69-13-42351-T418

THERMATTACH® Double-Sided Thermal Tapes Thermally Conductive Attachment Tapes Typical Applications • Mount heat sinks to components dissipating < ~25 W • Attach heat sinks to PC (esp. graphics) processors • Heat sink attachment to motor control processors • Telecommunication infrastructure components Product Attributes Description THERMATTACH double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners. ® THERMATTACH® tapes are proven to offer excellent reliability when exposed to thermal, mechanical, and environmental conditioning. They are offered in a variety of configurations, as detailed in the typical properties table. T418 • Superior adhesive strength • Best conformability to components • UL94 V-0 rated • Good thermal performance T412 • Good adhesion • Superior thermal performance • General use tape with added thermal conductivity of Al foil layer T411 • Designed for adhesion to plastic packages • Attaches to low surface energy packages • UL94 V-0 rated T404/T414 • Excellent dielectric strength due to polyimide carrier • Good thermal performance • UL94 V-0 rated T405 • General use tape with added thermal conductivity of Al foil layer • Excellent thermal performance • UL94 V-0 rated Features / Benefits • Offered in various forms to provide thermal, dielectric, and flame retardant properties • Offered in custom die-cut configurations to suit a variety of applications • Eliminates the need for mechanical attachment (i.e. screws, clips, rivets, fasteners) • Proven reliability under various mechanical, thermal, and environmental stresses • Embossed version available • UL recognized V-0 flammability • Meets RoHS specifications • No curing required, unlike epoxy or acrylic preforms or liquid systems • Easily reworkable ENGINEERING YOUR SUCCESS. 22 Electrical Mechanical / Adhesion Regulatory Chomerics Thermal Physical Not Tested 12 Shelf-Life, months from shipment Outgassing, % TML (% CVCM) Yes V-0 Flammability Rating (See UL File E140244) RoHS Compliant >50 >10 150 (1,034) 4.0 (6.9) Creep Adhesion, days 77ºF (15ºC) 302ºF (125ºC) Die Shear Adhesion after 400 psi attachment, psi (kPa) – 2 hour sample dwell time 77ºF (25ºC) 90° Peel Adhesion to 0.002” aluminum foil, lbf /in (N/cm) 150 (1,034) Lap Shear Al-Al @25°C, psi (kPa) 5 Voltage Breakdown (kVac) 1.0 X 1013 0.5 Thermal Conductivity W/m-K Volume Resistivity, (ohm-cm) 1.2 (7.7) -22 to +257 (-30 to + 125) -4 (-20) Thermal Impedance °C-in2 / W (°C-cm2/W) @ 300psi Operating Temperature Range, ºF (ºC) Glass Transition Temperature Range ºF (ºC) Adhesive CTE, ppm/ºF 300 0.14 (0.00) 12 Yes Not Tested >50 >10 135 (931) 1.0 (1.76) 70 (480) 1.0 X 102 N/A 1.4 0.30 (2.0) -22 to +257 (-30 to + 125) -22 (-30) 300 ± 0.001 (0.025) ± 0.001 (0.025) Thickness Tolerance, inch (mm) 0.009 (0.23) Aluminum Mesh Fiberglass 0.010 (0.25) Standard Gray No T412 Reinforcement Carrier Optional Light Yellow No T418 Thickness, inch (mm) (Rolls of width greater than 12” are not available with embossment) Embossed Color Recommended for Plastic Component Attachment Typical Properties Thermally Conductive Attachment Tapes 0.56 (0.02) 12 Yes V-0 >50 >10 130 (897) 1.5 (2.6) 100 (689) 3.0 X 1014 5 0.4 0.6 (3.7) -22 to +257 (-30 to + 125) -22 (-30) 300 ± 0.001 (0.025) 0.005 (0.127) Filled Polyimide Standard Beige No T404 / T414 0.25 (0.01) 12 Yes V-0 >50 >10 125 (862) 1.5 (2.6) 100 (689) N/A N/A 0.5 0.5 (3.4) -22 to +257 (-30 to + 125) -22 (-30) 300 ± 0.001 (0.025) 0.006 (0.15) Aluminum Standard White No T405 / T405-R Not Tested 12 Yes V-0 >50 >10 110 (759) 2.0 (3.5) 40 (270) NA NA 0.5 1.0 (6.5) -58 to +302 (-50 to +150) -58 (-50) 400 ± 0.001 (0.025) 0.010 (0.25) Aluminum Mesh No Clear / Metallic Yes T411 ASTM E595 Chomerics Chomerics Certification UL94 PSTC-7 Chomerics # 54 ASTM D1000 ASTM D1002 ASTM D257 ASTM D149 ASTM D5470 ASTM D5470 -- ASTM D1356 ASTM D3386 -- ASTM D374 Visual -- -- -- Method THERMATTACH® Thermally Conductive Attachment Tapes 23 THERMATTACH® Thermally Conductive Attachment Tapes Ordering Information These attachment tapes are available in the following formats. Contact Chomerics for custom widths, part sizes, etc. Sheets form, roll form, or die-cut parts. Offered on continuous rolls. A general ordering information table is included below for reference. Part Number: 6W XX YYYY ZZZZ XX = 13 for PSA two sides YYYY = 4 digit alpha/numeric part number. Contact Chomerics. W = 7 (Roll of material) XX = 10 (100 foot roll) XX = 40 (400 foot roll) YYYY = 0750 for 7.5” wide