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50-02-1075-1000

50-02-1075-1000

  • 厂商:

    PARKERCHOMERICS

  • 封装:

  • 描述:

    SILVER AL EMI SEALANT 57G

  • 数据手册
  • 价格&库存
50-02-1075-1000 数据手册
CHO-BOND® 1075 ONE COMPONENT CORROSION RESISTANT ELECTRICALLY CONDUCTIVE SILICONE SEALANT Customer Value Proposition: CHO-BOND 1075 is a silver plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For best adhesion results, CHO-BOND 1075 should be used in conjunction with CHOSHIELD 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters. Features and Benefits: • One component • Easy to use, no weighing or mixing required. • Silver plated aluminum filler • Excellent conductivity 0.010 ohm-cm outstanding galvanic corrosion resistance against aluminum substrates. • No VOCs • Minimal shrinkage. • Moisture cure silicone • 15 minute working life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures. 1 week for full cure. • Light weight • More coverage per gram of material, minimal weight added to assembly or vehicle. • Non corrosive cure mechanism • No corrosive by-products generated during curing to damage substrate. • Dry medium paste • Can be used on overhead or vertical surfaces. Contact Information: Parker Hannifin Corporation Chomerics Division 77 Dragon Court Woburn, MA 01801 phone 781 935 4850 fax 781 933 4318 chomailbox@parker.com www.chomerics.com www.parker.com/chomerics CHO-BOND 1075 - Product Information Table 1 Typical Properties CHO-BOND 1075 Typical Properties Typical Values Polymer Filler Silicone N/A Silver-Plated Aluminum N/A 1-part N/A Gray N/A Mix Ratio, A : B (by weight) Color Consistency Test Method (Q) Dry Medium Paste N/A (Q) Maximum DC Volume Resistivity 0.010 ohm-cm CHO-95-40-5555* (Q/C) Minimum Lap Shear Strength** 100 psi (689 kPa) CHO-95-40-5300* (Q/C) 4.0 lb./inch (700 N/m) CHO-95-40-5302* (Q/C) Minimum Peel Strength** Specific Gravity 2.0 ASTM D792 (Q/C) 81 Shore A ASTM-D2240 (Q/C) - 55°C to 200°C (-67 °F to 392 °F) N/A (Q) Hardness Continuous Use Temperature Elevated Temperature Cure Cycle None N/A Room Temperature Cure 1 week*** N/A (Q) Working Life 0.25 hour N/A (Q) 6 months @ 25°C (77°F) N/A (Q) Minimum thickness recommended 0.010 in (0.25 mm) N/A Maximum thickness recommended 0.125 in (3.18 mm) N/A 0 g/l Calculated 1375 in2 (8871 cm2) N/A 90 feet (27.4 m) N/A Shelf Life, unopened Volatile Organic Content (VOC) Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound (454 grams) Notes: N/A – Not Applicable, (Q/C) - Qualification and Conformance Test, (Q) - Qualification Test * This test Method is available from Parker Chomerics. ** Minimum values listed are based on using the CHO-SHIELD 1086 primer that typically comes bundled with the CHO-BOND. *** Cure is sufficient for handling in 24 hours. Full specification properties are developed after 1 week (168 hours) at room temperature. Table 2 Ordering Information Product CHO-BOND 1075 Weight (grams) Packaging Part Number Primer Included 71 1.5 fluid ounce foil tube 50-02-1075-0000 1086 71 1.5 fluid ounce foil tube 50-02-1075-1000 No 284 6 fluid ounce SEMCO cartridge 50-01-1075-0000 1086 Packaging Part Number Table 3 Primer Ordering Information Product CHO-BOND 1086 Weight (grams) 10 3 gram glass vial 50-10-1086-0000 95 4 fluid ounce glass bottle 50-04-1086-0000 375 1 pint can 50-01-1086-0000 Please refer to Parker Chomerics Surface Preparation and CHO-BOND Application documents for information regarding the proper surface preparation, primer application (if required), and use of these compounds. www.chomerics.com www.parker.com/chomerics CHOMERICS and CHO-BOND is a registered trademark of Parker Hannifin Corporation. ® 2013 TB 1131 EN January 2014
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