BC857S

www.msksemi.com BC857S Semiconductor Compiance BC857S DUAL TRANSISTOR (PNP+PNP) Isolated Transistor and Diode FEATURES Two transistors in one package z z Reduces number of components and board space No mutual interference between the transistors z SOT-363 MARKING: 3F MAXIMUM RATINGS(Ta=25℃ unless otherwise noted) Symbol Parameter Value Units VCBO Collector- Base Voltage -50 V VCEO Collector-Emitter Voltage -45 V VEBO Emitter-Base Voltage -5 V IC Collector Current -Continuous -0.2 A PC Collector Power Dissipation 0.3 W RθJA Thermal Resistance from Junction to Ambient 417 TJ Junction Temperature 150 ℃ Tstg Storage Temperature -55-150 ℃ stg ℃/W ELECTRICAL CHARACTERISTICS(Ta= 25℃ unless otherwise specified) Parameter Symbol Test conditions Min Typ M ax Unit Collector-base breakdown voltage V(BR)CBO Ic=-10µA,IE=0 -50 V Collector-emitter breakdown voltage V(BR)CEO Ic=-10mA,IB=0 -45 V Emitter-base breakdown voltage V(BR)EBO IE=-10µA,IC=0 -5 V Collector cut-off current ICBO VCB=-30V,IE=0 DC current gain hFE VCE=-5V,IC=-2mA -15 125 nA 630 VCE(sat)(1) IC=-10mA,IB=-0.5mA -0.3 V VCE(sat)(2) IC=-100mA,IB=-5mA -0.65 V -0.75 V -0.82 V Collector-emitter saturation voltage VBE(1) VCE=-5V,IC=-2mA VBE(2) VCE=-5V,IC=-10mA -0.6 Base-emitter voltage Transition frequency fT Collector output capacitance Cob Noise figure NF VCE=-5V,IC=-10mA,f=100MHz 200 MHz VCB=-10V,IE=0,f=1MHz 3.5 pF 2.5 dB VCE=-5V,Ic=-0.2mA, f=1kHZ,Rs=2KΩ,BW=200Hz www.msksemi.com BC857S Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions In Millimeters Min Max 0.900 1.100 0.000 0.100 0.900 1.000 0.150 0.350 0.100 0.150 2.000 2.200 1.150 1.350 2.150 2.400 0.650 TYP 1.200 1.400 0.525 REF 0.260 0.460 0° 8° Dimensions In Inches Min Max 0.035 0.043 0.000 0.004 0.035 0.039 0.006 0.014 0.004 0.006 0.079 0.087 0.045 0.053 0.085 0.094 0.026 TYP 0.047 0.055 0.021 REF 0.010 0.018 0° 8° REEL SPECIFICATION P/N PKG QTY BC857S SOT-363 3000 www.msksemi.com BC857S Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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