74HC4020; 74HCT4020
14-stage binary ripple counter
Rev. 6 — 3 February 2016
Product data sheet
1. General description
The 74HT4020; 74HCT4020 is a 14-stage binary ripple counter with a clock input (CP), an
overriding asynchronous master reset input (MR) and 12 buffered parallel outputs (Q0,
and Q3 to Q13). The counter advances on the HIGH-to-LOW transition of CP. A HIGH on
MR clears all counter stages and forces all outputs LOW, independent of the state of CP.
Each counter stage is a static toggle flip-flop. This device features reduced input threshold
levels to allow interfacing to TTL logic levels. Inputs also include clamp diodes, this
enables the use of current limiting resistors to interface inputs to voltages in excess of
VCC.
2. Features and benefits
Wide supply voltage range from 2.0 V to 6.0 V
Input levels:
For 74HC4020: CMOS level
For 74HCT4020: TTL level
Multiple package options
Complies with JEDEC standard no. 7A
Specified from 40 C to +85 C and from 40 C to +125 C
3. Applications
Frequency dividing circuits
Time delay circuits
Control counters
4. Ordering information
Table 1.
Ordering information
Type number
74HC4020D
Package
Temperature range
Name
Description
Version
40 C to +125 C
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
40 C to +125 C
SSOP16
plastic shrink small outline package; 16 leads; body SOT338-1
width 5.3 mm
74HCT4020D
74HC4020DB
74HCT4020DB
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
Table 1.
Ordering information …continued
Type number
74HC4020PW
Package
Temperature range
Name
Description
Version
40 C to +125 C
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
40 C to +125 C
DHVQFN16 plastic dual in-line compatible thermal enhanced
SOT763-1
very thin quad flat package; no leads; 16 terminals;
body 2.5 3.5 0.85 mm
74HCT4020PW
74HC4020BQ
74HCT4020BQ
5. Functional diagram
&3
05
7
67$*(&2817(5
&'
4 4 4 4 4 4 4 4 4 4 4 4
DDO
Fig 1.
Functional diagram
&75
&3
05
4
4
&7
4
4
4
4
4
4
4
4
4
4
Logic symbol
74HC_HCT4020
Product data sheet
&7
DDO
DDO
Fig 2.
Fig 3.
IEC logic symbol
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
4
4
))
7
&3
))
7
4
4
4
5'
4
))
7
5'
4
))
7
4
))
7
4
5'
4
5'
5'
05
4
4
4
DDO
Fig 4.
Logic diagram
6. Pinning information
6.1 Pinning
WHUPLQDO
LQGH[DUHD
+&
+&7
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
05
4
&3
*1'
4
4
9&&
05
&3
4
4
9&&
*1'
4
4
9&&
4
+&
+&7
DDO
7UDQVSDUHQWWRSYLHZ
DDO
(1) The substrate is attached to this pad using conductive
die attach material. It cannot be used as supply pin or
input. It is recommended that no connection is made at
all.
Fig 5.
Pin configuration SO16, SSOP16 and
TSSOP16
Fig 6.
Pin configuration DHVQFN16
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
Q0, Q3 to Q13
9, 7, 5, 4, 6, 13, 12, 14, 15, 1, 2, 3
output
GND
8
ground (0 V)
CP
10
clock input (HIGH-to-LOW, edge-triggered)
MR
11
master reset input (active HIGH)
VCC
16
positive supply voltage
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
7. Functional description
Table 3.
Function table
Input
Output
CP
MR
Q0, Q3 to Q13
L
no change
L
count
X
H
L
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; = LOW-to-HIGH clock transition; = HIGH-to-LOW clock transition.
7.1 Timing diagram
&3LQSXW
05LQSXW
4
4
4
4
4
4
4
4
4
4
4
4
DDO
Fig 7.
