at a very low pressures. Optimal thermal performance
is achieved at pressures as low as 50 psi.
Q: How do I know which Sil-Pad is right for
my specific application?
A: Each application has specific characteristics (e.g. surface finish,
flatness tolerances, high pressure requirements, potential burrs,
etc.) that determine which Sil-Pad will optimize thermal
performance. Select a minimum of two pads that best fit the
application, then conduct testing to determine which material
performs the best.
SIL-PAD
A: Sil-Pad 800 is specifically formulated to provide excellent thermal
Q: Why is the thermal performance curves of Sil-Pad
Q: What is IS09001:2000?
A: The ISO certification is the adoption of a quality management
system that is a strategic decision of the organization.This
International Standard specifies requirements for a quality
management system where an organization: a) needs to
demonstrate its ability to consistently provide product that
meets customer and applicable regulatory requirements, and
b) aims to enhance customer satisfaction through the effective
application of the system, including processes for continual
improvement of the system and the assurance of conformity
to customer and regulatory requirements.
47
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Why Choose Sil-Pad Thermally Conductive Insulators?
Overview
Polyimide Films
The Bergquist Company established the standard for elastomeric,
thermally conductive insulation materials with the development of
Sil-Pad over 25 years ago. Sil-Pad was developed as a clean, greasefree alternative to mica and grease. Now, a complete family of materials
is available to meet the diverse and changing requirements of today’s
design engineer.
Polyimide films can also be used as insulators and are often
combined with wax or grease to achieve a low thermal impedance.
These polyimide films are especially tough and have high dielectric
strength. Sil-Pad K-4, K-6 and K-10 incorporate polyimide film as
the carrier material.
Mica and Grease
SIL-PAD
Mica insulators have been in use for over 35 years and are still
commonly used as an insulator. Mica is inexpensive and has excellent
dielectric strength, but it is brittle and is easily cracked or broken.
Because mica used by itself has high thermal impedance, thermal
grease is commonly applied to it.The grease flows easily and excludes
air from the interface to reduce the interfacial thermal resistance. If
the mica is also thin (2-3 mils [50-80 µm]), a low thermal impedance
can be achieved.
However, thermal
grease introduces a
number of problems to
the assembly process. It
is time-consuming to
apply, messy and difficult
to clean. Once thermal
grease has been applied
to an electronic assembly, solder processes
must be avoided to
prevent contamination
of the solder. Cleaning
baths must also be avoided to prevent wash-out of the interface
grease, causing a dry joint and contamination of the bath. Assembly,
soldering and cleaning processes must be performed in one process
while the greased insulators are installed off-line in a secondary
process. If the grease is silicone-based, migration of silicone molecules
occurs over time, drying out the grease and contaminating the assembly.
Silicone migration onto electrical contacts can result in the loss of
electrical conductance. For this reason, silicone-based thermal grease
has not been used in telecommunications systems.
48
Ceramic Insulators
Other insulation materials include ceramic wafer insulators which have
a higher thermal conductivity than mica.They are often used thicker
(20-60 mils), (.5 to 1.5 mm) to reduce capacitive coupling while
maintaining a low thermal impedance.
Drawbacks to ceramic insulators are their high cost and, like mica,
they are rigid and crack easily. Also, ceramic beryllia use requires
careful handling since inhalation of beryllia dust can cause lung
inflammation (berylliosis).
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Sil-Pad Materials
Carriers
Sil-Pad thermally conductive insulators are designed to be clean,
grease-free and flexible.The combination of a tough carrier material
such as fiberglass and silicone rubber which is conformable, provides
the engineer with a more versatile material than mica or ceramics
and grease. Sil-Pad products minimize the thermal resistance from the
case of a power semiconductor to the heat sink. Sil-Pad materials
electrically isolate the semiconductor from the heat sink and have suffiicient dielectric strength to withstand high voltage.They are also
strong enough to resist puncture by the facing metal surface.With
more than 30 different Sil-Pad materials available, there is a Sil-Pad
matched to almost any application.
The carrier provides physical reinforcement and contributes to dielectric
strength. High dielectric and physical strength are obtained by using a
heavy, tight mesh, but thermal resistance will suffer. A light, open mesh
reduces thermal resistance, dielectric strength and cut-through resistance.
The carrier materials used in Sil-Pad materials include fiberglass and
dielectric film.
Sil-Pad Construction
Sil-Pad products are constructed with a variety of different materials
including fiberglass, silicone rubber, polyimide film, polyester film and
fillers used to enhance performance. Sil-Pad materials are typically
constructed with an elastomeric binder compounded with a thermally
conductive filler coated on a carrier.The characteristics of your
application often determine which Sil-Pad construction will produce
the best performance.
Binders
Most Sil-Pad products use silicone rubber as the binder. Silicone rubber
has a low dielectric constant, high dielectric strength, good chemical
resistance and high thermal stability.
Fillers
The thermal conductivity of Sil-Pad products is improved by filling
them with ingredients of high thermal conductivity.The fillers change
the characteristics of the silicone rubber to enhance thermal and/or
physical characteristics.
For instance, some fillers make the silicone rubber hard and tough
while still retaining the ability to flow under pressure. A harder silicone
helps the material resist cut-through. In other applications a filler is
used to make the silicone rubber softer and more conformable to
rough surfaces.While the range in thermal resistance of greased mica
is quite large, the average is comparable to elastomeric insulators filled
with a blend of the appropriate ingredients.
Fiberglass-based insulators (Sil-Pad 400 and Sil-Pad 1500) have a rough
surface texture and will show a 15-20% decrease in thermal resistance
over a 24-hour period. Film-based insulators (Sil-Pad K-4, Sil-Pad K-6 and
Sil-Pad K-10) are smoother initially and show a 5% decrease over the
same period of time.
SIL-PAD
Silicone rubber also exhibits cold flow, which excludes air from the
interface as it conforms to the mating surfaces.This flow eliminates
the need for thermal grease. A rough-surface-textured insulator needs
to flow more to exclude air than a smooth one.The smoother pads
also need less pressure to wet-out the surfaces and obtain optimum
thermal contact.
49
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Mechanical, Electrical and Thermal Properties
Mechanical Properties
Woven fiberglass and films are used in Sil-Pad products to provide
mechanical reinforcement.The most important mechanical property
in Sil-Pad applications is resistance to cut-through to avoid electrical
shorting from the device to the heat sink.
Devices with larger surface areas need more pressure to get the
insulator to conform to the interface than smaller devices. In most
screw-mount applications, the torque required to tighten the fastener
is sufficient to generate the pressure needed for optimum thermal
resistance.There are exceptions where the specified torque on the
fastener does not yield the optimum thermal resistance for the insulator being used and either a different insulator or a
different mounting scheme should be used.
Interfacial thermal resistance decreases as time
under pressure increases. In applications where
high clamping forces cannot be used, time can be
substituted for pressure to achieve lower thermal
resistance.The only way to know precisely what
the thermal resistance of an insulator will be in
an application is to measure it in that application.
Electrical Properties
Cut-Through Resistance - Bergquist introduced its TO-220 cut-through test
to help customers better understand typical application performance.
SIL-PAD
Mounting Techniques and Mounting Pressure
Typical mounting techniques include:
• A spring clip, which exerts a centralized clamping force on the body
of the transistor.The greater the mounting force of the spring, the
lower the thermal resistance of the insulator.
• A screw in the mounting tab.With a screw-mounted TO-220, the
force on the transistor is determined by the torque applied to the
fastener.
In extremely low-pressure applications, an insulator with pressure
sensitive adhesive on each side may give the lowest thermal resistance
since the adhesive wets-out the interface easier than the dry rubber.
This decreases the interfacial thermal resistance.
If your application does not require electrical insulation, Q-Pad II or
Q-Pad 3 are ideal grease replacement materials.These materials do
not provide electrical isolation but have excellent thermal properties.
Hi-Flow phase change materials should also be considered for these
applications. (Reference pages 32-44 of this guide.)
The most important electrical property in a typical assembly where a
Sil-Pad insulator is used is dielectric strength. In many cases the dielectric
strength of a Sil-Pad will be the determining factor in the design of
the apparatus in which it is to be used.
Here are some general guidelines regarding electrical properties to
consider when selecting a Sil-Pad material:
• Q-Pad II and Q-Pad 3 are used when electrical isolation is not
required.
• Dielectric breakdown voltage is the total voltage that a dielectric
material can withstand.When insulating electrical components from
each other and ground, it is desirable to use an insulator with a high
breakdown voltage.
SIL-PAD TYPICAL ELECTRICAL PROPERTIES
Material
Sil-Pad 400 - 0.007
Sil-Pad 400 - 0.009
Sil-Pad 900S
Sil-Pad A1500
Sil-Pad 2000
Sil-Pad K-4
Sil-Pad K-6
Sil-Pad K-10
Test Method
50
BREAKDOWN VOLTAGE
DIELECTRIC STRENGTH
DIELECTRIC CONSTANT
VOLUME RESISTIVITY
(kV)
3.5
4.5
5.5
6.0
4.0
6.0
6.0
6.0
(Volts/mil) (kV/mm)
500
20
500
20
600
24
600
24
400
16
1000
39
1000
39
1000
39
(1000 Hz)
5.5
5.5
6.0
7.0
4.0
5.0
4.0
3.7
(Ohm-Meter)
1011
1011
1010
1011
1011
1012
1012
1012
ASTM D149*
ASTM D149*
ASTM D150
ASTM D257
* Method A,Type 3 Electrodes
* Method A,Type 3 Electrodes
SPDG_Chapter2_10.06.qxp
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Page 49
• Breakdown voltage decreases as the area of the electrodes
increases.This area effect is more pronounced as the thickness
of the insulator decreases.
• Breakdown voltage decreases as temperature increases.
• Breakdown voltage decreases as humidity increases (Sil-Pad 1750
is less sensitive to moisture).
• Breakdown voltage decreases in the presence of partial discharge.
• Breakdown voltage decreases as the size of the voltage source (kVA
rating) increases.
• Breakdown voltage can be decreased by excessive mechanical stress
on the insulator.
