GBJ25G

GBJ25B thru GBJ25G Single Phase Glass Passivated Silicon Bridge Rectifier VRRM = 100 V - 400 V IO = 25 A Features • Epoxy Resin material compliant with 94V-0 standards of UL Material Flammability Provisions • Compliant with RoHS Provisions • Single in-line DIP package, compact size • Low forward voltage, high forward current • High surge current capability • Types from 100 V to 400 V VRRM GBJ Package • Small size, high heat-conducting performance • Thermal welding performance: 260 oC/10 s • Weight: 7.25 g (0.25 Oz) • Not ESD Sensitive Maximum ratings at TA = 25 °C (ambient temperature), unless otherwise specified GBJ25B GBJ25D GBJ25G Unit VRRM 100 200 400 V VDC Tj Tstg 100 -50 to 150 -50 to 150 200 -50 to 150 -50 to 150 400 -50 to 150 -50 to 150 °C °C Unit Parameter Symbol Repetitive peak reverse voltage DC blocking voltage Operating temperature Storage temperature Conditions Electrical characteristics at TA = 25 °C, unless otherwise specified Resistive load, single phase, half sine wave, 60 Hz. For capacitive load derate current by 20%. Parameter Symbol Maximum average forward rectified current Maximum forward surge current Maximum forward voltage IO IFSM VF Max. reverse current leakage at rated DC blocking voltage IR Insulation strengthg (Lead wire to case) Vdis Fusing feature Thermal resistance Mounting torgue I2 t RΘJA RΘJC TOR Conditions GBJ25B GBJ25D GBJ25G TC = 98 °C 25 (1) 25 (1) 25 (1) TA = 25 °C (2) (2) 4.5 (2) 4.5 4.5 A 8.3 ms pulse width, single pulse sine-wave, rated load, Tj = 25 °C 350 350 350 A IF = 12.5 A 1.05 1.05 1.05 V TA = 25 °C 5 5 5 TA = 125 °C 500 500 500 2.5 2.5 2.5 kV 300 300 300 A2s AC Voltage: 1 minute, current leakage < 1 mA 1ms ≤ t < 10ms, Tj=25 °C without heatsink with stated size heatsink (2) 22 1.0 (1) (2) 22 1.0 (1) μA (2) 22 1.0 (1) 1.0 ( 0.8 Nm is recomended ) o C/W Nm Remarks: (1) Install on PCB with stated size heat sink. In order to reach excellent heat dissipation performance, please coat thermal conductive sillica gel in moderation, use M3 screw to screw up. Recommended heatsink size: 12.4*15.2*12.8 cm. (2) Install on PCB without heatsink. Oct. 2018 http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj25g.pdf 1 GBJ25B thru GBJ25G Oct. 2018 http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj25g.pdf 2 GBJ25B thru GBJ25G Package dimensions and terminal configuration Product is marked with part number and terminal configuration. Dimensions in millimeters Oct. 2018 http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj25g.pdf 3