50-02-1075-1000

厂商：
PARKERCHOMERICS
封装：
描述：
SILVER AL EMI SEALANT 57G

数据手册：

下载50-02-1075-1000.pdf

立即购买

详情介绍
数据手册
价格&库存

50-02-1075-1000 数据手册

CHO-BOND® 1075 ONE COMPONENT CORROSION RESISTANT ELECTRICALLY CONDUCTIVE SILICONE SEALANT Customer Value Proposition: CHO-BOND 1075 is a silver plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. Features and Benefits: • One component • Easy to use, no weighing or mixing required. • Silver plated aluminum filler • Excellent conductivity 0.010 ohm-cm outstanding galvanic corrosion resistance against aluminum substrates. • No VOCs • Minimal shrinkage. • Moisture cure silicone • 15 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure. • Light weight • More coverage per gram of material, minimal weight added to assembly or vehicle. • Non corrosive cure mechanism • No corrosive by-products generated during curing to damage substrate. • Dry medium paste • Can be used on overhead or vertical surfaces. Contact Information: Parker Hannifin Corporation Chomerics Division 77 Dragon Court Woburn, MA 01801 phone 781 935 4850 fax 781 933 4318 chomailbox@parker.com www.chomerics.com www.parker.com/chomerics CHO-BOND 1075 - Product Information Table 1 Typical Properties CHO-BOND 1075 Typical Properties Typical Values Polymer Filler Silicone N/A Silver-Plated Aluminum N/A 1-part N/A Gray N/A Mix Ratio, A : B (by weight) Color Consistency Test Method (Q) Dry Medium Paste N/A (Q) Maximum DC Volume Resistivity 0.010 ohm-cm CHO-95-40-5555* (Q/C) Minimum Lap Shear Strength** 100 psi (689 kPa) CHO-95-40-5300* (Q/C) 4.0 lb./inch (700 N/m) CHO-95-40-5302* (Q/C) Minimum Peel Strength** Specific Gravity 2.0 ASTM D792 (Q/C) 81 Shore A ASTM-D2240 (Q/C) - 55°C to 200°C (-67 °F to 392 °F) N/A (Q) Hardness Continuous Use Temperature Elevated Temperature Cure Cycle None N/A Room Temperature Cure 1 week*** N/A (Q) Working Life 0.25 hour N/A (Q) 6 months @ 25°C (77°F) N/A (Q) Minimum thickness recommended 0.010 in (0.25 mm) N/A Maximum thickness recommended 0.125 in (3.18 mm) N/A 0 g/l Calculated 1375 in2 (8871 cm2) N/A 90 feet (27.4 m) N/A Shelf Life, unopened Volatile Organic Content (VOC) Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) Notes: N/A – Not Applicable, (Q/C) - Qualification and Conformance Test, (Q) - Qualification Test * This test Method is available from Parker Chomerics. ** Minimum values listed are based on using the CHO-SHIELD 1086 primer that typically comes bundled with the CHO-BOND. *** Cure is sufficient for handling in 24 hours. Full specification properties are developed after 1 week (168 hours) at room temperature. Table 2 Ordering Information Product CHO-BOND 1075 Weight (grams) Packaging Part Number Primer Included 71 1.5 fluid ounce foil tube 50-02-1075-0000 1086 71 1.5 fluid ounce foil tube 50-02-1075-1000 No 284 6 fluid ounce SEMCO cartridge 50-01-1075-0000 1086 Packaging Part Number Table 3 Primer Ordering Information Product CHO-BOND 1086 Weight (grams) 10 3 gram glass vial 50-10-1086-0000 95 4 fluid ounce glass bottle 50-04-1086-0000 375 1 pint can 50-01-1086-0000 Please refer to Parker Chomerics Surface Preparation and CHO-BOND Application documents for information regarding the proper surface preparation, primer application (if required), and use of these compounds. www.chomerics.com www.parker.com/chomerics CHOMERICS and CHO-BOND is a registered trademark of Parker Hannifin Corporation. ® 2013 TB 1131 EN January 2014

下载 PDF

50-02-1075-1000

物料型号：CHO-BOND 1075

器件简介： - 该产品是一种单组分的导电硅酮密封剂，填充有镀银铝粉，设计用于电气外壳的缝隙填充和接缝密封，以实现电磁干扰屏蔽或电气接地。 - 推荐最小粘合线宽度为0.010英寸（0.25毫米）。 - 也可用于EMI垫圈修复、粘接和附着，适用于需要中等强度（100 psi）的应用。 - 镀银铝填料提供出色的电偶腐蚀抗性。 - 无挥发性有机化合物（VOCs），固化时收缩量小。

引脚分配：不适用，因为这是一个密封剂产品，不是电子元件。

参数特性： - 聚合物类型：硅酮 - 填料：镀银铝 - 混合比例：单组分 - 颜色：灰色 - 一致性：干介质膏体 - 最大直流体积电阻率：0.010欧姆-厘米 - 最小搭接剪切强度：100 psi（689 kPa） - 最小剥离强度：4.0磅/英寸（700 N/m） - 比重：2.0 - 硬度：81 Shore A - 连续使用温度：-55°C至200°C - 工作寿命：0.25小时 - 保质期（未开封）：6个月25°C（77°F） - 推荐最小厚度：0.010英寸（0.25毫米） - 推荐最大厚度：0.125英寸（3.18毫米） - 挥发性有机化合物含量（VOC）：0 g/l - 理论覆盖面积（每磅0.010英寸厚）：1375平方英寸（8871平方厘米） - 理论覆盖长度（每磅1/8英寸直径珠）：90英尺（27.4米）

功能详解： - 单组分，易于使用，无需称量或混合。 - 镀银铝填料提供出色的电导率和对铝基材的电偶腐蚀抗性。 - 轻质，固化机制不腐蚀。 - 干燥介质膏体，易于操作。 - 15分钟工作寿命，快速形成表皮，24小时可操作，固化过程中无需施加压力，适用于广泛的应用温度。 - 每克材料覆盖更多面积，对组装或车辆增加的重量最小。 - 固化过程中不产生腐蚀性副产品，不会损坏基材。 - 可应用于垂直或顶部表面。

应用信息： - 典型应用包括便携式电子设备、雷达和通信系统、EMI通风口、军用地面车辆和掩体。

封装信息： - 产品名称：CHO-BOND 1075 - 重量（克）：71或284 - 包装：1.5盎司铝管或6盎司SEMCO软管 - 部件编号：50-02-1075-0000（含1086底漆）或50-02-1075-1000（不含底漆）

底漆订购信息： - 产品名称：CHO-BOND 1086 - 重量（克）：10、95或375 - 包装：3克玻璃瓶、4盎司玻璃瓶或1品脱罐 - 部件编号：50-10-1086-0000、50-04-1086-0000或50-01-1086-0000

50-02-1075-1000 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“50-02-1075-1000”相匹配的价格&库存，您可以联系我们找货

免费人工找货

搜索历史

50-02-1075-1000

相关技术文章