Dielectric strength, dielectric constant and volume resistivity should
all be taken into consideration when selecting a Sil-Pad material.
If your application requires specific electrical performance, please
contact a Bergquist Sales Representative for more detailed
testing information.
Thermal Properties
The thermal properties of a Sil-Pad material and your requirements for
thermal performance probably have more to do with your selection of a
Sil-Pad than any other factor.
Discrete semiconductors, under normal operating conditions, dissipate
waste power which raises the junction temperature of the device. Unless
sufficient heat is conducted out of the device, its electrical performance
and parameters are changed. A 10°C rise in junction temperature can
reduce the mean-time-to-failure of a device by a factor of two. Also,
above 25°C, the semiconductor's total power handling capability will be
reduced by a derating factor inherent to the device.
The thermal properties of Sil-Pad products are thermal impedance,
thermal conductivity and thermal resistance. The thermal resistance
and conductivity of Sil-Pad products are inherent to the material and
do not change.Thermal resistance and thermal conductivity are
measured per ASTM D5470 and do not include the interfacial thermal
resistance effects.Thermal impedance applies to the thermal transfer in
an application and includes the effects of interfacial thermal resistance.
As the material is applied in different ways, the thermal impedance values
will vary from application to application.
• The original Sil-Pad material, Sil-Pad 400, continues to be Bergquist's
most popular material for many applications.
• Sil-Pad A1500 is chosen when greater thermal performance is
required. Sil-Pad A2000 is ideal for high performance, high reliability
applications.
Beyond these standard materials, many things can contribute to the
selection of the correct material for a particular application. Questions
regarding the amount of torque and clamping pressure are often
asked when selecting a Sil-Pad material. Here are some guidelines:
• Interfacial thermal resistance decreases as clamping pressure increases.
• The clamping pressure required to minimize interfacial thermal
resistance can vary with each type of insulator.
• Sil-Pad products with smooth surface finishes (Sil-Pad A1500, Sil-Pad
A2000, Sil-Pad K-4, Sil-Pad K-6 and Sil-Pad K-10) are less sensitive to
clamping pressure than Sil-Pads with rough surface finishes (Sil-Pad 400)
or smooth and tacky finishes (Sil-Pad 1500ST).
SIL-PAD
5.14
3.13
2.9
2.45
2.76
2.21
2.0
1.51
1.86
2.01
1.76
1.51
1.23
(0.008)
(0.010)
51
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Sil-Pad Thermally Conductive
®
Sil-Pad 400
.007 in.
Sil-Pad 400
.009 in.
Sil-Pad
800
Sil-Pad
900S
Sil-Pad
980
Sil-Pad
A1500
Sil-Pad
1100ST
Gray
Gray
Gold
Pink
Mauve
Green
Yellow
.007 ± .001
(.18 ± .025)
.009 ± .001
(.23 ± .025)
.005 ± .001
(.13 ± .025)
.009 ± .001
(.23 ± .025)
.009 ± .001
(.23 ± .025)
.010 ± .001
(.25 ± .025)
.012 ± .001
(.30 ± .025)
Thermal Performance
TO-220 Test @ 50 psi °C/W
5.14
6.61
2.45
2.90
4.52
2.21
1.51
Thermal Impedance (°C-in2/W)
1.13
1.45
0.45
0.61
1.07
0.42
0.66
Thermal Conductivity
(W/m-K nominal)
0.9
0.9
1.6
1.6
1.2
2.0
1.1
3500
4500
3000
5500
4000
6000
5000
Continuous Use
Temperature (°C)
-60 to 180
-60 to 180
-60 to 180
-60 to 180
-40 to 150
-60 to 180
-60 to 180
Construction
Silicone/
Fiberglass
Silicone/
Fiberglass
Silicone/
Fiberglass
Silicone/
Fiberglass
Silicone/
Fiberglass
Silicone/
Fiberglass
Silicone/
Fiberglass
Color
Thickness (in/mm)
Voltage Breakdown (Vac)
SIL-PAD
Sil-Pad Applications
Here, Sil-Pad 900S enhances the
thermal transfer from this FR-4
circuit board with thermal vias to
the metal base plate.
Sil-Pad is available in over 100
standard configurations for
common JEDEC package
outlines.
The circuit board above shows
punched parts interfacing screwmounted transistors to a finned
heat sink.
This application uses Sil-Pad to
isolate the mounting brackets from
the assembly frame.
A common Sil-Pad application
includes TO-220 transistors
mounted in a row on a heat rail.
These Sil-Pad applications show
clip mounting of transistors on the
left and screw mounting to an aluminum bracket on the right.
Choose a Sil-Pad that optimizes
thermal performance for your
mounting method — screw, clip,
spring, bar, etc.
Sil-Pad 980 is used extensively in
industrial applications having
excellent cut-through and abrasion
resistance.
52
Insu
tive
SPDG_Chapter2_10.06.qxp
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Insulator Selection Table
Sil-Pad
1500ST
Sil-Pad
A2000
Sil-Pad
K-4
Sil-Pad
K-6
Sil-Pad
K-10
Poly-Pad
1000
Poly-Pad
K-4
Poly-Pad
K-10
Test
Method
Blue
White
Gray
Bluegreen
Beige
Yellow
Tan
Yellow
Visual
.008 ± .001
(.20 ± .025)
.015 ± .001
(.38 ± .025)
.006 ± .001
(.15 ± .025)
.006 ± .001
(.15 ± .025)
.006 ± .001
(.15 ± .025)
.009 ± .001
(.23 ± .025)
.006 ± .001
(.15 ± .025)
.006 ± .001
(.15 ± .025)
ASTM D374
1.51
1.86
3.13
2.76
2.01
3.74
4.34
2.75
ASTM D5470
0.23
0.32
0.48
0.49
0.41
0.82
0.95
0.60
ASTM D5470
1.8
3.0
0.9
1.1
1.3
1.2
0.9
1.3
ASTM D5470
3000
4000
6000
6000
6000
2500
6000
6000
ASTM D149
-60 to 180
-60 to 200
-60 to 180
-60 to 180
-60 to 180
-20 to 150
-20 to 150
-20 to 150
—
Silicone/
Fiberglass
Silicone/
Fiberglass
Silicone/
Film
Silicone/
Film
Silicone/
Film
Polyester/
Fiberglass
Polyester/
Film
Polyester/
Film
—
Sil-Pad Comparison Made Simple!
Comparing thermally conductive interface
materials has never been easier.
The materials comparison tool can be used for
most Bergquist thermal materials, including Sil-Pad,
Hi-Flow, Gap Pad, Q-Pad, Bond-Ply and
Liqui-Bond products.
53
SIL-PAD
Simply go to the “Thermal Materials” section of the
Bergquist website (www.bergquistcompany.com)
and select “Compare Material Properties.” Then
select up to three separate products and this handy
comparison tool will automatically chart thermal
resistance values and display a material properties
table of the selected materials.
SPDG_Chapter2_10.06.qxp
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Sil-Pad 400
®
The Original Sil-Pad Material
Features and Benefits
• Thermal impedance:
1.13°C-in2/W (@50 psi)
• Original Sil-Pad material
• Excellent mechanical and physical
characteristics
• Flame retardant
TYPICAL PROPERTIES OF SIL-PAD 400
PROPERTY
Color
IMPERIAL VALUE
Gray
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.007, 0.009
0.178, 0.229
ASTM D374
Hardness (Shore A)
85
85
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%45° to Warp and Fill)
54
54
ASTM D412
3000
20
ASTM D412
Continuous Use Temp (°F) / (°C)
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
3500, 4500
3500, 4500
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.007"
6.62
5.93
5.14
4.38
3.61
TO-220 Thermal Performance (°C/W) 0.009"
8.51
7.62
6.61
5.63
4.64
Thermal Impedance (°C-in2/W) 0.007" (1)
1.82
1.42
1.13
0.82
0.54
Thermal Impedance (°C-in2/W) 0.009" (1)
2.34
1.83
1.45
1.05
0.69
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Power supplies
• Power semiconductors
• Automotive electronics
• U.L. File Number E59150
• Motor controls
• CAGE Number 55285
Configurations Available:
• Sheet form, die-cut parts and roll form; with or without pressure sensitive adhesive
Building a Part Number
Standard Options
NA
Section E
– AC – 12/250 –
Section D
0.007
Section C
–
Section B
SP400
Section A
SIL-PAD
Sil-Pad 400 has excellent mechanical and
physical characteristics. Surfaces are pliable
and allow complete surface contact with
excellent heat dissipation. Sil-Pad 400 actually
improves its thermal resistance with age.
The reinforcing fiberglass provides excellent
cut-through resistance. In addition, Sil-Pad 400
is non-toxic and resists damage from
cleaning agents.
TEST METHOD
Visual
Reinforcement Carrier
Tensile Strength (psi) / (MPa)
Sil-Pad 400 is a composite of silicone rubber
and fiberglass.The material is flame retardant
and is specially formulated for use as a
thermally conductive insulator.The primary
use for Sil-Pad 400 is to electrically isolate
power sources from heat sinks.
METRIC VALUE
Gray
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side; AC2 = Adhesive, two sides; or
00 = no adhesive
Standard thicknesses available: 0.007", 0.009"
SP400 = Sil-Pad 400 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ® U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
54
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Sil-Pad 800
®
High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance:
0.45°C-in2/W (@50 psi)
• High value material
• Smooth and highly compliant surface
• Electrically isolating
TYPICAL PROPERTIES OF SIL-PAD 800
PROPERTY
Color
IMPERIAL VALUE
Gold
METRIC VALUE
Gold
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Hardness (Shore A)
91
91
ASTM D2240
Elongation (%45° to Warp and Fill)
20
20
ASTM D412
1700
12
ASTM D412
-76 to 356
-60 to 180
—
1700
1700
ASTM D149
3000
3000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.6
1.6
ASTM D5470
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Type 3 Electrodes
25
50
100
200
3.56
3.01
2.45
2.05
1.74
Thermal Impedance (°C-in2/W) (1)
0.92
0.60
0.45
0.36
0.29
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
SIL-PAD
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
0.005
– AC – 1212 –
Standard Options
NA
Section E
–
Section D
SP800
Section C
Applications requiring low component
clamping forces include discrete semiconductors (TO-220,TO-247 and TO-218) mounted
with spring clips. Spring clips assist with
quick assembly but apply a limited amount
of force to the semiconductor.The smooth
surface texture of Sil-Pad 800 minimizes
interfacial thermal resistance and maximizes
thermal performance.
