UMW
R
AO4807
Dual P-Channel MOSFET
General Description
D1
The AO4807 uses advanced trench technology to
provide excellent RDS(ON), and ultra-low low gate
charge. This device is suitable for use as a load
switch or in PWM applications.
D2
G1
G2
S1
S2
Features
VDS (V) = -30V
ID = -6 A (VGS = -10V)
RDS(ON) < 21mΩ (VGS = 10V)
RDS(ON) < 30mΩ (VGS = 4.5V)
S2
G2
S1
G1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
Current A
Pulsed Drain Current
TA=25°C
TA=70°C
ID
IDM
B
Junction and Storage Temperature Range
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A
Units
V
±20
V
A
-30
2
W
1.44
TJ, TSTG
-55 to 150
Symbol
A
D2
D2
D1
D1
Maximum
-30
-5
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead C
8
7
6
5
-6
TA=25°C
Power Dissipation A
1
2
3
4
t ≤ 10s
Steady-State
Steady-State
RθJA
RθJL
1
Typ
48
74
35
°C
Max
62.5
110
40
Units
°C/W
°C/W
°C/W
UTD Semiconductor Co.,Limited
UMW
R
AO4807
Dual P-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
BVDSS
Parameter
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
VGS(th)
ID(ON)
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
RDS(ON)
Static Drain-Source On-Resistance
Min
-30
Conditions
ID=-250µA, VGS=0V
Typ
Max
-1
VDS=-24V, VGS=0V
TJ=55°C
VDS=0V, VGS=±20V
VDS=VGS ID=-250µA
VGS=-10V, VDS=-5V
-1
-30
-1.5
-5
±100
-2.5
Units
V
µA
nA
V
A
VGS=-10V, ID=-6A
19
25
mΩ
VGS=-4.5V, ID=-5A
25
30
mΩ
gFS
VSD
IS
VDS=-5V, ID=-6A
Diode Forward Voltage
IS=-1A,VGS=0V
Maximum Body-Diode Continuous Current
13
-0.76
Ciss
Coss
Crss
Rg
Qg(10V)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
920
190
122
3.6
18.5
pF
pF
pF
Ω
nC
9.6
2.7
4.5
nC
nC
nC
ns
ns
ns
ns
IF=-6A, dI/dt=100A/µs
7.7
5.7
20.2
9.5
20
IF=-6A, dI/dt=100A/µs
8.8
Forward Transconductance
Gate resistance
Total Gate Charge (10V)
Qg(4.5V) Total Gate Charge (4.5V)
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
Qrr
Body Diode Reverse Recovery Charge
VGS=0V, VDS=-15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=-10V, VDS=-15V, ID=-6A
VGS=-10V, VDS=-15V, RL=2.7Ω,
RGEN=3Ω
-1
-4.2
S
V
A
ns
nC
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
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2
UTD Semiconductor Co.,Limited
UMW
R
AO4807
Dual P-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
-10V
-6V
-5V
25
VDS=-5V
25
20
20
-4V
-ID(A)
-ID (A)
30
-4.5V
15
-3.5V
10
15
10
125°C
5
5
VGS=-3V
25°C
0
0
0
1
2
3
4
0
5
0.5
60
1.5
2
2.5
3
3.5
4
4.5
5
1.60
Normalized On-Resistance
55
VGS=-4.5V
50
45
RDS(ON) (mΩ)
1
-VGS(Volts)
Figure 2: Transfer Characteristics
-VDS (Volts)
Fig 1: On-Region Characteristics
40
35
VGS=-10V
30
25
20
ID=-6A
1.40
VGS=-10V
1.20
VGS=-4.5V
1.00
15
0.80
10
0
5
10
15
20
0
25
25
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
100
1.0E+01
90
1.0E+00
ID=-6A
80
1.0E-01
70
125°C
60
125°C
1.0E-02
-IS (A)
RDS(ON) (mΩ)
50
1.0E-03
50
25°C
1.0E-04
40
25°C
1.0E-05
30
1.0E-06
20
3
4
0.0
6
7
8
9
10
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
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5
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics
3
UTD Semiconductor Co.,Limited
UMW
R
AO4807
Dual P-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1500
10
VDS=-15V
ID=-6A
1250
Capacitance (pF)
-VGS (Volts)
8
6
4
2
Ciss
1000
750
500
Coss
250
0
0
0
4
8
12
16
20
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
10µs
100µs
0.1s
1ms
10ms
1s
20
25
30
TJ(Max)=150°C
TA=25°C
20
10
10s
DC
0
0.001
0.1
0.1
15
30
Power (W)
RDS(ON)
limited
1.0
10
40
TJ(Max)=150°C, TA=25°C
10.0
5
-VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
-ID (Amps)
Crss
1
10
100
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
-VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
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0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
4
100
1000
UTD Semiconductor Co.,Limited
UMW
R
AO4807
Dual P-Channel MOSFET
PACKAGE OUTLINE DIMENSIONS
SOP-8
Symbol
A
A1
A2
b
c
D
E
E1
e
L
θ
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Dimensions In Millimeters
Min
Max
1.350
1.750
0.100
0.250
1.350
1.550
0.330
0.510
0.170
0.250
4.700
5.100
3.800
4.000
5.800
6.200
1.270(BSC)
0.400
1.270
0°
8°
5
Dimensions In Inches
Min
Max
0.053
0.069
0.004
0.010
0.053
0.061
0.013
0.020
0.006
0.010
0.185
0.200
0.150
0.157
0.228
0.244
0.050(BSC)
0.016
0.050
0°
8°
UTD Semiconductor Co.,Limited
UMW
R
AO4807
Dual P-Channel MOSFET
Marking
AO4807
UMW xxxx
("xxxx"代表年份周期)
Ordering information
Order code
Package
Baseqty
Deliverymode
UMW AO4807
SOP-8
3000
Tape and reel
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6
UTD Semiconductor Co.,Limited
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