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5N10-MS

5N10-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOT-23

  • 描述:

    5N10-MS

  • 数据手册
  • 价格&库存
5N10-MS 数据手册
www.msksemi.com 5N10-MS Semiconductor SOT23 Pin Configuration Compiance Product Summary BVDSS RDSON 100V 105 mΩ ID 5A  Green Device Available  Super Low Gate Charge  Excellent Cdv/dt effect decline  Advanced high cell density Trench technology Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 100 V VGS Gate-Source Voltage ±20 V ID@TA=25℃ Continuous Drain Current, VGS @ 10V1 5 A ID@TA=70℃ Continuous Drain Current, VGS @ 10V IDM PD@TA=25℃ 2.2 A Current2 11 A Dissipation3 1 W Pulsed Drain Total Power 1 TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Parameter Typ. Max. Unit RθJA Thermal Resistance Junction-ambient 1 --- 125 ℃/W RθJC Thermal Resistance Junction-Case1 --- 80 ℃/W www.msksemi.com 5N10-MS Semiconductor Electrical Characteristics TC=25℃ Symbol Compiance unless otherwise specified Parameter Test Condition Min. Typ. Max. Units Off Characteristic V(BR)DSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250μA 100 110 - V IDSS Zero Gate Voltage Drain Current VDS = 100V, VGS = 0V - - 1 μA IGSS Gate to Body Leakage Current VDS = 0V, VGS = ±20V - - ±100 nA 1.0 1.95 3.0 V - 105 140 mΩ - 196 - pF - 25.9 - pF - 21.4 - pF - 4.3 - nC - 3.5 - nC - 3.1 - nC - 14.7 - ns - 3.5 - ns - 20.9 - ns - 2.7 - ns On Characteristics note3 VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250μA RDS(on) Static Drain-Source On-Resistance note2 VGS = 10V, ID = 3A Dynamic Characteristics note4 Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain(“Miller”) Charge Switching Characteristics VDS = 50V, VGS = 0V, f = 1.0MHz VDS = 50V, ID = 3A, VGS = 10V note4 td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time VDD = 50V, IDS=3A RG = 2Ω, VGEN = 10V Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain to Source Diode Forward Current note2 - - 4.5 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 12 A VSD Drain to Source Diode Forward Voltage - - 1.3 V trr Body Diode Reverse Recovery Time - 32.1 - ns Qrr Body Diode Reverse Recovery Time Charge - 39.4 - nC Irrm Peak Reverse Recovery Current - 2.1 - A note3 VGS = 0V, IS =3A VGS = 0V, IF = 3A, di/dt =100A/μs Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t ≤ 10 sec. 3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤2%. 4. Guaranteed by design, not subject to production 5. VDD=50 V, RG=50 Ω, L=0.3 mH, starting Tj=25 °C www.msksemi.com 5N10-MS Semiconductor Compiance Typical Characteristics 4 4 VGS = 10V VDS= 5V VGS = 4.5V 3 VGS = 3.5V Drain current ID (A) Drain current ID (A) 3 2 VGS = 2.5V 1 2 1 VGS = 2V 0 0 1 2 3 4 0 5 0 Drain−source voltage VDS (V) Figure 1. Output Characteristics 1 2 3 4 Gate−source voltage VGS (V) Figure 2. Transfer Characteristics 2 1200 On-Resistance RDS (on) (mΩ) Source current IS (A) ID= 2A 1.5 1 0.5 0 900 600 300 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 3 Source−drain voltage VSD (V) 500 2.5 400 2.0 VGS = 4.5V 200 VGS = 10V 100 0 9 12 15 Figure 4. RDS(ON) vs. VGS Normalized RDS (on) On-Resistance R DS (on) (mΩ) Figure 3. Forward Characteristics of Reverse 300 6 Gate−source voltage VGS (V) 1.5 1.0 0.5 0 0.5 1 1.5 2 Drain current I-IDD(A) (A) Figure 5. RDS(ON) vs. ID 2.5 3 0.0 -50 -25 0 25 50 75 100 Temperature Tj(°C) 125 150 Figure 6. Normalized RDS(on) vs. Temperature 3 www.msksemi.com 5N10-MS Semiconductor Compiance 10000 Capacitance(pF) 1000 Ciss 100 Coss 10 Crss F=1.0MHz 1 0 20 40 60 80 100 Drain-source voltage VDS(V) Figure 7. Capacitance Characteristics Figure 8. Gate Charge Characteristics www.msksemi.com 5N10-MS Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions In Millimeters Min Max 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950 TYP 1.800 2.000 0.550 REF 0.300 0.500 0° 8° Dimensions In Inches Min Max 0.035 0.045 0.000 0.004 0.035 0.041 0.012 0.020 0.003 0.006 0.110 0.118 0.047 0.055 0.089 0.100 0.037 TYP 0.071 0.079 0.022 REF 0.012 0.020 0° 8° REEL SPECIFICATION P/N 5N10-MS PKG QTY SOT-23 3000 www.msksemi.com 5N10-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
5N10-MS 价格&库存

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5N10-MS
    •  国内价格
    • 1+0.18525
    • 100+0.17290
    • 300+0.16055
    • 500+0.14820
    • 2000+0.14202
    • 5000+0.13832

    库存:0

    5N10-MS
      •  国内价格
      • 10+0.27364
      • 100+0.22296
      • 300+0.19751
      • 3000+0.15483
      • 6000+0.13964
      • 9000+0.13204

      库存:127792

      5N10-MS
        •  国内价格
        • 1+0.26620
        • 200+0.17160
        • 1500+0.14960
        • 3000+0.13200

        库存:5703