50-02-1030-0000-55E

CHO-BOND® 1030 ONE COMPONENT FLEXIBLE ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE Customer Value Proposition: CHO-BOND 1030 is a silver plated copper filled, one-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND 1030 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines, less than 0.010 inches (0.25mm), and should not be used as an EMI caulk where bond lines are greater than 0.010 inches (0.25 mm). No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1030 a good choice for a variety of commercial and military applications. CHO-BOND 1030’s moisture cure silicone polymer system allows it to cure to the touch in 24hrs and provides a robust conductive bond over a wide range of application temperatures. For best adhesion results, CHO-BOND 1030 should be used in conjunction with CHO-SHIELD 1086 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing around EMI vents and windows. Features and Benefits: Contact Information: Parker Hannifin Corporation Chomerics Division 77 Dragon Court Woburn, MA 01801 phone 781 935 4850 fax 781 933 4318 chomailbox@parker.com www.chomerics.com www.parker.com/chomerics • One component • Easy to use, no weighing or mixing required. • Silver plated copper filler • Good conductivity 0.050 ohm-cm. • No VOCs • Minimal shrinkage. • Moisture cure silicone • Flexible, 30 minute working life, rapid skin formation, > 200 psi lap shear strength, 24 hr handling time, wide range of application temperatures. 1 week for full cure. • Non corrosive cure mechanism • No corrosive by-products generated during curing to damage substrate. • Medium paste • Can be used on overhead or vertical surfaces. CHO-BOND 1030 - Product Information Table 1 Typical Properties CHO-BOND 1030 Typical Properties Typical Values Polymer Filler Mix Ratio, A : B (by weight) Color Test Method Silicone N/A Silver-Plated Copper N/A 1-part N/A Light Gray N/A (Q) Consistency Medium Paste N/A (Q) Maximum DC Volume Resistivity 0.050 ohm-cm CHO-95-40-5555* (Q/C) Minimum Lap Shear Strength** 200 psi (1379 kPa) CHO-95-40-5300* (Q/C) 8.0 lb./inch (1401 N/m) CHO-95-40-5302* (Q/C) 3.8 ASTM D792 (Q/C) 77 Shore A ASTM-D2240 (Q/C) - 55°C to 200°C (-67 °F to 392 °F) N/A (Q) None N/A 1 week*** N/A (Q) 0.5 hour N/A (Q) 6 months @ 25°C (77°F) N/A (Q) Minimum thickness recommended N/A N/A Maximum thickness recommended 0.010 in (0.25 mm) N/A 0 g/l Calculated Minimum Peel Strength** Specific Gravity Hardness Continuous Use Temperature Elevated Temperature Cure Cycle Room Temperature Cure Working Life Shelf Life, unopened Volatile Organic Content (VOC) Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) 2 775 in (5000 cm ) N/A Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) 50 feet (15.2 m) N/A 2 Note: N/A – Not Applicable, (Q/C) - Qualification and Conformance Test, (Q) - Qualification Test * This test Method is available from Parker Chomerics. ** Minimum values listed are based on using the CHO-SHIELD 1086 primer that typically comes bundled with the CHO-BOND. *** Cure is sufficient for handling in 24 hours. Full specification properties are developed after 1 week (168 hours) at room temperature. Table 2 Ordering Information Product CHO-BOND 1030 Weight (grams) Packaging Part Number Primer Included 113.4 1.5 fluid ounce aluminum foil tube 50-02-1030-0000 1086 113.4 1.5 fluid ounce aluminum foil tube 50-02-1030-1000 No 454 6 fluid ounce SEMCO cartridge 50-01-1030-0000 1086 Please refer to Parker Chomerics Surface Preparation and CHO-BOND Application documents for information regarding the proper surface preparation, primer application (if required), and use of these compounds. www.parker.com/chomerics CHOMERICS and CHO-BOND is a registered trademark of Parker Hannifin Corporation. ® 2020 TB 1133 EN July 2020