THERMAL GREASES
Parker Chomerics thermal greases offer a range of
performance covering the simplest to the most demanding
thermal requirements. These materials are screened,
stenciled or dispensed and require virtually no compressive
force to conform under typical assembly pressures.
FEATURES/BENEFITS
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Mobile, desktop, server CPUs
Engine and transmission
control modules
Memory modules
Power conversion equipment
Power supplies and UPS
Power semiconductors
PERFORMANCE GUIDE
T670
3.0
Thermal Conductivity (W/m-K)
TYPICAL APPLICATIONS
Silicone based materials conduct
heat between a hot component
and a heat sink or enclosure
Fills interface variable tolerances
in electronics assemblies and heat
sink applications
Dispensable, highly conformable
materials require no cure cycle,
mixing or refrigeration
Thermally stable and require
virtually no compressive force to
deform under typical assembly
pressures
Supports high power applications
requiring material with minimum
bond line thickness and high
conductivity
Ideal for rework and field repair
situations
2.0
1.0
T660
T650
100,000
200,000
300,000
400,000
Viscosity (cps)
Phone +1 781-935-4850 www.parker.com/chomerics
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Thermal Greases
Typical Properties
T650
T660
T670
Test Method
Pale Blue
Light Gray
White
Visual
2.3
2.4
2.6
ASTM D792
190,000
170,000
350,000
N/A
Operating Temperature Range, ºF (ºC)
-58 to 392
(-50 to 200)
-58 to 392
(-50 to 200)
-58 to 392
(-50 to 200)
N/A
Phase Transition Temperature, ºF (ºC)
N/A
144 (62)
N/A
ASTM D3418
Weight Loss % @ 150°C, 48 Hours
0.21
0.17
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