Timing diagram
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
VCC
supply voltage
0.5
+7
V
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
-
20
mA
IOK
output clamping current
VI < 0.5 V or VI > VCC + 0.5 V
-
20
mA
IO
output current
0.5 V < VO < VCC + 0.5 V
-
25
mA
ICC
supply current
-
50
mA
IGND
ground current
-
50
mA
Tstg
storage temperature
65
+150
C
-
500
mW
Tamb = 40 C to +125 C
total power dissipation
Ptot
Min
Unit
[1]
SO16, SSOP16, TSSOP16 and
DHVQFN16 packages
[1]
Max
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN16 package: Ptot derates linearly with 4.5 mW/K above 60 C.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol Parameter
VCC
supply voltage
Conditions
74HC4020
74HCT4020
Unit
Min
Typ
Max
Min
Typ
Max
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
VCC
0
-
VCC
V
VO
output voltage
0
-
VCC
0
-
VCC
V
t/V
input transition rise and
fall rate
Tamb
ambient temperature
74HC_HCT4020
Product data sheet
except for
Schmitt trigger inputs
VCC = 2.0 V
-
-
625
-
-
-
ns/V
VCC = 4.5 V
-
1.67
139
-
1.67
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
40
+25
+125
40
+25
+125
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
C
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
10. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V
1.5
1.2
-
1.5
-
1.5
-
V
VCC = 4.5 V
3.15
2.4
-
3.15
-
3.15
-
V
VCC = 6.0 V
4.2
3.2
-
4.2
-
4.2
-
V
VCC = 2.0 V
-
0.8
0.5
-
0.5
-
0.5
V
VCC = 4.5 V
-
2.1
1.35
-
1.35
-
1.35
V
VCC = 6.0 V
-
2.8
1.8
-
1.8
-
1.8
V
IO = 20 A; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = 20 A; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = 20 A; VCC = 6.0 V
5.9
6.0
-
5.9
-
5.9
-
V
IO = 4.0 mA; VCC = 4.5 V
3.98
4.32
-
3.84
-
3.7
-
V
IO = 5.2 mA; VCC = 6.0 V
5.48
5.81
-
5.34
-
5.2
-
V
IO = 20 A; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 20 A; VCC = 6.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.26
-
0.33
-
0.4
V
IO = 5.2 mA; VCC = 6.0 V
-
0.16
0.26
-
0.33
-
0.4
V
74HC4020
VIH
VIL
VOH
VOL
HIGH-level
input voltage
LOW-level
input voltage
HIGH-level
output voltage
LOW-level
output voltage
VI = VIH or VIL
VI = VIH or VIL
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
-
0.1
-
1
-
1
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
8.0
-
80
-
160
A
CI
input
capacitance
-
3.5
-
-
-
-
-
pF
74HCT4020
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
1.6
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
1.2
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
VOL
II
IO = 20 A
4.4
4.5
-
4.4
-
4.4
-
V
IO = 4.0 mA
3.98
4.32
-
3.84
-
3.7
-
V
IO = 20 A; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 4.5 V
-
0.15
0.26
-
0.33
-
0.4
V
-
-
0.1
-
1
-
1
A
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 C
Conditions
Min
Typ
Max
Min
Max
Min
Max
-
-
8.0
-
80
-
160
A
pin MR
-
110
396
-
495
-
539
A
pin CP
-
85
306
-
383
-
417
A
-
3.5
-
-
-
-
-
pF
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
ICC
additional
supply current
VI = VCC 2.1 V; IO = 0 A;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V
CI
40 C to +85 C 40 C to +125 C Unit
input
capacitance
11. Dynamic characteristics
Table 7.
