UMW
R
AO4614
40V P-Channel and N-Channel MOSFET
D1
D2
General Description
The AO4614 uses advanced trench technology
MOSFETs to provide excellent RDS(ON) and low gate
charge. The complementary MOSFETs may be used
in H-bridge, Inverters and other applications.
G1
G2
S1
S2
n-channel
p-channel
Product Summary
N-Channel
VDS (V) = 40V,
ID = 6A (VGS=10V)
RDS(ON)
< 20mΩ (VGS=10V)
< 26mΩ (VGS=4.5V)
P-Channel
-40V
-5A (VGS=-10V)
S2
G2
S1
G1
< 39mΩ (VGS= -10V)
< 50mΩ (VGS= -4.5V)
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
Max n-channel
40
VGS
TA=25°C
Continuous Drain
Current A
TA=70°C
Pulsed Drain Current B
1
2
3
4
D2
D2
D1
D1
8
7
6
5
Max p-channel
-40
±20
±20
6
-5
ID
5
-4
IDM
30
-30
Units
V
V
A
B
IAR
14
-20
Repetitive avalanche energy L=0.1mH B
EAR
9.8
20
2
2
1.28
1.28
-55 to 150
-55 to 150
Avalanche Current
Power Dissipation
TA=25°C
TA=70°C
Junction and Storage Temperature Range
PD
TJ, TSTG
Thermal Characteristics: n-channel and p-channel
Parameter
t ≤ 10s
Maximum Junction-to-Ambient A
Steady-State
Maximum Junction-to-Ambient A
Steady-State
Maximum Junction-to-Lead C
t ≤ 10s
Maximum Junction-to-Ambient A
Steady-State
Maximum Junction-to-Ambient A
Steady-State
Maximum Junction-to-Lead C
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Symbol
RθJA
RθJL
RθJA
RθJL
1
mJ
W
°C
Device
n-ch
n-ch
n-ch
Typ
48
74
35
Max
62.5
110
50
Units
°C/W
°C/W
°C/W
p-ch
p-ch
p-ch
48
74
35
62.5
110
50
°C/W
°C/W
°C/W
UTD Semiconductor Co.,Limited
UMW
R
AO4614
40V P-Channel and N-Channel MOSFET
N Channel Electrical Characteristics (TJ=25°C unless otherwise noted)
Parameter
Symbol
Conditions
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
Min
ID=250µA, VGS=0V
Typ
40
1
TJ=55°C
5
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
Gate Threshold Voltage
VDS=VGS ID=250µA
1.7
ID(ON)
On state drain current
VGS=10V, VDS=5V
30
RDS(ON)
Static Drain-Source On-Resistance
±100
2.5
24
30
VGS=4.5V, ID=5A
30
38
Forward Transconductance
VDS=5V, ID=6A
19
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.76
IS
Maximum Body-Diode Continuous Current
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
410
VGS=0V, VDS=20V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg (10V) Total Gate Charge
VGS=10V, VDS=20V,
ID=6A
Qg (4.5V) Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
VGS=10V, VDS=20V, RL=3.3Ω,
RGEN=3Ω
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=6A, dI/dt=100A/µs
nA
V
516
mΩ
S
1
V
2
A
650
pF
82
pF
43
pF
4.6
Ω
8.9
10.8
nC
4.3
5.6
nC
2.4
nC
1.4
nC
6.4
ns
3.6
ns
16.2
ns
6.6
IF=6A, dI/dt=100A/µs
µA
A
gFS
Output Capacitance
3
VGS=10V, ID=6A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Units
V
VDS=40V, VGS=0V
VGS(th)
Coss
Max
18
10
ns
24
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
9
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
12
D. The static characteristics in Figures 1 to 6 are obtained using
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