AZ4208-01F-MS

www.msksemi.com AZ4208-01F-MS Semiconductor Compiance Feature 80W peak pulse power per line (tP = 8/20μs) Replacement for MLV(0402) Bidirectional configurations Response time is typically < 1ns Low clamping voltage RoHS compliant Transient protection for data lines to IEC61000-4-2(ESD) ±30KV(air), ±30KV(contact); DFN1006P2X IEC61000-4-4 (EFT) 40A (5/50ns) Mechanical Characteristics Lead finish:100% matte Sn(Tin) Mounting position: Any Qualified max reflow temperature:260℃ Device meets MSL 2 requirements Pure tin plating: 7 ~ 17 um Pin flatness:≤3mil Applications Cellular phones Portable devices Digital cameras Power supplies Electrical characteristics per line@25℃ (unless otherwise specified) Parameter Symbol Peak Reverse Working Voltage Breakdown Voltage Reverse Leakage Current Maximum Reverse Peak Pulse Conditions Min. Typ. Max. Units 8 V 13.0 V 1.0 μA VRWM VBR It = 1mA IR 9.0 11.0 VRWM = 5V T=25℃ 5.0 IPP A Clamping Voltage VC IPP=1A 13 V Clamping Voltage VC IPP=3A 15 V Clamping Voltage VC IPP=5A 17 V 15 pF Junction Capacitance Cj VR=0V f = 1MHz 13 Absolute maximum rating@25℃ Rating Symbol Value Units Peak Pulse Power (tp=8/20μs) Ppp 80 W Operating Temperature TJ -55 to +150 ℃ Storage Temperature TSTG -55 to +150 ℃ www.msksemi.com AZ4208-01F-MS Semiconductor Compiance Electrical Parameter Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM IT Test Current VBR Breakdown Voltage @ IT 20 16 11.2 IR(nA) 11.0 10.8 12 8 4 10.6 10.4 -55 +25 +150 0 0 25 50 75 100 125 Temperature (ºC) Temperature (ºC) Fig .Typical Breakdown Voltage vs. Temperature Fig .Typical Leakage Current vs. Temperature 150 30 Pulse waveform: tp=8/20us 24 VC-Clamping Voltage (V) Breakdown Voltage (V) (VZ @ IZ) 11.4 18 12 6 0 0 2 4 6 8 IPP-Peak pulse current (A) Fig Clamping voltage vs. Peak pulse current www.msksemi.com AZ4208-01F-MS Semiconductor Compiance PACKAGE MECHANICAL DATA A Dim B C R D E MIN Millimeters MAX MIN MAX A 0.0125 0.02 0.32 0.52 B 0.000 0.002 0.00 0.05 C 0.037 0.043 0.95 1.080 D 0.022 0.027 0.55 0.680 E 0.016 0.024 0.40 0.60 F 0.008 0.012 0.20 0.30 H R F Inches 0.015Typ. 0.001 0.40Typ. 0.005 0.05 0.15 H 1.20 0.50 0.60 0.70 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. REEL SPECIFICATION P/N PKG AZ4208-01F-MS DFN1006P2X QTY 12000 www.msksemi.com AZ4208-01F-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. 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