10
TO-220 Thermal Performance (°C/W)
Section B
Sil-Pad 800 material combines a smooth and
highly compliant surface characteristic with high
thermal conductivity.These features optimize the
thermal resistance properties at low pressure.
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
Section A
The Sil-Pad 800 family of thermally conductive
insulation materials is designed for applications
requiring high thermal performance and
electrical isolation.These applications also
typically have low mounting pressures for
component clamping.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.005"
SP800 = Sil-Pad 800 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
55
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Sil-Pad 900S
®
High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance:
0.61°C-in2/W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution
TYPICAL PROPERTIES OF SIL-PAD 900S
PROPERTY
Color
IMPERIAL VALUE
Pink
METRIC VALUE
Pink
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.009
0.229
ASTM D374
Hardness (Shore A)
92
92
ASTM D2240
Elongation (%45° to Warp and Fill)
20
20
ASTM D412
1300
9
ASTM D412
-76 to 356
-60 to 180
—
5500
5500
ASTM D149
8300
8300
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.6
1.6
ASTM D5470
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Type 3 Electrodes
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
50
100
200
3.41
2.90
2.53
2.32
Thermal Impedance (°C-in2/W) (1)
0.95
0.75
0.61
0.47
0.41
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
00
Standard Options
– ACME 951753 Rev B
Section E
0.009
– AC –
Section D
SP900S
–
Section C
Applications requiring low component clamping forces include discrete semiconductors
(TO-220,TO-247 and TO-218) mounted with
spring clips. Spring clips assist with quick
assembly and apply a limited amount of force
to the semiconductor.The smooth surface
texture of Sil-Pad 900S minimizes interfacial
thermal resistance and maximizes thermal
performance.
25
3.96
Section B
Sil-Pad 900S material combines a smooth
and highly compliant surface characteristic
with high thermal conductivity.These features
optimize the thermal resistance properties at
low pressures.
10
TO-220 Thermal Performance (°C/W)
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Section A
SIL-PAD
The true workhorse of the Sil-Pad product
family, Sil-Pad 900S thermally conductive
insulation material, is designed for a wide
variety of applications requiring high thermal
performance and electrical isolation.These
applications also typically have low mounting
pressures for component clamping.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.009"
SP900S = Sil-Pad 900S Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
56
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Sil-Pad 980
®
High Cut-Through Resistant, Electrically Insulating,Thermally Conductive Material
Features and Benefits
• Thermal impedance:
1.07°C-in2/W (@50 psi)
• Excellent cut-through resistance
• Use in screw-mounted applications with
cut-through problems
TYPICAL PROPERTIES OF SIL-PAD 980
PROPERTY
Color
IMPERIAL VALUE
Mauve
METRIC VALUE
Mauve
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.009
0.229
ASTM D374
Hardness (Shore A)
95
95
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
140
26
ASTM D1458
Elongation (%45° to Warp and Fill)
10
10
ASTM D412
Cut-Through (lbs) / (kg)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
750
340
ASTM D412
-40 to 302
-40 to 150
—
ASTM D149
4000
4000
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
1.2
1.2
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
25
50
100
200
5.48
5.07
4.52
4.04
3.56
Thermal Impedance (°C-in2/W) (1)
1.51
1.22
1.07
0.89
0.53
Typical Applications Include:
• Silicone-sensitive assemblies
• Telecommunications
• Automotive electronics
Configurations Available:
Building a Part Number
– AC –
00
Standard Options
– ACME 951753 Rev B
Section E
0.009
Section D
–
Section C
SP980
SIL-PAD
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Section B
With a field-proven history of reliability,
Sil-Pad 980 is Bergquist's best material for
cut-through resistance in screw-mounted and
other applications with cut-through problems.
10
TO-220 Thermal Performance (°C/W)
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Section A
In addition to excellent heat transfer and
dielectric properties, Sil-Pad 980 is specially
formulated for high resistance to crushing and
cut-through typically found in high-pressure
applications where surface imperfections such
as burrs and dents are inherently common
(e.g. heavily-machined metal surfaces
manufactured from extrusions or castings).
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.009"
SP980 = Sil-Pad 980 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
57
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Sil-Pad 1100ST
®
Affordable, Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material
Features and Benefits
• Inherent tack on both sides for exceptional
thermal performance and easy placement
• Re-positionable for higher utilization, ease of
use and assembly error reduction
TYPICAL PROPERTIES OF SIL-PAD 1100ST
PROPERTY
Color
IMPERIAL VALUE
Yellow
METRIC VALUE
Yellow
TEST METHOD
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.012
0.305
ASTM D374
Inherent Surface Tack (1or 2 sided)
2
2
—
• Lined on both sides for ease of handling
prior to placement in high volume
assemblies
Hardness (Shore 00) (1)
85
85
ASTM D2240
Breaking Strength (lb/inch) / (kN/m)
2.6
0.5
ASTM D1458
Elongation (% - 45º to Warp and Fill)
16
16
ASTM D412
• Exhibits exceptional thermal performance
even at a low mounting pressure
Tensile Strength (psi) / (MPa)
220
1.5
ASTM D412
-76 to 356
-60 to 180
—
• Fiberglass reinforced
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
5000
5000
ASTM D149
• Valve alternative to Sil-Pad 1500ST
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
10
10
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.1
1.1
ASTM D5470
Continuous Use Temp (°F) / (°C)
THERMAL PERFORMANCE
VS.
10
10
PRESSURE
Pressure (psi)
TO-220 Thermal Performance (ºC/W)
10
2.72
25
2.71
50
2.68
100
2.62
200
2.23
Thermal Impedance (ºC-in2/W) (2)
0.75
0.71
0.66
0.61
0.57
SIL-PAD
1) Thirty second delay value Shore 00 hardness scale.
2) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Sil-Pad 1100ST (Soft Tack) is a fiberglassreinforced thermal interface material featuring
inherent tack on both sides.The material
exhibits excellent thermal performance at
low mounting pressures.The material is supplied on two liners for exceptionally easy
handling prior to auto-placement in high-volume assemblies.The material is ideal for
placement between an electronic power
device and its heat sink.
Typical Applications Include:
• Automotive ECMs
• Motor controls
• Power supplies
• Between an electronic power device and its heat sink
Configurations Available:
• Sheet form, die-cut parts and roll form
• Top and bottom liners
Building a Part Number
Standard Options
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
58
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Sil-Pad A1500
®
Electrically Insulating,Thermally Conductive Elastomeric Material
Features and Benefits
• Thermal impedance:
0.42°C-in2/W (@50 psi)
• Elastomeric compound coated on
both sides
TYPICAL PROPERTIES OF SIL-PAD A1500
PROPERTY
Color
IMPERIAL VALUE
Green
METRIC VALUE
Green
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010
0.254
ASTM D374
Hardness (Shore A)
80
80
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
65
12
ASTM D1458
Elongation (% - 45° to Warp and Fill)
40
40
ASTM D412
-76 to 356
-60 to 180
—
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
ASTM D149
7.0
7.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
3.03
2.62
2.21
1.92
1.78
Thermal Impedance (°C-in2/W) (1)
0.59
0.50
0.42
0.34
0.31
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
SIL-PAD
• Sheet form, die-cut parts, and roll form
• With or without pressure sensitive adhesive
Building a Part Number
– AC – 12/250 –
Standard Options
NA
Section E
0.010
Section D
–
Section C
SPA1500
Section B
Sil-Pad A1500 performs well under clamping
pressure up to 200 psi and is an excellent
choice for high performance applications
requiring electrical isolation and cut-through
resistance.
6000
Dielectric Constant (1000 Hz)
Section A
Bergquist Sil-Pad A1500 is a silicone-based,
thermally conductive and electrically insulating
material. It consists of a cured silicone
elastomeric compound coated on both sides
of a fiberglass reinforcement layer.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.010"
SPA1500 = Sil-Pad A1500 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
59
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Sil-Pad 1500ST
®
Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material
Features and Benefits
• Thermal impedance:
0.23°C-in2/W (@50 psi)
• Naturally tacky on both sides
• Pad is repositionable
• Excellent thermal performance
• Auto-placement and dispensable
TYPICAL PROPERTIES OF SIL-PAD 1500ST
PROPERTY
Color
IMPERIAL VALUE
Blue
METRIC VALUE
Blue
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.008
0.203
ASTM D374
Hardness (Shore 00)
75
75
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
1.9
0.34
ASTM D1458
Elongation (% - 45° to Warp and Fill)
22
22
ASTM D412
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
238
1.6
ASTM D412
-76 to 356
-60 to 180
—
ASTM D149
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Bergquist Sil-Pad 1500ST (Soft Tack) is a fiberglass reinforced thermal interface material
that is naturally tacky on both sides.
Sil-Pad 1500ST exhibits superior thermal
performance when compared to the
competitors’ thermal interface materials.
Sil-Pad 1500ST is supplied in sheet or roll
form for exceptional auto-dispensing and
auto-placement in high volume assemblies.
Sil-Pad 1500ST is intended for placement
between an electronic power device and its
heat sink.