Dynamic characteristics
GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
Symbol Parameter
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V; CL = 50 pF
-
39
140
-
175
-
210
ns
VCC = 4.5 V; CL = 50 pF
-
14
28
-
35
-
42
ns
VCC = 5.0 V; CL = 15 pF
-
11
-
-
-
-
-
ns
VCC = 6.0 V; CL = 50 pF
-
11
24
-
30
-
36
ns
VCC = 2.0 V; CL = 50 pF
-
22
75
-
95
-
110
ns
VCC = 4.5 V; CL = 50 pF
-
8
15
-
19
-
22
ns
VCC = 5.0 V; CL = 15 pF
-
6
-
-
-
-
-
ns
VCC = 6.0 V; CL = 50 pF
-
6
13
-
16
-
19
ns
HIGH to LOW MR to Qn; see Figure 8
propagation
VCC =2.0 V; CL = 50 pF
delay
VCC = 4.5 V; CL = 50 pF
-
55
170
-
215
-
225
ns
-
20
34
-
43
-
51
ns
VCC = 5.0 V; CL = 15 pF
-
17
-
-
-
-
-
ns
-
16
29
-
37
-
43
ns
VCC = 2.0 V; CL = 50 pF
-
19
75
-
95
-
110
ns
VCC = 4.5 V; CL = 50 pF
-
7
15
-
19
-
22
ns
VCC = 6.0 V; CL = 50 pF
-
6
13
-
16
-
19
ns
74HC4020
tpd
propagation
delay
[1]
CP to Q0; see Figure 8
Qn to Qn+1; see Figure 9
tPHL
VCC = 6.0 V; CL = 50 pF
tt
transition
time
74HC_HCT4020
Product data sheet
[2]
Qn; see Figure 8
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Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
Table 7.
Dynamic characteristics …continued
GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
Symbol Parameter
tW
pulse width
25 C
Conditions
40 C to +85 C 40 C to +125 C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 2.0 V; CL = 50 pF
80
14
-
100
-
120
-
ns
VCC = 4.5 V; CL = 50 pF
16
4
-
20
-
24
-
ns
VCC = 6.0 V; CL = 50 pF
14
3
-
17
-
20
-
ns
VCC = 2.0 V; CL = 50 pF
80
17
-
100
-
120
-
ns
VCC = 4.5 V; CL = 50 pF
16
6
-
20
-
24
-
ns
VCC = 6.0 V; CL = 50 pF
14
5
-
17
-
20
-
ns
VCC = 2.0 V; CL = 50 pF
50
6
-
65
-
75
-
ns
VCC = 4.5 V; CL = 50 pF
10
2
-
13
-
15
-
ns
VCC = 6.0 V; CL = 50 pF
9
2
-
11
-
13
-
ns
VCC = 2.0 V; CL = 50 pF
6.0
30
-
4.8
-
4.0
-
MHz
VCC = 4.5 V; CL = 50 pF
30
92
-
24
-
20
-
MHz
CP HIGH or LOW;
see Figure 8
MR HIGH; see Figure 8
trec
fmax
CPD
recovery time MR to CP; see Figure 8
maximum
frequency
see Figure 8
VCC = 5.0 V; CL = 15 pF
-
101
-
-
-
-
-
MHz
VCC = 6.0 V; CL = 50 pF
35
109
-
28
-
24
-
MHz
-
19
-
-
-
-
-
pF
VCC = 4.5 V; CL = 50 pF
-
18
36
-
45
-
54
ns
VCC = 5.0 V; CL = 15 pF
-
15
-
-
-
-
-
ns
VCC = 4.5 V; CL = 50 pF
-
8
15
-
19
-
22
ns
VCC = 5.0 V; CL = 15 pF
-
6
-
-
-
-
-
ns
HIGH to LOW MR to Qn; see Figure 8
propagation
VCC = 4.5 V; CL = 50 pF
delay
VCC = 5.0 V; CL = 15 pF
-
22
45
-
56
-
68
ns
-
19
-
-
-
-
-
ns
-
7
15
-
19
-
22
ns
20
7
-
25
-
30
-
ns
20
8
-
25
-
30
-
ns
10
2
-
13
-
15
-
ns
[3]
power
dissipation
capacitance
74HCT4020
tpd
propagation
delay
[1]
CP to Q0; see Figure 8
Qn to Qn+1; see Figure 9
tPHL
tt
transition
time
Qn; see Figure 8
tW
pulse width
CP HIGH or LOW;
see Figure 8
[2]
VCC = 4.5 V; CL = 50 pF
VCC = 4.5 V; CL = 50 pF
MR HIGH; see Figure 8
VCC = 4.5 V; CL = 50 pF
trec
recovery time MR to CP; see Figure 8
VCC = 4.5 V; CL = 50 pF
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
Table 7.
