65-02-TC50-0030

THERM-A-GAPTM TC50 DISPENSABLE THERMAL PUTTY Customer Value Proposition: TC50 is a high performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heat sink or enclosure. The TC50 compound provides low thermal impedance at multiple gaps to allow the use of common heat spreaders. The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. TC50 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses. This one component material is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations. Features and Benefits: Contact Information: Parker Hannifin Corporation Chomerics Division 77 Dragon Court Woburn, MA 01801 phone 781 935 4850 fax 781 933 4318 chomailbox@parker.com www.chomerics.com www.parker.com/chomerics • Thermal conductivity: 5.0 W/m-K • Easily Dispensed • No secondary curing required • Low Thermal Impedance • Ultra-low compression force • Reworkable • Able to accommodate a variety of bond line applications Typical Applications: • Automotive Electronic Control Units • Power Supplies and Semiconductors • Memory and Power Modules • Microprocessors • Consumer Electronics Packaging and Handling: Material may be packaged in syringes, cartridges or bulk packaged in pails. Product Information Dispensable Thermal Putty TC50 Dispensable Thermal Putty Typical Properties TC50 Test Method Gray Visual 10 Chomerics 3.25 ASTM D792 Percent Deflection @ Various Force Levels See graph Modified ASTM C165 Dispensed 1.0 cc of material. 1” x 1” probe down to 0.100” Test rate 0.025 in/min Minimum bondline thickness, in (mm) 0.006 (.15) Chomerics 5.0 ASTM D5470 1 ASTM E1269 150 ASTM E831 Physical Color Flow Rate, grams/min - 30cc syringe with no tip attachment 0.100” orifice, 90psi (621 kPa) Specific Gravity Thermal Thermal Conductivity, W/m-K Heat Capacity, J/g-K Coefficient of Thermal Expansion, ppm/K Regulatory Electrical Operating Temperature Range, °F (°C) Dielectric Strength, Vac / mil (KVac/mm) -67 to 392 (-55 to 200) Chomerics 200 (8) ASTM D149 Volume Resistivity, ohm-cm 1014 ASTM D257 Dielectric Constant @100 kHz @ 1mm 6.8 ASTM D150 (5mm probe) Dissipation Factor @ 100 kHz @ 1mm 0.022 Chomerics Flammability Rating V-O UL 94 RoHS Compliant Yes Chomerics Certification 0.07 (0.01) ASTM E595 18 Chomerics Outgassing, % TML (%CVCM) Shelf Life, months from date of manufacture www.chomerics.com www.parker.com/chomerics CHOMERICS is a registered trademark of Parker Hannifin Corporation. ® 2014 Parker Chomerics TC50 MS EN 062916