GBJ10J thru GBJ10M
Single Phase Glass Passivated
Silicon Bridge Rectifier
VRRM = 600 V - 1000 V
IO = 10 A
Features
• Epoxy Resin material compliant with 94V-0 standards
of UL Material Flammability Provisions
• Compliant with RoHS Provisions
• Single in-line DIP package, compact size
• Low forward voltage, high forward current
• High surge current capability
• Types from 600 V to 1000 V VRRM
GBJ Package
• Small size, high heat-conducting performance
• Thermal welding performance: 260 oC/10 s
• Weight: 7.25 g (0.25 Oz)
• Not ESD Sensitive
Maximum ratings at TA = 25 °C (ambient temperature), unless otherwise specified
GBJ10J
GBJ10K
GBJ10M
Unit
VRRM
600
800
1000
V
VDC
Tj
Tstg
600
-50 to 150
-50 to 150
800
-50 to 150
-50 to 150
1000
-50 to 150
-50 to 150
°C
°C
Unit
Parameter
Symbol
Repetitive peak reverse voltage
DC blocking voltage
Operating temperature
Storage temperature
Conditions
Electrical characteristics at TA = 25 °C, unless otherwise specified
Resistive load, single phase, half sine wave, 60 Hz.
For capacitive load derate current by 20%.
Parameter
Symbol
Maximum average forward
rectified current
Maximum forward surge current
Maximum forward voltage
IO
IFSM
VF
Max. reverse current leakage at
rated DC blocking voltage
IR
Insulation strengthg (Lead wire
to case)
Vdis
Fusing feature
Thermal resistance
Mounting torgue
I2 t
RΘJA
RΘJC
TOR
Conditions
GBJ10J
GBJ10K
GBJ10M
TC = 100 °C
10 (1)
10 (1)
10 (1)
(2)
(2)
2.7 (2)
TA = 25 °C
2.7
2.7
A
8.3 ms pulse width,
single pulse sine-wave,
rated load, Tj = 25 °C
200
200
200
A
IF = 5 A
1.05
1.05
1.05
V
TA = 25 °C
5
5
5
TA = 125 °C
500
500
500
2.5
2.5
2.5
kV
80
80
80
A2s
AC Voltage: 1 minute,
current leakage < 1 mA
1ms ≤ t < 10ms, Tj=25 °C
without heatsink
with stated size heatsink
(2)
26
2.3 (1)
(2)
26
2.3 (1)
μA
(2)
26
2.3 (1)
1.0 ( 0.8 Nm is recomended )
o
C/W
Nm
Remarks: (1) Install on PCB with stated size heat sink. In order to reach excellent heat dissipation performance, please coat thermal
conductive sillica gel in moderation, use M3 screw to screw up. Recommended heatsink size: 12.7*8.2*3.8 cm.
(2) Install on PCB without heatsink.
Oct. 2018
http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj10j.pdf
1
GBJ10J thru GBJ10M
Oct. 2018
http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj10j.pdf
2
GBJ10J thru GBJ10M
Package dimensions and terminal configuration
Product is marked with part number and terminal configuration.
Dimensions in millimeters
Oct. 2018
http://www.diodemodule.com/silicon_products/bridge_rectifiers/gbj10j.pdf
3
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