HF5N65(BEB)

BVDSS = 650 V RDS(on) typ = 2.8 Ω HF5N65 ID = 5.0 A 650V N-Channel MOSFET TO-220F FEATURES  Originative New Design 1  Superior Avalanche Rugged Technology  Robust Gate Oxide Technology 2 3 1.Gate 2. Drain 3. Source  Very Low Intrinsic Capacitances  Excellent Switching Characteristics  Unrivalled Gate Charge : 15 nC (Typ.)  Extended Safe Operating Area  Lower RDS(ON) : 2.8 Ω (Typ.) @VGS=10V  100% Avalanche Tested Absolute Maximum Ratings Symbol TC=25℃ unless otherwise specified Parameter Value Units 650 V VDSS Drain-Source Voltage ID Drain Current – Continuous (TC = 25℃) 5.0* A Drain Current – Continuous (TC = 100℃) 2.5* A IDM Drain Current – Pulsed 16* A VGS Gate-Source Voltage ±30 V EAS Single Pulsed Avalanche Energy (Note 2) 240 mJ IAR Avalanche Current (Note 1) 5.0 A EAR Repetitive Avalanche Energy (Note 1) 10 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 5.5 V/ns PD Power Dissipation (TC = 25℃) - Derate above 25℃ 33 W TJ, TSTG Operating and Storage Temperature Range TL Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds (Note 1) 0.26 W/℃ -55 to +150 ℃ 300 ℃ * Drain current limited by maximum junction temperature Thermal Resistance Characteristics Typ. Max. RθJC Symbol Junction-to-Case Parameter -- 3.79 RθJA Junction-to-Ambient -- 62.5 Units ℃/W HF5N65 July 2005 Symbol Parameter unless otherwise specified Test Conditions Min Typ Max Units On Characteristics VGS RDS(ON) Gate Threshold Voltage VDS = VGS, ID = 250 ㎂ 2.5 -- 4.5 V Static Drain-Source On-Resistance VGS = 10 V, ID = 2.50 A -- 2.0 2.8 Ω 650 -- -- V ID = 250 ㎂, Referenced to25℃ -- 0.65 -- V/℃ VDS = 600 V, VGS = 0 V -- -- 1 ㎂ VDS = 480 V, TC = 125℃ -- -- 10 ㎂ Off Characteristics BVDSS Drain-Source Breakdown Voltage ΔBVDSS Breakdown Voltage Temperature Coefficient /ΔTJ IDSS Zero Gate Voltage Drain Current VGS = 0 V, ID = 250 ㎂ IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 ㎁ IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 ㎁ -- 600 780 ㎊ -- 65 85 ㎊ -- 11 14 ㎊ -- 15 30 ㎱ -- 40 80 ㎱ -- 50 100 ㎱ -- 40 80 ㎱ -- 15 20 nC -- 3.4 -- nC -- 6.7 -- nC Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz Switching Characteristics td(on) Turn-On Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd VDS = 300 V, ID = 5.0 A, RG = 25 Ω (Note 4,5) VDS = 480V, ID = 5.0 A, VGS = 10 V (Note 4,5) Gate-Drain Charge Source-Drain Diode Maximum Ratings and Characteristics IS Continuous Source-Drain Diode Forward Current -- -- 5.0 ISM Pulsed Source-Drain Diode Forward Current -- -- 16 VSD Source-Drain Diode Forward Voltage IS = 5.0 A, VGS = 0 V -- -- 1.4 V trr Reverse Recovery Time -- 300 -- ㎱ Qrr Reverse Recovery Charge IS = 5.0 A, VGS = 0 V diF/dt = 100 A/μs (Note 4) -- 2.2 -- μC Notes ; 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=27.5mH, IAS=5.0A, VDD=50V, RG=25Ω, Starting TJ =25°C 3. ISD≤4.0A, di/dt≤300A/μs, VDD≤BVDSS , Starting TJ =25 °C 4. Pulse Test : Pulse Width ≤ 300μs, Duty Cycle ≤ 2% 5. Essentially Independent of Operating Temperature A HF5N65 Electrical Characteristics TC=25 °C HF5N65 Typical Characteristics V 15.0V 10.0V 8.0V 7.0V 6.5V 6.0V 5.5V Bottem 5.0V Top: 101 ID, Drain Current [A] ID, Drain Current [A] 101 100 10-1 150℃ 100 25℃ -55℃ ※ Note : 1. 