HEF4555BP

HEF4555B 1-of-4 decoder/demultiplexer Rev. 5 — 18 November 2011 Product data sheet 1. General description The HEF4555B contains two 1-of-4 decoders/demultiplexers. Each has two address inputs (nA0 and nA1, an active LOW enable input (nE) and four mutually exclusive outputs which are active HIGH (nY0 to nY3). When used as a decoder, nE when HIGH, forces nY0 to nY3 LOW. When used as a demultiplexer, the appropriate output is selected by the information on nA0 and nA1 with nE as data input. All unselected outputs are LOW. It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS (usually ground). Unused inputs must be connected to VDD, VSS, or another input. 2. Features and benefits      Fully static operation 5 V, 10 V, and 15 V parametric ratings Standardized symmetrical output characteristics Specified from 40 C to +85 C Complies with JEDEC standard JESD 13-B 3. Applications  Code conversion  Address decoding  Demultiplexing: when using the enable input as data input 4. Ordering information Table 1. Ordering information All types operate from 40 C to +85 C. Type number Package Name Description Version HEF4555BP DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 HEF4555BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 5. Functional diagram 1Y0 4 nY0 2 1A0 1Y1 5 DECODER nA0 1Y2 6 3 1A1 1Y3 7 nY1 1 1E nA1 2Y0 12 14 2A0 nY2 2Y1 11 DECODER 2Y2 10 13 2A1 2Y3 9 nE nY3 15 2E 001aae753 001aae751 Fig 1. Functional diagram Fig 2. Logic diagram for one decoder/multiplexer 6. Pinning information 6.1 Pinning HEF4555B 1E 1 16 VDD 1A0 2 15 2E 1A1 3 14 2A0 1Y0 4 13 2A1 1Y1 5 12 2Y0 1Y2 6 11 2Y1 1Y3 7 10 2Y2 VSS 8 9 2Y3 001aae752 Fig 3. Pin configuration HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 2 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 6.2 Pin description Table 2. Pin description Symbol Pin Description 1A0, 1A1, 2A0, 2A1 2, 3, 14, 13 address input 1E, 2E 1, 15 enable input (active LOW 1Y0, 1Y1, 1Y2, 1Y3, 2Y0, 2Y1, 2Y2, 2Y3 4, 5, 6, 7, 12, 11, 10, 9 output (active HIGH) VDD 16 supply voltage VSS 8 ground (GND) 7. Functional description Table 3. Function selection[1] Inputs Outputs nE nA0 nA1 nY0 nY1 nY2 nY3 L L L H L L L L H L L H L L L L H L L H L L H H L L L H H X X L L L L [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD supply voltage IIK input clamping current Conditions Min Max Unit 0.5 +18 V VI < 0.5 V or VI > VDD + 0.5 V - 10 mA 0.5 VDD + 0.5 V VO < 0.5 V or VO > VDD + 0.5 V - 10 mA VI input voltage IOK output clamping current II/O input/output current - 10 mA IDD supply current - 50 mA Tstg storage temperature 65 +150 C Tamb ambient temperature 40 +85 C DIP16 package [1] - 750 mW SO16 package [2] - 500 mW - 100 mW total power dissipation Ptot P power dissipation per output [1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C. [2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 3 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 9. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VDD Conditions Min Typ Max Unit supply voltage 3 - 15 V VI input voltage 0 - VDD V Tamb ambient temperature in free air 40 - +85 C t/V input transition rise and fall rate VDD = 5 V - - 3.75 s/V VDD = 10 V - - 0.5 s/V VDD = 15 V - - 0.08 s/V 10. Static characteristics Table 6. Static characteristics VSS = 0 V; VI = VSS or VDD unless otherwise specified. Symbol Parameter VIH VIL VOH VOL IOH IOL HIGH-level input voltage LOW-level input voltage Conditions Tamb = 25 C Tamb = 85 C Min Max Min Max Min Max 5V 3.5 - 3.5 - 3.5 - V 10 V 7.0 - 7.0 - 7.0 - V 15 V 11.0 - 11.0 - 11.0 - V 5V - 1.5 - 1.5 - 1.5 V 10 V - 3.0 - 3.0 - 3.0 V 15 V - 4.0 - 4.0 - 4.0 V VDD IO < 1 A IO < 1 A HIGH-level output voltage IO < 1 A; VI = VSS or VDD Tamb = 40 C Unit 5V 4.95 - 4.95 - 4.95 - V 10 V 9.95 - 9.95 - 9.95 - V 15 V 14.95 - 14.95 - 14.95 - V 5V - 0.05 - 0.05 - 0.05 V 10 V - 0.05 - 0.05 - 0.05 V 15 V - 0.05 - 0.05 - 0.05 V HIGH-level output current VO = 2.5 V 5V - 1.7 - 1.4 - 1.1 mA VO = 4.6 V 5V - 0.52 - 0.44 - 0.36 mA VO = 9.5 V 10 V - 1.3 - 1.1 - 0.9 mA VO = 13.5 V 15 V - 3.6 - 3.0 - 2.4 mA VO = 0.4 V 5V 0.52 - 0.44 - 0.36 - mA VO = 0.5 V 10 V 1.3 - 1.1 - 0.9 - mA LOW-level output voltage LOW-level output current IO < 1 A; VI = VSS or VDD VO = 1.5 V 15 V 3.6 - 3.0 - 2.4 - mA II input leakage current VDD = 15 V 15 V - 0.3 - 0.3 - 1.0 A IDD supply current IO = 0 A; VI = VSS or VDD 5V - 20 - 20 - 150 A 10 V - 40 - 40 - 300 A 15 V - 80 - 80 - 600 A - - - - 7.5 - - pF CI input capacitance HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 4 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 11. Dynamic characteristics Table 7. Dynamic characteristics VSS = 0 V; Tamb = 25 C; for test circuit see Figure 5; unless otherwise specified. Symbol tPHL Parameter Conditions HIGH to LOW propagation delay nAn  nYn; see Figure 4 nE  nYn VDD Min Typ Max Unit 88 ns + (0.55 ns/pF)CL - 115 230 ns 10 V 34 ns + (0.23 ns/pF)CL - 45 90 ns 15 V 22 ns + (0.16 ns/pF)CL - 30 65 ns 5V 98 ns + (0.55 ns/pF)CL - 125 250 ns 10 V 39 ns + (0.23 ns/pF)CL - 50 95 ns 5V Extrapolation formula [1] 22 ns + (0.16 ns/pF CL - 30 65 ns 113 ns + (0.55 ns/pF)CL - 140 280 ns 10 V 44 ns + (0.23 ns/pF)CL - 55 105 ns 15 V 32 ns + (0.16 ns/pF)CL - 40 75 ns 5V 123 ns + (0.55 ns/pF)CL - 150 295 ns 10 V 44 ns + (0.23 ns/pF)CL - 55 110 ns 32 ns + (0.16 ns/pF)CL - 40 75 ns 10 ns + (1.00 ns/pF)CL - 60 120 ns 10 V 9 ns + (0.42 ns/pF)CL - 30 60 ns 15 V 6 ns + (0.28 ns/pF)CL - 20 40 ns 15 V LOW to HIGH propagation delay tPLH nAn  nYn nE  nYn 5V [1] 15 V transition time tt on nYn 5V [1][2] [1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF). [2] Transition time tt is the same as the HIGH to LOW and LOW to HIGH transition times tTHL and tTLH. Table 8. Dynamic power dissipation PD PD can be calculated from the formulas shown. VSS = 0 V; tr = tf  20 ns; Tamb = 25 C. Symbol Parameter PD dynamic power dissipation VDD Typical formula for PD (W) Where: PD = 4500  fi + (fo  CL)  VDD2 fi = input frequency in MHz, 10 V PD = 18800  fi + (fo  CL)  VDD2 fo = output frequency in MHz, 15 V PD = 45700  fi + (fo  CL)  VDD2 CL = output load capacitance in pF, 5V VDD = supply voltage in V, (fo  CL) = sum of the outputs. HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 5 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 12. Waveforms VDD 0.5VM nAn, nE input GND tPHL tPLH VOH nYn output 0.5VM VOL tTHL tTLH 001aal114 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 4. Inputs nAn and nE to output nYn propagation delays Table 9. Measurement points Supply voltage Input Output VDD VM VM 5 V to 15 V 0.5VDD 0.5VDD HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 6 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VEXT VDD VI VO G DUT RT CL 001aal115 Test data is given in Table 10. Definitions for test circuit: Device Under Test (DUT); RL = Load resistance; CL = Load capacitance including jig and probe capacitance; RT = Termination resistance should be equal to the output impedance Zo of the pulse generator; VEXT = External voltage for measuring switching times. Fig 5. Load circuitry for switching times Table 10. Test data Supply voltage 5 V to 15 V HEF4555B Product data sheet Input Load VEXT VI tr = tf CL tPLH, tPHL tTHL, tTLH VDD  20 ns 50 pF open VDD All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 7 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 95-01-14 03-02-13 SOT38-4 Fig 6. EUROPEAN PROJECTION Package outline SOT38-4 (DIP16) HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 8 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 7. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT109-1 (SO16) HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 9 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes HEF4555B v.5 20111118 Product data sheet - HEF4555B v.4 Modifications: • Table 6: IOH minimum values changed to maximum HEF4555B v.4 20100106 Product data sheet - HEF4555B_CNV v.3 HEF4555B_CNV v.3 19950101 Product specification - HEF4555B_CNV v.2 HEF4555B_CNV v.2 19950101 Product specification - - HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 10 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 11 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com HEF4555B Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 18 November 2011 © NXP B.V. 2011. All rights reserved. 12 of 13 HEF4555B NXP Semiconductors 1-of-4 decoder/demultiplexer 17. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 November 2011 Document identifier: HEF4555B