YYYY = 1150 for 11.5” wide YYYY = 2400 for 24” wide For T404/T414 Only: YYYY= 0600 for 6”wide YYYY= 0900 for 9” wide YYYY= 1900 for 19” wide* W = 9 (Custom part) XX = 13 for PSA two sides YYYYY = Custom Part Number. Contact Chomerics W = 0 (Standard Part) ( ) Rolls of width greater than 12” are not available with embossment Material Type ZZZZ = T405 T405-R T411 T412 T418 * for T404/T414 only Handling Information These products are defined by Chomerics as “articles” according to the following generally recognized regulatory definition for articles: An article is a manufactured item “formed to a specific shape or design during manufacturing,” which has “end use functions” dependent upon its size and shape during end use and which has generally “no change of chemical composition during its end use.” In addition: • There is no known or anticipated exposure to hazardous materials/substances during routine and anticipated use of the product. • The product’s shape, surface, and design is more relevant than its chemical composition. These materials are not deemed by Chomerics to require an MSDS. For further questions, please contact Chomerics at 781-935-4850. ENGINEERING YOUR SUCCESS. 24 THERMATTACH® Tape THERMATTACH® Thermally Conductive Attachment Tapes Tape Application Instructions: T404, T405, T405-R, T411, T412, T413, T414, T418 Materials Needed • Clean lint-free cloth rag • Industrial solvent • Rubber gloves For optimal performance, Chomerics recommends interface flatness of 0.001 in/in (0.025 mm/25 mm) to 0.002 in/in (0.050 mm/25 mm) maximum. Step 1: Ensure that bonding surfaces are free from oil, dust, or any contamination that may affect bonding. Using rubber gloves, wipe surfaces with a cloth dampened with industrial solvents such as MEK, toluene, acetone or isopropyl alcohol. Step 2: Cut tape to size* and remove a liner or remove pre-cut tape from roll. between the heat sink and the component. The penetration need not be very deep. Minimum: 10 psi at room temperature for 15 seconds PREFERRED: 30 psi at room temperature for 5 seconds contact surfaces. A twisting motion during assembly of the substrates will typically improve wetting. *Note: Due to variations in heat sink surfaces, Chomerics’ data indicates that it sometimes is beneficial to be cut slightly smaller than the area of the heat sink. See illustration. Step 3: Apply to center of heat sink bonding area and smooth over entire surface using moderate hand pressure / rubbing motion. A roller may be useful to help smooth the part to the surface by rolling from the center out to beyond the edges of the part. This ensures optimal contact between tape and heat sink. Step 4: Center heat sink onto component and apply using any one of the recommended temperature/ pressure options: More pressure equals better wetting out of the adhesive to the Note that typically 70% of the ultimate adhesive bond strength is achieved with initial application, and 80-90% is reached within 15 minutes. Ultimate adhesive strength is achieved within 36 hours; however the next manufacturing step can typically occur immediately following the initial application. Removal Instructions Materials needed: Single-edged razor blade or a small, thin-bladed pocketknife; soft, thin metal spatula. Use safety precautions when handling sharp instruments and organic solvents. Step 2: Remove the blade and insert the spatula into the wedge. Slowly twist the spatula blade so that it exerts a slight upward pressure. Step 3: As the two surfaces start to separate, move the spatula blade deeper into the bond line and continue the twisting motion and upward force. Step 4: After the two components are separated, the tape can be removed and discarded. If adhesive remains on the component surfaces, it must be removed. Wipe with a clean rag (lint-free) dabbed with MEK, toluene, or isopropyl alcohol. Use sufficient solvent to remove all adhesive. Step 5: Solvent cleaned components must be verified 100% free of cleaning solvent prior to reattachment of adhesive. Step 1: Carefully insert the blade edge into the bond line at a corner Relative Thermal Performance Thermally Conductive Attachment Tapes Performance* Typical Properties T418 T412 T404 / T414 T405 / T405-R T411 Ceramic Attachment 5 3 4 4 4 Metal Attachment 5 3 4 4 4 Plastic Attachment N/R N/R Dielectric Performance Thermal Performance 3 2 N/R N/R N/R 5 5 3 5 N/R N/R 4 2 * Performance rated on a scale of 1-5, 5 being the best. N/R = Not Recommended. Chomerics 25