Dynamic characteristics …continued
GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10
Symbol Parameter
fmax
maximum
frequency
25 C
Conditions
VCC = 4.5 V; CL = 50 pF
[3]
power
dissipation
capacitance
[1]
tpd is the same as tPHL and tPLH.
[2]
tt is the same as tTHL and tTLH.
[3]
Min
Typ
Max
Min
Max
Min
Max
25
47
-
20
-
17
-
MHz
-
52
-
-
-
-
-
MHz
-
20
-
-
-
-
-
pF
see Figure 8
VCC = 5.0 V; CL = 15 pF
CPD
40 C to +85 C 40 C to +125 C Unit
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
(CL VCC2 fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in V.
12. Waveforms
9,
90
05LQSXW
W:
WUHF
9,
IPD[
90
&3LQSXW
W3+/
W3/+
W:
4RU4Q
RXWSXW
W3+/
90
W7/+
W7+/
DDG
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
Clock timing, propagation delays, pulse widths and measurement points
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
92+
4QRXWSXW
90
92/
W3/+
W3+/
92+
90
4QRXWSXW
92/
DDL
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 9.
Waveforms showing the output Qn to output Qn+1 propagation delays
Table 8.
Measurement points
Type
Input
Output
VM
VM
74HC4020
0.5 VCC
0.5 VCC
74HCT4020
1.3 V
1.3 V
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
9,
QHJDWLYH
SXOVH
W:
90
*1'
9,
WI
WU
WU
WI
SRVLWLYH
SXOVH
*1'
90
90
90
W:
9&&
*
9,
92
'87
57
&/
DDK
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
Fig 10. Test circuit for measuring switching times
Table 9.
Test data
Type
Input
VI
Load
tr, tf
CL
74HC4020
VCC
6 ns
15 pF, 50 pF
74HCT4020
3V
6 ns
15 pF, 50 pF
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
13. Package outline
62SODVWLFVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
627
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287/,1(
9(56,21
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-(,7$
(8523($1
352-(&7,21
,668('$7(
Fig 11. Package outline SOT109-1 (SO16)
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
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74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 19
74HC4020; 74HCT4020
NXP Semiconductors
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74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
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74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
14. Abbreviations
Table 10.
Abbreviations
Acronym
Abbreviation
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
15. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74HC_HCT4020 v.6
20160203
Product data sheet
-
74HC_HCT4020 v.5
Modifications:
74HC_HCT4020 v.5
Modifications:
74HC_HCT4020 v.4
Modifications:
74HC_HCT4020 v.3
•
Type numbers 74HC4020N and 74HCT4020N (SOT38-4) removed.
20120806
•
Product data sheet
74HC_HCT4020 v.4
Product data sheet
-
74HC_HCT4020 v.3
Product data sheet
-
74HC_HCT4020_CNV v.2
Product specification
-
-
Legal pages updated.
20100120
74HC_HCT4020_CNV v.2 19970901
74HC_HCT4020
-
Measurement points added to figure 8 (errata).
20111213
•
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
16 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT4020
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
17 of 19
74HC4020; 74HCT4020
NXP Semiconductors
14-stage binary ripple counter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT4020
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 3 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
18 of 19
NXP Semiconductors
74HC4020; 74HCT4020
14-stage binary ripple counter
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 February 2016
Document identifier: 74HC_HCT4020