GP2000S40-0.040-02-4/4

SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 17 Gap Pad 2000S40 ® Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very low pressures • Highly conformable, low hardness • Designed for low-stress applications • Fiberglass reinforced for puncture, shear and tear resistance IMPERIAL VALUE Gray METRIC VALUE Gray TEST METHOD Visual Reinforcement Carrier Fiberglass Fiberglass — Thickness (inch) / (mm) 0.020 to 0.125 0.508 to 3.175 ASTM D374 Inherent Surface Tack (1- or 2-sided) 2 — 2.9 2.9 ASTM D792 Heat Capacity (J/g-K) 0.6 0.6 ASTM E1269 Hardness, Bulk Rubber (Shore 00) (1) 30 30 ASTM D2240 Young’s Modulus (psi) / (kPa) (2) 45 310 ASTM D575 Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 — ELECTRICAL Dielectric Breakdown Voltage (Vac) >5000 >5000 ASTM D149 Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150 Volume Resistivity (Ohm-meter) 1011 1011 ASTM D257 Flame Rating V-O V-O U.L. 94 THERMAL Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470 GAP PAD 2 Density (g/cc) 1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116. Configurations Available: • Sheet form and die-cut parts Building a Part Number 0.020 – 02 – 0816 – NA NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. 0816 = Standard sheet size 8" x 16", or 00 = custom configuration 02 = Natural tack, both sides Thickness vs. Thermal Resistance Gap Pad 2000S40 Resultant Thickness (mils) Standard Options Section E – Section D GP2000S40 Section C Note: Resultant thickness is defined as the final gap thickness of the application. • Power electronics DC/DC; 1/4, 1/2, full bricks, etc. • Mass storage devices • Graphics card/processor/ASIC • Wireline/wireless communications hardware • Automotive engine/transmission controls Section B Gap Pad 2000S40 is electrically isolating, and well suited for applications requiring electrical isolation between heat sinks and high-voltage, bare-leaded devices. Gap Pad 2000S40 is a filled, thermally conductive polymer reinforced with a fiberglass carrier on one side, allowing for easy material handling and enhanced puncture, shear and tear resistance. Typical Applications Include: Section A Gap Pad 2000S40 is recommended for lowstress applications that require a mid to high thermally conductive interface material.The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" 125 100 GP2000S40 = Gap Pad 2000S40 Material 75 Note: To build a part number, visit our website at www.bergquistcompany.com. 50 Gap Pad ®: U.S. Patent 5,679,457 and others. 25 0 0 0.50 1.00 1.50 2.00 Thermal Resistance (C-in2/W) 2.50 17