250㎲ Pulse Test 2. TC=25℃ 10-1 100 10-1 101 2 4 VDS, Drain-Source Voltage [V] ※ Note : 1. VDS=40V 2. 250㎲ Pulse Test 6 8 10 VGS, Gate-Source Voltage [V] Figure 1. On Region Characteristics Figure 2. Transfer Characteristics 12 101 IDR, Reverse Drain Current [A] RDS(ON)[Ω], Drain-Source On-Resistance 10 VGS=10V 8 VGS=20V 6 4 100 150℃ 25℃ ※ Note : 1. VGS=0V 2. 250㎲ Pulse Test 2 ※ Note : TJ=25℃ 0 0 2 4 6 8 10 10-1 0.2 12 0.4 0.6 Capacitances [pF] Ciss 800 600 Coss 400 * Note ; 1. VGS = 0 V 2. f = 1 MHz Crss 200 1.2 1.4 12 VGS, Gate-Source Voltage [V] Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 1000 1.0 Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature Figure 3. On Resistance Variation vs Drain Current and Gate Voltage 1200 0.8 VSD, Source-Drain Voltage [V] ID, Drain Current [A] VDS = 120V 10 VDS = 300V VDS = 480V 8 6 4 2 * Note : ID = 4A 0 10-1 100 101 0 0 2 4 6 8 10 12 14 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics 16 HF5N65 Typical Characteristics (continued) 3.0 RDS(ON), (Normalized) Drain-Source On-Resistance BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 ※ Note : 1. VGS=0V 2. ID=250㎂ 0.9 0.8 -100 -50 0 50 100 150 2.5 2.0 1.5 1.0 * Note : 1. VGS = 10 V 2. ID = 2.0 A 0.5 0.0 -100 200 -50 0 50 100 150 200 TJ, Junction Temperature [oC] TJ, Junction Temperature [oC] Figure 8. On-Resistance Variation vs Temperature Figure 7. Breakdown Voltage Variation vs Temperature 102 4 Operation in This Area is Limited by R DS(on) 1 ms 10 ms 100 ms DC 100 10-1 3 2 1 * Notes : 1. TC = 25 oC o 10-2 100 2. TJ = 150 C 3. Single Pulse 101 102 0 25 103 50 75 100 Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs Case Temperature D=0.5 0 10 0.2 ※ Notes : 1. Zθ JC(t) = 3.79 ℃/W Max. 2. Duty Factor, D=t1/t2 3. TJM - TC = PDM * Zθ JC(t) 0.1 0.05 -1 10 0.02 PDM 0.01 t1 single pulse -2 10 -5 10 -4 10 125 TC, Case Temperature [ ℃] VDS, Drain-Source Voltage [V] Zθ JC(t), Thermal Response ID, Drain Current [A] ID, Drain Current [A] 100 µs 101 -3 10 -2 10 -1 10 t2 0 10 t1, Square Wave Pulse Duration [sec] Figure 11. Transient Thermal Response Curve 1 10 150 HF5N65 Fig 12. Gate Charge Test Circuit & Waveform 50KΩ 12V VGS Same Type as DUT Qg 200nF 10V 300nF VDS VGS Qgs Qgd DUT 3mA Charge Fig 13. Resistive Switching Test Circuit & Waveforms RL VDS VDS 90% VDD RG ( 0.5 rated VDS ) Vin DUT 10V 10% tr td(on) td(off) t on tf t off Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms BVDSS 1 EAS = ---- LL IAS2 -------------------2 BVDSS -- VDD L VDS VDD ID BVDSS IAS RG 10V ID (t) DUT VDS (t) VDD tp Time HF5N65 Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + VDS _ IS L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by RG • IS controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current IS ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt Vf Body Diode Forward Voltage Drop VDD HF5N65 Package Dimension TO-220F ±0.20 ±0.20 0 0.2 2.54±0.20 6.68±0.20 0.70±0.20 12.42±0.20 3.30±0.20 2.76±0.20 1.47max 9.75±0.20 15.87±0.20 φ 8± 1 . 3 0.80±0.20 2.54typ 2.54typ 0.50±0.20