TEST METHOD
Visual
3000
3000
Dielectric Constant (1000 Hz)
6.1
6.1
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
1.8
1.8
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
1.54
1.52
1.51
1.49
1.46
Thermal Impedance (°C-in2/W) (1)
0.37
0.28
0.23
0.21
0.20
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
Configurations Available:
SIL-PAD
• Sheet form, die-cut parts and slit-to-width roll form
• Also available in 12 mil thickness
Building a Part Number
Standard Options
NA
Section E
– 1012 –
Section D
– 02
Section C
0.008
Section B
Section A
SP1500ST
–
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls (8 mil
only), or 00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.008", 0.012"
SP1500ST = Sil-Pad 1500ST Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
60
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Sil-Pad 1750
®
For High Humidity, High Dielectric (U.L. 94 1950, IEC 950) Requirements
Features and Benefits
• Thermal impedance:
0.53°C-in2/W (@50 psi)
• Excellent dielectric strength retention after
humidity exposure
• Elastomeric pad
TYPICAL PROPERTIES OF SIL-PAD 1750
PROPERTY
Color
IMPERIAL VALUE
Green
METRIC VALUE
Green
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.012
0.305
ASTM D374
Hardness (Shore A)
85
85
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
65
12
ASTM D1458
Elongation (% - 45° to Warp and Fill)
23
23
ASTM D412
1500
10
ASTM D412
-76 to 356
-60 to 180
—
ASTM D149
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
4.0
4.0
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL
Thermal Conductivity (W/m-K)
2.2
2.2
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
3.11
2.87
2.42
2.08
1.90
Thermal Impedance (°C-in2/W) (1)
0.86
0.68
0.53
0.39
0.28
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• High-voltage power supplies
• Motor controls
• High “hi-pot” requirements
Configurations Available:
Building a Part Number
– AC – 1212 –
Standard Options
NA
Section E
0.012
Section D
–
Section C
SP1750
SIL-PAD
• Sheet form and die-cut parts
• With or without pressure sensitive adhesive
Section B
Sil-Pad 1750 relies on processes that minimize
the effect of high humidity on the electrical
properties of finished material.Therefore,
exposure to humid environments during
assembly, or over long-term operating
conditions, will not severely affect the ability
of the material to perform.
6000
Dielectric Constant (1000 Hz)
Section A
The combination of high thermal conductivity
and excellent dielectric strength retention
after humidity exposure is formulated into
the Sil-Pad 1750 elastomeric pad.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, or 00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.012"
SP1750 = Sil-Pad 1750 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
61
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Sil-Pad 2000
®
Higher Performance, High Reliability Insulator
Features and Benefits
TYPICAL PROPERTIES OF SIL-PAD 2000
• Thermal impedance:
0.33°C-in2/W (@50 psi)
• Optimal heat transfer
• High thermal conductivity: 3.5 W/m-K
PROPERTY
Color
IMPERIAL VALUE
White
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.015
0.254 to 0.381
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
4000
4000
ASTM D149
Dielectric Constant (1000 Hz)
4.0
4.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
3.5
3.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
0.07
0.26
0.03
0.10
1.37
Thermal Impedance (°C-in2/W) (1)
0.57
0.43
0.33
0.25
0.20
• Power supplies
• Power semiconductors
• CAGE Number 55285
• Aerospace
• Motor controls
• U.L. File Number E59150
• Military Electronics
• Avionics
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
–
0.010
– AC –
00
–
NA
Section E
24 hrs. @ 175°C
No Post Cure
200
1.65
Section D
%CVCM
(0.1% Max.
Acceptable)
100
2.02
Section C
% TML
(1.0% Max.
Acceptable)
50
2.32
Typical Applications Include:
SP2000
Post Cure
Conditions
25
2.61
Section B
Outgassing Data for
Spacecraft Materials
10
TO-220 Thermal Performance (°C/W)
1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
Section A
SIL-PAD
Sil-Pad 2000 is a silicone elastomer formulated
to maximize the thermal and dielectric
performance of the filler/binder matrix.The
result is a grease-free, conformable material
capable of meeting or exceeding the thermal
and electrical requirements of high-reliability
electronic packaging applications.
TEST METHOD
Visual
Reinforcement Carrier
Continuous Use Temp (°F) / (°C)
Sil-Pad 2000 is a high performance, thermally
conductive insulator designed for demanding
military/aerospace and commercial applications. In these applications, Sil-Pad 2000
complies with military standards.
METRIC VALUE
White
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, or 00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.010", 0.015"
SP2000 = Sil-Pad 2000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Building a Part Number
Standard Options
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
62
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Sil-Pad A2000
®
Higher Performance, High Reliability Insulator
Features and Benefits
• Thermal impedance:
0.32°C-in2/W (@50 psi)
• Optimal heat transfer
• High thermal conductivity: 3.0 W/m-K
TYPICAL PROPERTIES OF SIL-PAD A2000
PROPERTY
Color
IMPERIAL VALUE
White
METRIC VALUE
White
TEST METHOD
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.015 to 0.020
0.381 to 0.508
ASTM D374
90
90
ASTM D2240
Hardness (Shore A)
Heat Capacity (J/g-K)
Continuous Use Temp (°F) / (°C)
1.0
1.0
ASTM E1269
-76 to 392
-60 to 200
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
4000
4000
ASTM D149
Dielectric Constant (1000 Hz)
7.0
7.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
3.0
3.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
25
50
100
200
2.05
1.94
1.86
1.79
1.72
Thermal Impedance (°C-in2/W) 0.015" (1)
0.53
0.40
0.32
0.28
0.26
Typical Applications Include:
• Motor drive controls
• Avionics
• High-voltage power supplies
• Power transistor / heat sink interface
Configurations Available:
Building a Part Number
– 00
– 1012 –
Standard Options
NA
Section E
0.015
Section D
–
Section C
SPA2000
SIL-PAD
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Section B
This thermally conductive silicone elastomer is
formulated to maximize the thermal and
dielectric performance of the filler/binder
matrix.The result is a grease-free, conformable material capable of meeting or exceeding
the thermal and electrical requirements of high
reliability electronic packaging applications.
10
TO-220 Thermal Performance (°C/W) 0.015"
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Section A
Sil-Pad A2000 is a conformable elastomer
with very high thermal conductivity that acts
as a thermal interface between electrical
components and heat sinks. Sil-Pad A2000 is
for applications where optimal heat transfer is
a requirement.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1012 = 10" x 12" sheets, 10/250 = 10" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.015", 0.020"
SPA2000 = Sil-Pad A2000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
63
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Sil-Pad K-4
®
The Original Kapton®-Based Insulator
Features and Benefits
• Thermal impedance:
0.48°C-in2/W (@50 psi)
• Withstands high voltages
• High dielectric strength
• Very durable
TYPICAL PROPERTIES OF SIL-PAD K-4
PROPERTY
Color
IMPERIAL VALUE
Gray
METRIC VALUE
Gray
Reinforcement Carrier
Kapton
Kapton
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%)
40
40
ASTM D412
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
5000
34
ASTM D412
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
6000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
VTM-O
VTM-O
U.L.94
0.9
0.9
ASTM D5470
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
Sil-Pad K-4 uses a specially developed film
which has high thermal conductivity, high
dielectric strength and is very durable. Sil-Pad
K-4 combines the thermal transfer properties
of well-known Sil-Pad rubber with the physical
properties of a film.
Sil-Pad K-4 is a durable insulator that withstands high voltages and requires no thermal
grease to transfer heat. Sil-Pad K-4 is available
in customized shapes and sizes.
TEST METHOD
Visual
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
3.66
3.43
3.13
2.74
2.42
Thermal Impedance (°C-in2/W) (1)
1.07
0.68
0.48
0.42
0.38
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Power supplies
• Power semiconductors
• Motor controls
• CAGE Number 55285
Configurations Available:
SIL-PAD
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
– 12/250 –
Standard Options
NA
Section E
– 00
Section D
0.006
Section C
–
Section B
Section A
SPK4
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.006"
SPK4 = Sil-Pad K4 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others.
Kapton® is a registered trademark of DuPont.
64
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Sil-Pad K-6
®
The Medium Performance Kapton®-Based Insulator
Features and Benefits
• Thermal impedance:
0.49°C-in2/W (@50 psi)
• Physically strong dielectric barrier against
cut-through
• Medium performance film
TYPICAL PROPERTIES OF SIL-PAD K-6
PROPERTY
Color
IMPERIAL VALUE
Bluegreen
METRIC VALUE
Bluegreen
TEST METHOD
Visual
Reinforcement Carrier
Kapton
Kapton
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%)
40
40
ASTM D412
5000
34
ASTM D412
-76 to 356
-60 to 180
—
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
6000
ASTM D149
Dielectric Constant (1000 Hz)
4.0
4.0
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
VTM-O
VTM-O
U.L.94
1.1
1.1
ASTM D5470
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
3.24
3.03
2.76
2.45
2.24
Thermal Impedance (°C-in2/W) (1)
0.82
0.62
0.49
0.41
0.36
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Power supplies
• Power semiconductors
• Motor controls
• CAGE Number 55285
Configurations Available:
Building a Part Number
Standard Options
NA
Section E
– AC – 12/250 –
Section D
0.006
Section C
–
Section B
SPK6
SIL-PAD
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Section A
Sil-Pad K-6 is a medium performance, filmbased thermally conductive insulator.The film
is coated with a silicone elastomer to deliver
high performance and provide a continuous,
physically strong dielectric barrier against
“cut-through” and resultant assembly failures.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.006"
SPK6 = Sil-Pad K6 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Kapton® is a registered trademark of DuPont.
65
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Sil-Pad K-10
®
The High Performance Kapton®-Based Insulator
Features and Benefits
• Thermal impedance:
0.41°C-in2/W (@50 psi)
• Tough dielectric barrier against cut-through
• High performance film
• Designed to replace ceramic insulators
TYPICAL PROPERTIES OF SIL-PAD K-10
PROPERTY
Color
IMPERIAL VALUE
Beige
METRIC VALUE
Beige
Reinforcement Carrier
Kapton
Kapton
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%)
40
40
ASTM D412
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
5000
34
ASTM D412
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
6000
ASTM D149
Dielectric Constant (1000 Hz)
3.7
3.7
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
VTM-O
VTM-O
U.L.94
1.3
1.3
ASTM D5470
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
Sil-Pad K-10 is a high performance insulator. It
combines special film with a filled silicone rubber.
The result is a product with good cut-through
properties and excellent thermal performance.
Sil-Pad K-10 is designed to replace ceramic
insulators such as Beryllium Oxide, Boron
Nitride and Alumina. Ceramic insulators are
expensive and they break easily. Sil-Pad K-10
eliminates breakage and costs much less
than ceramics.
