Glass Tube Fuses
FSD Series / 5.2×20 mm, Fast Acting Type
I-T Characteristics / 時間-電流特性
Ampere Rating
額定電流
% of Ampere Rating
額定電流%
200mA~6.3A
Opening Time
熔斷時間
1 Hr Min. / 最短1小時
150%
8A~15A
30min Min. / 最短30分鐘
200mA~15A
210%
30min Max. / 最長30分鐘
200mA~15A
275%
50ms Min. 2s Max. / 最短50毫秒,最長2秒
200mA~6.3A
10ms Min. 300ms Max. / 最短10毫秒,最長300毫秒
400%
8.0A~15A
200mA~6.3A
10ms Min. 400ms Max. / 最短10毫秒,最長400毫秒
20ms Max. / 最長20毫秒
1000%
8.0A~15A
40ms Max. / 最長40毫秒
In accordance with IEC60127-2 standard, sheet2 / 遵循IEC60127-2, 規格單2
Product Features / 產品特性
Materials
材質
Operating Temperature
操作溫度
Solderability
可焊性
Resistance to
Soldering Heat
耐焊接熱
Recommended
Soldering Parameters
建議焊錫參數
Storage Conditions
儲存條件
Dimensions / 尺寸圖
Body / 本體:Glass tube / 玻璃管
Lead / 引線:Tinned copper wire / 鍍錫銅線
Cap / 銅帽:Brass with nickel plated / 銅鍍鎳
Element / 熔絲:Alloy / 合金線
(Unit / 單位:mm)
20±0.5
5.1±0.6
-55℃ to +125℃ (Consider de-rating / 需考慮溫度折減)
Ø5.2+0.1
-0.2
260℃, ≤ 3s. (Wave / 波峰焊)
350±10℃, ≤ 3s. (Soldering iron / 烙鐵焊)
260℃, 10s. (Wave / 波峰焊)
350℃, 5s. (Soldering iron / 烙鐵焊)
38±2
Wave soldering parameter / 波峰焊
Soldering pot temperature / 錫爐溫度:260℃ Max
Solder dwell time / 焊接時間:2∼5s
21.5±1
Ø0.8±0.02
Ø5.9±0.2
Hand welding parameter / 手工焊
Soldering iron temperature / 烙鐵溫度:350±5℃
Solder dwell time / 焊接時間:5s Max.
Can be stored for 3 years under tight seal condition at
temperature of +10℃~60℃, relative humidity ≤ 75%.
在溫度+10℃~60℃,相對濕度 ≤ 75% 的密閉條件下可存放 3 年。
At most can be kept 30 days at temperature +10℃~60℃,
relative humidity ≤ 95% under covered conditions.
在溫度+10℃~60℃,相對濕度為 95% 的非露天下最多可存放 30 天。
Electrical Characteristics / 電氣特性
Rated Voltage
Breaking Capacity
額定電流
額定電壓
分斷能力
200mA
250V
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250mA
250V
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315mA
250V
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400mA
250V
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500mA
250V
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630mA
250V
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800mA
250V
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1.00A
250V
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1.25A
250V
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1.60A
250V
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2.00A
250V
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2.50A
250V
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3.15A
250V
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4.00A
250V
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5.00A
250V
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6.30A
250V
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8.00A
125V/250V
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10.0A
125V/250V
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12.0A
125V/250V
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15.0A
125V/250V
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Remark: *FSD 8A~15A approved KC
37
Safety Approvals 安全認證
Rated Current
200mA~3.15A
35A@250V AC
4A~15A
10IN@250V AC
250V only. *125V Voltage only for
,
and
.
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