65-00-T670-0080

THERMAL GREASES Parker Chomerics thermal greases offer a range of performance covering the simplest to the most demanding thermal requirements. These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. FEATURES/BENEFITS • • • • • • • • • • • • Mobile, desktop, server CPUs Engine and transmission control modules Memory modules Power conversion equipment Power supplies and UPS Power semiconductors PERFORMANCE GUIDE T670 3.0 Thermal Conductivity (W/m-K) TYPICAL APPLICATIONS Silicone based materials conduct heat between a hot component and a heat sink or enclosure Fills interface variable tolerances in electronics assemblies and heat sink applications Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration Thermally stable and require virtually no compressive force to deform under typical assembly pressures Supports high power applications requiring material with minimum bond line thickness and high conductivity Ideal for rework and field repair situations 2.0 1.0 T660 T650 100,000 200,000 300,000 400,000 Viscosity (cps) Phone +1 781-935-4850 www.parker.com/chomerics 1 Thermal Greases Typical Properties T650 T660 T670 Test Method Pale Blue Light Gray White Visual 2.3 2.4 2.6 ASTM D792 190,000 170,000 350,000 N/A Operating Temperature Range, ºF (ºC) -58 to 392 (-50 to 200) -58 to 392 (-50 to 200) -58 to 392 (-50 to 200) N/A Phase Transition Temperature, ºF (ºC) N/A 144 (62) N/A ASTM D3418 Weight Loss % @ 150°C, 48 Hours 0.21 0.17