TEST METHOD
Visual
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
2.35
2.19
2.01
1.87
1.76
Thermal Impedance (°C-in2/W) (1)
0.86
0.56
0.41
0.29
0.24
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Power supplies
• Power semiconductors
• Motor controls
• CAGE Number 55285
Configurations Available:
SIL-PAD
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
Standard Options
NA
Section E
– AC – 1212 –
Section D
0.006
Section C
–
Section B
Section A
SPK10
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.006"
SPK10 = Sil-Pad K10 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others.
Kapton® is a registered trademark of DuPont.
66
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Q-Pad II
®
Foil-Format Grease Replacement for Maximum Heat Transfer
Features and Benefits
• Thermal impedance:
0.22°C-in2/W (@50 psi)
• Maximum heat transfer
• Aluminum foil coated both sides
• Designed to replace thermal grease
TYPICAL PROPERTIES OF Q-PAD II
PROPERTY
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
Reinforcement Carrier
Aluminum
Aluminum
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
93
93
ASTM D2240
-76 to 356
-60 to 180
—
Non-Insulating
Non-Insulating
ASTM D149
Dielectric Constant (1000 Hz)
NA
NA
ASTM D150
Volume Resistivity (Ohm-meter)
10 2
10 2
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
2.5
2.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
Q-Pad II is a composite of aluminum foil coated
on both sides with thermally / electrically
conductive Sil-Pad rubber.The material is
designed for those applications in which maximum heat transfer is needed and electrical
isolation is not required. Q-Pad II is the ideal
thermal interface material to replace messy
thermal grease compounds.
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
2.44
1.73
1.23
1.05
0.92
Thermal Impedance (°C-in2/W) (1)
0.52
0.30
0.22
0.15
0.12
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include:
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
SIL-PAD
Q-Pad II eliminates problems associated with
grease such as contamination of reflow solder
or cleaning operations. Unlike grease, Q-Pad II
can be used prior to these operations. Q-Pad II
also eliminates dust collection which can cause
possible surface shorting or heat buildup.
TEST METHOD
Visual
Standard Options
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
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Q-Pad 3
®
Glass-Reinforced Grease Replacement Thermal Interface
Features and Benefits
• Thermal impedance:
0.35°C-in2/W (@50 psi)
• Eliminates processing constraints typically
associated with grease
• Conforms to surface textures
• Easy handling
• May be installed prior to soldering and
cleaning without worry
TYPICAL PROPERTIES OF Q-PAD 3
PROPERTY
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.005
0.127
ASTM D374
Hardness (Shore A)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
TEST METHOD
Visual
86
86
ASTM D2240
-76 to 356
-60 to 180
—
Non-Insulating
Non-Insulating
ASTM D149
Dielectric Constant (1000 Hz)
NA
NA
ASTM D150
Volume Resistivity (Ohm-meter)
10 2
10 2
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
2.26
1.99
1.76
1.53
1.30
Thermal Impedance (°C-in2/W) (1)
0.65
0.48
0.35
0.24
0.16
Bergquist Q-Pad 3 eliminates problems
associated with thermal grease such as contamination of electronic assemblies and reflow
solder baths. Q-Pad 3 may be installed prior
to soldering and cleaning without worry.When
clamped between two surfaces, the elastomer
conforms to surface textures thereby creating
an air-free interface between heat-generating
components and heat sinks.
Typical Applications Include:
Fiberglass reinforcement enables Q-Pad 3 to
withstand processing stresses without losing
physical integrity. It also provides ease of
handling during application.
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
Configurations Available:
Building a Part Number
Standard Options
NA
Section E
– AC – 12/250 –
Section D
0.005
Section C
–
Section B
Q3
Section A
SIL-PAD
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.005"
Q3 = Q-Pad 3 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
68
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Poly-Pad 400
®
Polyester-Based,Thermally Conductive Insulation Material
Features and Benefits
• Thermal impedance:
1.13°C-in2/W (@50 psi)
• Polyester based
• For applications requiring conformal
coatings
• Designed for silicone-sensitive standard
applications
TYPICAL PROPERTIES OF POLY-PAD 400
PROPERTY
Color
IMPERIAL VALUE
Tan
METRIC VALUE
Tan
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.009
0.229
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch)/(kN/m)
100
18
ASTM D1458
Elongation(% - 45° to Warp and Fill)
10
10
ASTM D412
7000
48
ASTM D412
Continuous Use Temp (°F) / (°C)
-4 to 302
-20 to 150
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Tensile Strength (psi) / (MPa)
2500
2500
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
Flame Rating
V-O
V-O
U.L. 94
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
25
50
100
200
5.85
5.61
5.13
4.59
4.12
Thermal Impedance (°C-in2/W) (1)
1.62
1.35
1.13
086
0.61
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
• We produce thousands of specials.Tooling charges vary depending on tolerances and the
complexity of the part.
Building a Part Number
– 1212 –
Standard Options
NA
Section E
– 00
Section D
0.009
Section C
–
Section B
PP400
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.009"
PP400 = Poly-Pad 400 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
69
SIL-PAD
Polyester-based, thermally conductive insulators
from Bergquist provide a complete family of
materials for silicone-sensitive applications.
Poly-Pads are ideally suited for applications
requiring conformal coatings or applications
where silicone contamination is a concern
(telecomm and certain aerospace applications).
Poly-Pads are constructed with ceramic-filled
polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad
family offers a complete range of performance
characteristics to match individual applications.
10
TO-220 Thermal Performance (°C/W)
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Section A
Poly-Pad 400 is a fiberglass-reinforced
insulator coated with a filled polyester resin.
Poly-Pad 400 is economical and designed for
most standard applications.
TEST METHOD
Visual
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Poly-Pad 1000
®
Polyester-Based,Thermally Conductive Insulation Material
Features and Benefits
• Thermal impedance:
0.82°C-in2/W (@50 psi)
• Polyester based
• For applications requiring non-silicone
conformal coatings
• Designed for silicone-sensitive applications
requiring high performance
TYPICAL PROPERTIES OF POLY-PAD 1000
PROPERTY
Color
IMPERIAL VALUE
Yellow
METRIC VALUE
Yellow
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.009
0.229
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
100
18
ASTM D1458
Elongation (%)
10
10
ASTM D412
7000
48
ASTM D412
-4 to 302
-20 to 150
—
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
2500
2500
ASTM D149
Dielectric Constant (1000 Hz)
4.5
4.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
THERMAL
Thermal Conductivity (W/m-K)
1.2
1.2
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
25
50
100
200
4.70
4.25
3.74
3.27
2.89
Thermal Impedance (°C-in2/W) (1)
1.30
1.02
0.82
0.61
0.43
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
– 00
– 1212 –
Standard Options
NA
Section E
0.009
Section D
–
Section C
PP1000
Section B
Polyester-based, thermally conductive insulators
from Bergquist provide a complete family of
materials for silicone-sensitive applications.
Poly-Pads are ideally suited for applications
requiring conformal coatings or applications
where silicone contamination is a concern
(telecomm and certain aerospace applications).
Poly-Pads are constructed with ceramic-filled
polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad
family offers a complete range of performance
characteristics to match individual applications.
10
TO-220 Thermal Performance (°C/W)
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Section A
SIL-PAD
Poly-Pad 1000 is a fiberglass-reinforced
insulator coated with a filled polyester resin.
The material offers superior thermal resistance
for high performance applications.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.009"
PP1000 = Poly-Pad 1000 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
70
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Poly-Pad K-4
®
Polyester-Based,Thermally Conductive Insulation Material
Features and Benefits
• Thermal impedance:
0.95°C-in2/W (@50 psi)
• Polyester based
• For applications requiring non-silicone
conformal coatings
• Designed for silicone-sensitive applications
• Excellent dielectric and physical strength
TYPICAL PROPERTIES OF POLY-PAD K-4
PROPERTY
Color
IMPERIAL VALUE
Tan
METRIC VALUE
Tan
TEST METHOD
Visual
Reinforcement Carrier
Kapton
Kapton
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%)
40
40
ASTM D412
5000
34
ASTM D412
-4 to 302
-20 to 150
—
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
6000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
Flame Rating
V-O
V-O
U.L.94
0.9
0.9
ASTM D5470
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
50
100
200
5.04
4.34
3.69
3.12
Thermal Impedance (°C-in2/W) (1)
1.55
1.21
0.95
0.70
0.46
Typical Applications Include:
• Power supplies
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
– 12/250 –
Standard Options
NA
Section E
– 00
Section D
0.006
Section C
–
Section B
PPK4
SIL-PAD
Polyester-based, thermally conductive insulators
from Bergquist provide a complete family of
materials for silicone-sensitive applications.
Poly-Pads are ideally suited for applications
requiring conformal coatings or applications
where silicone contamination is a concern
(telecomm and certain aerospace applications).
Poly-Pads are constructed with ceramic-filled
polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad
family offers a complete range of performance
characteristics to match individual applications.
25
5.64
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Section A
Poly-Pad K-4 is a composite of film coated with
a polyester resin.The material is an economical
insulator and the film carrier provides excellent
dielectric and physical strength.
10
TO-220 Thermal Performance (°C/W)
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.006"
PPK4 = Poly-Pad K-4 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Kapton® is a registered trademark of DuPont.
71
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Poly-Pad K-10
®
Polyester-Based,Thermally Conductive Insulation Material
Features and Benefits
• Thermal impedance:
0.60°C-in2/W (@50 psi)
• Polyester based
• For applications requiring non-silicone
conformal coatings
• Designed for silicone-sensitive applications
• Excellent dielectric strength and
thermal performance
TYPICAL PROPERTIES OF POLY-PAD K-10
PROPERTY
Color
IMPERIAL VALUE
Yellow
METRIC VALUE
Yellow
Reinforcement Carrier
Kapton
Kapton
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
90
90
ASTM D2240
Breaking Strength (lbs/inch) / (kN/m)
30
5
ASTM D1458
Elongation (%)
40
40
ASTM D412
Tensile Strength (psi) / (MPa)
Continuous Use Temp (°F) / (°C)
5000
34
ASTM D412
-4 to 302
-20 to 150
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
6000
6000
ASTM D149
Dielectric Constant (1000 Hz)
3.7
3.7
ASTM D150
Volume Resistivity (Ohm-meter)
1012
1012
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
1.3
1.3
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
25
50
100
200
3.76
3.35
2.75
2.30
2.03
Thermal Impedance (°C-in2/W) (1)
1.04
0.80
0.60
0.43
0.30
Typical Applications Include:
• Power supplies
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
Building a Part Number
– AC – 1212 –
Standard Options
NA
Section E
0.006
Section D
–
Section C
PPK10
Section B
Polyester-based, thermally conductive insulators
from Bergquist provide a complete family of
materials for silicone-sensitive applications.
Poly-Pads are ideally suited for applications
requiring conformal coatings or applications
where silicone contamination is a concern
(telecomm and certain aerospace applications).
Poly-Pads are constructed with ceramic-filled
polyester resins coating either side of a fiberglass carrier or a film carrier.The Poly-Pad
family offers a complete range of performance
characteristics to match individual applications.
10
TO-220 Thermal Performance (°C/W)
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
Section A
SIL-PAD
Poly-Pad K-10 is a composite of film coated
with a polyester resin.The material offers
superior thermal performance for your most
critical applications with a thermal resistance
of 0.2°C-in2/W as well as excellent dielectric
strength.
TEST METHOD
Visual
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
AC = Adhesive, one side
00 = No adhesive
Standard thicknesses available: 0.006"
PPK10 = Poly-Pad K-10 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Kapton® is a registered trademark of DuPont.
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Sil-Pad Tubes
®
Silicone-Based,Thermally Conductive Tubes
Features and Benefits
• Thermal conductivity:
SPT 400 – 0.9 W/m-K
SPT 1000 – 1.2 W/m-K
• For clip-mounted plastic power packages
TYPICAL PROPERTIES OF SIL-PAD TUBE 400
PROPERTY
Color
IMPERIAL VALUE
Gray/Green
METRIC VALUE
Gray/Green
0.012
0.30
ASTM D374
80
80
ASTM D2240
Thickness / Wall (inch) / (mm)
Hardness (Shore A)
Breaking Strength (lbs/inch) / (kN/m)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
TEST METHOD
Visual
6
1
ASTM D1458
-76 to 356
-60 to 180
—
5000
5000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
Thermal Impedance (°C-in2/W) (1)
0.6
0.6
ASTM D5470
TYPICAL PROPERTIES OF SIL-PAD TUBE 1000
SPT 400 and SPT 1000 (Sil-Pad Tubes) provide
thermally conductive insulation for clipmounted plastic power packages. Sil-Pad
Tubes are made of silicone rubber with high
thermal conductivity.
Sil-Pad Tube 1000 is best suited for higher
thermal performance. Sil-Pad Tube 400 is ideal
for applications requiring average thermal
conductivity and economy.
Sil-Pad Tube 400 and Sil-Pad Tube 1000 are
designed to meet VDE, U.L. and TUV agency
requirements.
• Clip-mounted power semiconductors
• TO-220,TO-218,TO-247 and TO-3P
Configurations Available:
• TO-220,TO-218,TO-247 and TO-3P
Special thickness and diameters can also be
ordered. Please contact Bergquist Sales.
IMPERIAL VALUE
Brown
METRIC VALUE
Brown
0.012
0.30
ASTM D374
80
80
ASTM D2240
Thickness / Wall (inch) / (mm)
Hardness (Shore A)
TEST METHOD
Visual
Breaking Strength (lbs/inch) / (kN/m)
6
1
ASTM D1458
Continuous Use Temp (°F) / (°C)
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
5000
5000
ASTM D149
Dielectric Constant (1000 Hz)
4.5
4.5
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
1.2
1.2
ASTM D5470
Thermal Impedance (°C-in2/W) (1)
0.4
0.4
ASTM D5470
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
SIL-PAD
Typical Applications
Include:
PROPERTY
Color
Standard Dimensions
A = Wall Thickness: .30 mm (.012") + .10 mm/ -0.0 mm (+.004" / -0.0")
B = Inner Diameter: 11 mm (.433") or 13.5 mm (.532") ± 1.0 mm (± .039")
C = Length:
25 mm (.985") or 30 mm (1.18") +3.18 mm / -0.0 mm (+ .125" / - 0.0")
Special lengths are available. For more information, contact a Bergquist Sales Representative.
B
Ordering Procedure:
Sample:
SPT 400 ___ - ___ - ___
“A” – “B” – “C”
C
A
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125;
4,602,678; 4,685,987; 4,842,911 and others.
73
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Sil-Pad Shield
®
Bonded Laminate of Sil-Pad with a Copper Shield
Features and Benefits
• Bonded laminate
• Electrically isolating
• Copper shield between layers of Sil-Pad
• Pre-tinned 60/40 solder point for easy
grounding
PROBLEM:
Radio Frequency Interference (RFI) is produced by heat sink current.The capacitance
between a TO-3 encapsulated transistor and
its heat sink is typically 100pf when a mica or
other insulating washer is used. A power
supply constructed with a standard insulator
and a grounded heat sink can be expected to
produce about 10 times more interference
than is permitted.
SIL-PAD
SOLUTION:
1.The use of chokes, filters and LC networks
which have to be designed into the circuitry.
OR
2. Constructing a shield between the transistor
and its heat sink by replacing the mica insulator with a Sil-Pad Shield (see illustration).
74
TYPICAL PROPERTIES OF SIL-PAD SHIELD
PROPERTY
Thickness / Total (inches)
Shield / Copper Thickness (inches)
Approx.Thermal Resistance (TO-3) (°C/W)
Min. Breakdown Voltage Between Device and Copper (Volts)
Capacitance @ 1000 Hz and 5 Volts (pF)
Dissipation Factor @ 1000 Hz and 5 Volts (Power Factor)
Dielectric Constant @ 1000 Hz and 5 Volts
Continuous Use Temp. (°C)
Recommended Torque (TO-3) (inch-pounds)
VALUE
0.019
0.0015
0.85 - 1.0
4500
50
0.0155
5.5
-60 to 180
6-8
TEST METHOD
***
***
***
ASTM D149
***
ASTM D150
ASTM D150
***
***
Typical Applications Include:
• Switch mode power supplies
• EMI / RFI shield between PCB’s
Configurations Available:
Sil-Pad Shield is available in many custom configurations to meet special requirements.Tooling
charges vary depending on tolerances and complexity of the part.
Sil-Pad Shield is a laminate of copper with Sil-Pad thermally conductive insulators. Sil-Pad Shield
provides:
• Shielding effectiveness of 50dB or higher
• Good thermal transfer
• Reduced labor costs due to the elimination of having to apply thermal grease
Sil-Pad ®: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
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Bond-Ply and Liqui-Bond Adhesives
®
®
Bond-Ply Adhesive Tapes
Liqui-Bond Liquid Adhesives
Available in a pressure sensitive adhesive or laminating format, the
Bond-Ply family of materials are thermally conductive and electrically
isolating. Bond-Ply facilitates the decoupling of bonded materials with
mismatched thermal coefficients of expansion.
Bergquist Liqui-Bond liquid adhesives are high performance, thermally
conductive, liquid gap filling materials.These soft, form-in-place elastomers are ideal for coupling “hot” electronic components mounted
on PC boards with an adjacent metal case or heat sink.
Typical Bond-Ply Applications
Typical Liqui-Bond Applications
Features
Features
• High performance, thermally conductive, pressure sensitive adhesive
• Excellent low and high temperature mechanical and chemical stability
• Material immediately bonds to the target surface
Benefits
• Bond strength increases over time when repeatedly exposed to
high continuous-use temperatures
Before cure, Liqui-Bond flows under pressure like a grease. After
cure, it bonds the components, eliminating the need for mechanical
fasteners. Additional benefits include:
Benefits
• Provide an excellent dielectric barrier
• Excellent wet-out to most types of component surfaces
including plastic
• Bond-Ply 400 is unreinforced to increase conformance and
wet-out on low surface energy materials
• Low modulus provides stress-absorbing flexibility
• Supplied as a one-part material with an elevated temperature
curing system
• Offers infinite thickness with little or no stress during displacement
• Eliminates need for specific pad thickness and die-cut shapes
for individual applications
• Eliminates need for screws, clip mounts or fasteners
Options
Options
• Supplied in sheet, die-cut, roll and tabulated forms
The growing Liqui-Bond family offers a variety of choices to meet the
customer’s performance, handling and process needs.
Applications
• Custom coated thickness
Liqui-Bond products are intended for use in thermal interface
applications where a structural bond is a requirement.This material
is formulated for high cohesive and adhesive strength and cures to
a low modulus.Typical applications include:
Applications
• Attach a heat sink to a graphics processing unit
• Attach a heat spreader to a motor control PCB
• Attach a heat sink to a power converter PCB
• Attach a heat sink to a drive processor
• Automotive electronics
• Telecommunications
• Computer and peripherals
• Between any heat-generating semiconductor and a heat sink
75
BOND-PLY
• Available in thickness range of 3 to 11 mil
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Frequently Asked Questions
Q: What is the primary difference between the
A:
Bond-Ply 660B and Bond-Ply 100 products?
Bond-Ply 660B utilizes a dielectric film, replacing the fiberglass
inherent in our Bond-Ply 100 series products.The addition of
the film allows for high dielectric performance without additional
product thickness.
Q: How should I size my interface dimensions for Bond-Ply?
A: Bond-Ply product testing has been completed on various interface
materials.These tests have demonstrated that improper surface
wet-out is the single largest variable associated with maximizing
bond strength and heat transfer. Bergquist has found that reducing
the size of the interface pad to roughly 80% of the total interface
area actually improves the overall bonding performance while
offering significant improvements in total package cooling.
Bergquist offers three standard thicknesses for Bond-Ply 100
allowing each application to be optimized in three dimensions.
Q: What application pressure is required to optimize
bond strength with Bond-Ply?
A: The answer to this varies from application to application, depending upon surface roughness and flatness. In general, pressure, temperature, and time are the primary variables associated with increasing surface contact or wet-out. Increasing the application time
and/or pressure will significantly increase surface contact. Natural
wet-out will continue to occur with Bond-Ply materials.This
inherent action often increases bond strength by more than 2x
within the first 24 hours.
Q: Will Bond-Ply adhere to plastic packages?
A: Adhesive performance on plastic packages is primarily a function
of surface contact or wet-out. If surface contaminants such as
plastic mold release oils are present, this will prevent contact
and/or bonding to the surface. Make sure all surfaces are clean
and dry prior to applying Bond-Ply materials.
Q: How are one-part Liqui-Bond adhesives cured?
A: Liqui-Bond SA 2000 and Liqui-Bond SA 1000 require heat to
cure and bond in theapplication. Altering the bond line temperature and time can control the cure schedule.The components
should not be moved during the curing process.
Bond-Ply Comparison Data
BOND-PLY
®
76
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Bond-Ply 100
®
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape
Features and Benefits
Fiberglass
Fiberglass
—
0.005, 0.008, 0.011
0.127, 0.203, 0.279
ASTM D374
Temp. Resistance, 30 sec. (°F) / (°C)
392
200
—
Elongation (%45° to Warp & Fill)
70
70
ASTM D412
Tensile Strength (psi) / (MPa)
900
6
ASTM D412
CTE (ppm)
325
325
ASTM D3386
Glass Transition (°F) / (°C)
-22
-30
ASTM 1356
-22 to 248
-30 to 120
—
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
Static Dead Weight Shear (°F) / (°C)
302
150
PSTC#7
ELECTRICAL
Dielectric Breakdown Voltage - 0.005" (Vac)
VALUE
3000
TEST METHOD
ASTM D149
Dielectric Breakdown Voltage - 0.008" (Vac)
6000
ASTM D149
Dielectric Breakdown Voltage - 0.011" (Vac)
8500
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.8
ASTM D5470
Continuous Use Temp (°F) / (°C)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.005"
4.39
4.02
3.48
3.15
3.05
TO-220 Thermal Performance (°C/W) 0.008"
5.11
4.69
4.53
4.45
4.38
TO-220 Thermal Performance (°C/W) 0.011"
6.26
5.92
5.73
5.63
5.53
Thermal Impedance (°C-in2/W) 0.005" (1)
0.78
0.61
0.58
0.55
0.54
Thermal Impedance (°C-in2/W) 0.008" (1)
1.28
0.94
0.90
0.86
0.84
Thermal Impedance (°C-in2/W) 0.011" (1)
2.47
1.22
1.19
1.14
1.11
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
Building a Part Number
–
0.008
– 00
– 1112 –
Standard Options
NA
Section E
Section A
BP100
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
1112 = 11" x 12" sheets,11250 = 11" x 250' rolls
or 00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.005", 0.008", 0.011"
BP100 = Bond-Ply 100 Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
Bond-Ply ®: U.S. Patent 5,090,484 and others.
77
BOND-PLY
Shelf Life: The double-sided, pressure
sensitive adhesive used in Bond-Ply products
requires the use of dual liners to protect
the surfaces from contaminants. Bergquist
recommends a 6-month shelf life at a
maximum continuous storage temperature
of 35°C or 3-month shelf life at a maximum
continuous storage temperature of 45°C, for
maintenance of controlled adhesion to the
liner.The shelf life of the Bond-Ply material,
without consideration of liner adhesion
(which is often not critical for manual assembly
processing), is recommended at 12 months
from date of manufacture at a maximum
continuous storage temperature of 60°C.
TEST METHOD
Visual
Thickness (inch) / (mm)
Configurations Available:
• Sheet form, roll form and die-cut parts
METRIC VALUE
White
Reinforcement Carrier
Section D
• Mount heat sink onto BGA graphic
processor or drive processor
• Mount heat spreader onto power
converter PCB or onto motor control PCB
IMPERIAL VALUE
White
Section C
Typical Applications
Include:
TYPICAL PROPERTIES OF BOND-PLY 100
PROPERTY
Color
Section B
• Thermal impedance:
0.86°C-in2/W (@100 psi)
• High bond strength to a variety of surfaces
• Double-sided, pressure sensitive
adhesive tape
• High performance, thermally conductive
acrylic adhesive
• Can be used instead of heat-cure adhesive,
screw mounting or clip mounting
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Bond-Ply 400
®
Thermally Conductive, Unreinforced, Pressure Sensitive Adhesive Tape
Features and Benefits
• Thermal impedance:
0.87°C-in2/W (@50 psi)
• Easy application
• Eliminates need for external hardware
(screws, clips, etc.)
• Available with easy release tabs
TYPICAL PROPERTIES OF BOND-PLY 400
PROPERTY
Color
IMPERIAL VALUE
White
METRIC VALUE
White
0.005
0.127
ASTM D374
-22
-30
ASTM E1356
-22 to 248
-30 to 120
—
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
VALUE
3000
TEST METHOD
ASTM D149
Flame Rating
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.4
ASTM D5470
Thickness (inch) / (mm)
Glass Transition (°F) / (°C)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds)
10
25
50
100
200
TO-220 Thermal Performance (°C/W) 0.005"
5.4
5.4
5.4
5.4
5.4
Thermal Impedance (°C-in2/W) (1)
BOND-PLY
Building a Part Number
0.005
– 00
– 11/250 –
Standard Options
NA
Section E
–
Section D
BP400
Section C
Secure:
• Heat sink onto BGA graphic processor
• Heat sink to computer processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires
the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a
6-month shelf life at a maximum continuous storage temperature of 35°C, or 3-month shelf life at
a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to
the liner. The shelf life of the Bond-Ply material, without consideration of liner adhesion (which is
often not critical for manual assembly processing), is recommended at 12 months from date of
manufacture at a maximum continuous storage temperature of 60°C.
Section B
Typical Applications
Include:
0.87
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
Section A
Bergquist Bond-Ply 400 is an un-reinforced,
thermally conductive, pressure sensitive
adhesive tape.The tape is supplied with
protective topside tabs and a carrier liner.
Bond-Ply 400 is designed to attain high bond
strength to a variety of “low energy” surfaces,
including many plastics, while maintaining high
bond strength with long term exposure to
heat and high humidity.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
11/250 = 11" x 250' rolls or 00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.005"
BP400 = Bond-Ply 400 Material
Configurations Available:
Note: To build a part number, visit our website at www.bergquistcompany.com.
• Die-cut parts (supplied on rolls with easy
release, protective tabs)
Bond-Ply ®: U.S. Patent 5,090,484 and others.
78
TEST METHOD
Visual
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Bond-Ply 660B
®
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape
Features and Benefits
• Designed to replace mechanical fasteners
or screws
• For applications that require
electrical isolation
• Double-sided pressure sensitive
adhesive tape
TYPICAL PROPERTIES OF BOND-PLY 660B
PROPERTY
Color
IMPERIAL VALUE
White
METRIC VALUE
White
Reinforcement Carrier
PEN Film
PEN Film
—
Thickness (inch) / (mm)
0.0055
0.14
ASTM D374
Temp. Resistance, 30 sec. (°F) / (°C)
392
200
—
Elongation (%)
40
40
ASTM D412
30000
210
ASTM D412
250
250
ASTM D3386
Tensile Strength (psi) / (MPa)
CTE (ppm)
FR-4 or
Flex Circuit
Bond-Ply 660B
Metal Heat Spreader
Bond-Ply 660B is a thermally conductive,
electrically insulating, double-sided pressure
sensitive adhesive tape.The tape consists of a
high performance, thermally conductive acrylic
adhesive coated on both sides of a PEN film.
Use Bond-Ply 660B in applications to replace
mechanical fasteners or screws.
Typical Applications
Include:
Glass Transition (°F) / (°C)
TEST METHOD
Visual
-22
-30
ASTM E1356
-22 to 248
-30 to 120
—
ADHESION
Lap Shear @ RT (psi) / (MPa)
100
0.7
ASTM D1002
Lap Shear after 5 hr @ 100°C
200
1.4
ASTM D1002
Lap Shear after 2 min @ 200°C
200
1.4
ASTM D1002
Static Dead Weight Shear (°F) / (°C)
302
150
PSTC#7
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
7000
7000
ASTM D149
Flame Rating
V-O
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
0.4
0.4
ASTM D5470
Continuous Use Temp (°F) / (°C)
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
5.30
4.94
4.38
4.02
3.88
Thermal Impedance (°C-in2/W) (1)
1.15
0.79
0.74
0.72
0.70
1) The ASTM D5470 (Bergquist modified) test fixture was used.The recorded value includes interfacial thermal resistance.These values are
provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
• Mount heat sink onto BGA graphic processor
• Mount heat sink onto drive processor
• Mount heat spreader onto power
converter PCB
• Mount heat spreader onto motor
control PCB
Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply products requires
the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a
6-month shelf life at a maximum continuous storage temperature of 35°C, or 3-month shelf life
at a maximum continuous storage temperature of 45°C, for maintenance of controlled
adhesion to the liner.The shelf life of the Bond-Ply material, without consideration of liner
adhesion (which is often not critical for manual assembly processing), is recommended at
12 months from date of manufacture at a maximum continuous storage temperature
of 60°C.
Configurations Available:
Building a Part Number
®
NA
Section E
– 1112 –
Section D
Section C
– 0.0055 – 00
Section B
Section A
BP660B
Standard OptionsBond-Ply :
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or
00 = custom configuration
00 = No adhesive
Standard thicknesses available: 0.0055"
BP660B = Bond-Ply 660B Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
U.S. Patent 5,090,484 and others.
79
BOND-PLY
• Roll form and die-cut parts
The material as delivered will include a
continuous base liner with differential release
properties to allow simplicity in roll packaging
and application assembly.
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Liqui-Bond SA 1000 (One-Part)
™
Thermally Conductive, One-Part, Liquid Silicone Adhesive
Features and Benefits
• High thermal performance
• Eliminates need for mechanical fasteners
• Low viscosity for ease of screening or
stenciling
• Can achieve a very thin bond line
• Mechanical and chemical stability
• Maintains structural bond in
severe-environment applications
• Heat cure
TYPICAL PROPERTIES OF LIQUI-BOND SA 1000
PROPERTY AS SUPPLIED
Color
IMPERIAL VALUE
Black
METRIC VALUE
Black
TEST METHOD
Visual
125,000
125,000
ASTM B2196
2.4
2.4
ASTM D792
6
6
—
ASTM D2240
Viscosity (cps) (1)
Density (g/cc)
Shelf Life @ 10°C (months)
PROPERTY AS CURED - PHYSICAL
Hardness (Shore A)
75
75
-76 to 392
-60 to 200
—
Shear Strength (psi) / (MPa)
200
1.4
ASTM D1002
PROPERTY AS CURED - ELECTRICAL
Dielectric Strength (V/mil) / (V/mm)
250
10,000
ASTM D149
Dielectric Constant (1000 Hz)
5.5
5.5
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-O
V-O
U.L.94
PROPERTY AS CURED - THERMAL
Thermal Conductivity (W/m-K)
1.0
1.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (hours) (2)
10
10
—
Cure @ 125°C (minutes) (3)
20
20
—
Cure @ 150°C (minutes) (3)
10
10
—
Continuous Use Temp (°F) / (°C)
1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25°C.
2) Based on 1/8" diameter bead.
3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.
BOND-PLY
• PCBA to housing
• Discrete component to heat spreader
Configurations Available:
• With or without glass beads
Building a Part Number
– 00
– 30cc –
Standard Options
NA
Section E
00
Section D
–
Section C
LBSA1000
Section B
Liqui-Bond SA 1000 features excellent
low and high-temperature mechanical and
chemical stability.The material’s mild elastic
properties assist in relieving CTE stresses
during thermal cycling. Liqui-Bond SA 1000
contains no cure by-products, cures at elevated temperatures and requires refrigeration
storage at 10°C.The material is available in
both tube and mid-sized container forms.
Typical Applications Include:
Section A
Liqui-Bond SA 1000 is a thermally conductive,
one-part liquid silicone adhesive with a low
viscosity for easy screenability. Liqui-Bond SA
1000 features a high thermal performance
and maintains it’s structure even in severeenvironment applications.
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml)
Pail: 1G = 1-gallon, 5G = 5-gallon
00 = No adhesive
00 = No spacer beads
07 = 0.007" spacer beads
LBSA1000 = Liqui-Bond SA 1000 Liquid Adhesive Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
80
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Liqui-Bond SA 2000
™
Thermally Conductive, One-Part, Liquid Silicone Adhesive
Features and Benefits
METRIC VALUE
Yellow
TEST METHOD
Visual
200,000
200,000
ASTM B2196
2.4
2.4
ASTM D792
6
6
—
ASTM D2240
Density (g/cc)
Shelf Life @ 10°C (months)
PROPERTY AS CURED - PHYSICAL
Hardness (Shore A)
80
80
-76 to 392
-60 to 200
—
Shear Strength (psi) / (MPa)
200
1.4
ASTM D1002
PROPERTY AS CURED - ELECTRICAL
Dielectric Strength (V/mil) / (V/mm)
250
10,000
ASTM D149
Dielectric Constant (1000 Hz)
6.0
6.0
ASTM D150
Volume Resistivity (Ohm-meter)
1011
1011
ASTM D257
Flame Rating
V-O
V-O
U.L.94
PROPERTY AS CURED - THERMAL
Thermal Conductivity (W/m-K)
2.0
2.0
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (hours) (2)
24
24
—
Cure @ 125°C (minutes) (3)
20
20
—
Cure @ 150°C (minutes) (3)
10
10
—
Continuous Use Temp (°F) / (°C)
1) Brookfield RV, Heli-path, Spindle TF @ 20 rpm, 25°C.
2) Based on 1/8" diameter bead.
3) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent.
Typical Applications Include:
• PCBA to housing
• Discrete component to heat spreader
Configurations Available:
• With or without glass beads
Building a Part Number
00
– 00
– 30cc –
Standard Options
NA
Section E
–
Section D
LBSA2000
Section C
Liqui-Bond SA 2000 features excellent
low and high-temperature mechanical and
chemical stability.The material’s mild elastic
properties assist in relieving CTE stresses
during thermal cycling. Liqui-Bond SA 2000
cures at elevated temperatures and requires
refrigeration storage at 10°C.
IMPERIAL VALUE
Yellow
Viscosity (cps) (1)
Section B
Liqui-Bond SA 2000 is a high performance,
thermally conductive silicone adhesive that
cures to a solid bonding elastomer. Liqui-Bond
SA 2000 is supplied as a one-part liquid
component, in either tube or mid-sized
container form.
TYPICAL PROPERTIES OF LIQUI-BOND SA 2000
PROPERTY AS SUPPLIED
Color
Section A
• High thermal conductivity: 2.0 W/m-K
• Eliminates need for mechanical fasteners
• One-part formulation for easy dispensing
• Mechanical and chemical stability
• Maintains structural bond in
severe-environment applications
• Heat cure
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
Cartridges: 30cc = 30.0cc, 600cc = 600.0cc (ml)
Pail: 1G = 1-gallon, 5G = 5-gallon
00 = No spacer beads
07 = 0.007" spacer beads
LBSA2000 = Liqui-Bond SA 2000 Liquid Adhesive Material
Note: To build a part number, visit our website at www.bergquistcompany.com.
81
BOND-PLY
00 = No adhesive
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Assistance is Just a Click Away
“TechChat” Online Technical Support
Real-Time Response to
Important Issues Facing
Design Engineers,
Engineering Managers
and Product Specifiers.
Need help selecting the right
Bergquist thermal management
product for your specific
application needs?
The Bergquist Company website
features a service for designers,
engineers and specifiers —
“TechChat,” an online technical
support service for anyone who
desires immediate support via the
web.“TechChat” can be found at:
www.bergquistcompany.com
“TechChat” provides real-time
answers to technical issues faced
when designing and specifying
thermal management materials,
touch screens, membrane switches
or electronic components.
TechChat is available Monday Friday, 8am-5pm, CST.
ORDERING
From the simplest of questions to the most complex, Bergquist’s seasoned professionals draw on the company’s extensive
experience with thermal management as well as membrane switch, touch screen and electronic component applications.
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Solutions for Surface Mount Applications
Hi-Flow
The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface
for many surface mount packages. At the phase change temperature, Hi-Flow materials
change from a solid and flow with minimal applied pressure.This characteristic optimizes
heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to
replace messy thermal grease.
Bergquist phase change materials are specially compounded to prevent pump-out of
the interface area, which is often associated with thermal grease. Typical applications for
Hi-Flow materials include:
• Pentium®, Athlon®, Core 2 Duo and other high performance CPUs
• DC/DC converters
• Power modules
Hi-Flow materials are manufactured with or without film or foil carriers. Custom shapes
and sizes for non-standard applications are also available.
Power Device
Thermal Clad
Hi-Flow
High Power Application
Hi-Flow with Thermal Clad
Heat
Spreader
Heat
Spreader
Hi-Flow
Processor
FR-4 Board
High Power Application
Hi-Flow without Thermal Clad
Sil-Pad
Sil-Pad is the benchmark in thermal interface materials.The Sil-Pad family of materials
are thermally conductive and electrically insulating. Available in custom shapes, sheets,
and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in
SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages
Power Device
Sil-Pad or
Bond-Ply
FR-4
Heat
Spreader
ORDERING
Mid Power Application with Bond-Ply or Sil-Pad
Pentium® is a registered trademark of Intel Corporation.
Athlon® is a registered trademark of Advanced Micro Devices, Inc.
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Where Thermal Solutions Come Together
Bond-Ply and Liqui-Bond
The Bond-Ply family of materials are thermally conductive and electrically isolating.
Bond-Ply is available in a pressure sensitive adhesive or laminating format. Liqui-Bond is
a high thermal performance liquid silicone adhesive that cures to a solid bonding
elastomer. Bond-Ply provides for the mechanical decoupling of bonded materials with
mismatched thermal coefficients of expansion.Typical applications include:
• Bonding bus bars in a variety of electronic modules and sub assemblies
• Attaching a metal-based component to a heat sink
• Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages
• Bonding flexible circuits to a rigid heat spreader or thermal plane
• Assembly tapes for BGA heat spreader
• Attaching PCB assemblies to housings
Gap Pad and Gap Filler
The Gap Pad product family offers a line of thermally conductive materials which
are highly conformable.Varying degrees of thermal conductivity and compression
deflection characteristics are available.Typical applications include:
• On top of a semiconductor package such as a QFP or BGA. Often times, several
packages with varying heights can use a common heat sink when utilizing Gap Pad
• Between a PCB or substrate and a chassis, frame, or other heat spreader
• Areas where heat needs to be transferred to any type of heat spreader
• For interfacing pressure sensitive devices
• Filling various gaps between heat-generating devices and heat sinks or housings
Gap Pads are available in thickness of 0.010" to 0.250", and in custom shapes, with or
without adhesive. Gap Fillers are available in cartridge or kit form.
Power
Device
Gap Pad
Heat
Spreader
FR-4 Board
Lower Power Application
with Gap Pad
Top Efficiency In
Thermal Materials For
Today’s Changing Technology.
ORDERING
Contact Bergquist for additional information regarding
our Thermal Solutions.We are constantly innovating
to offer you the greatest selection of options and
flexibility to meet today’s changing technology.
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Ordering Information
Ordering Procedure:
Rolls:
The last 2 or 3 digits define the part number selected.The “foot print”
and dimensions are shown on pages 87-95.
Sil-Pad materials are available in roll form, with or without adhesive,
with the exception of Sil-Pad 1750 and Sil-Pad 2000. Hi-Flow materials
are available in roll form. Certain Gap Pad materials are available in
roll form. Please contact Bergquist Sales for more information.
Special Shapes:
For applications requiring non-standard or custom Sil-Pad configurations,
contact your Bergquist Sales Representative.We produce thousands of
custom die shapes and designs.
Bergquist adhesives include:
SILICONE:
Tolerances:
Typical converting tolerances are held on length (L), width (W), hole
diameter and hole location for most materials as noted below:
TYPICAL SIL-PAD / HI-FLOW TOLERANCES
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