FSR05

FSR05 Ultra Low Cap acitance TVS Array FEATURES:     Protects one bi-directional I/O line Low clamping voltage Low operating voltage: 5.0V ROHS compliant MAIN APPLICATIONS        SOT-143 Fire wire & USB Sensitive analog inputs Notebook computers Portable electronics LAN/WAN equipment Video line protection Microcontroller input protection PROTECTION SOLUTION TO MEET  IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)  IEC61000-4-4 (EFT) 40A (5/50ns) PIN Configuration MECHANICAL CHARACTERISTICS      Package SOT-143 Molding Compound Flammability Rating : UL 94V-O Quantity Per Reel : 3,000pcs Lead Finish : Lead Free Marking : E5R ABSOLUTE MAXIMUM RATINGS (TA=25ºC, RH=45%-75%, unless otherwise noted) Parameter Symbol Value Unit Tstg -55 to +150 ℃ Operating junction temperature range Tj -55 to +125 ℃ Lead Soldering Temperature TL 260 (10 sec.) ℃ PPP 60 W VESD +/- 15 +/- 8 kV Storage temperature range Peak pulse power dissipation on 8/20 μs waveform ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) www.fuxinsemi.com Page 1 Ver2.1 FSR05 Ultra Low Cap acitance TVS Array ELECTRICAL CHARACTERISTICS (TA=25℃) Parameter Symbol Reverse working voltage Conditions Min Typ VRWM Reverse breakdown voltage VBR Reverse leakage current IR Clamping voltage (I/O pin to Ground) VC Junction capacitance CJ IT = 1mA Max Unit 5.0 V 6.0 V VRWM = 5V pin4 to pin1 1 μA IPP =1A, tp =8/20μs 9 10 V IPP =5A, tp =8/20μs 12 13 V 0.8 1.0 VRWM = 0V, f = 1MHz Any I/O pin to Ground VRWM = 0V, f = 1MHz Between I/O pins pF 0.4 0.6 RATINGS AND V-I CHARACTERISTICS CURVES (TA=25ºC, unless otherwise noted) FIG.2: Pulse waveform (8/20μs) FIG .1 :V - I cu rve characteristics (U ni-direction al) Percent of IPPM I front time: T1 = 1.25×T = 8×(1±20%)μs time to half value: T2 = 20×(1±20%)μs Peak value 100 90 Half value V V C V BR V RW M 50 T2 VF 10 0 0 IP P FIG.3: Pulse derating curve t(μs) T T1 10 20 30 40 FIG.4: ESD clamping (8KV contact) PPP derating in percentage(%) 100 Percent of IPPM 100 90 80 30ns 60 60ns 40 20 0 0 25 50 www.fuxinsemi.com TA(℃) 75 100 125 150 175 10 0 0 Page 2 t(ns) tr 0.7 to 1ns 30 60 Ver2.1 FSR05 Ultra Low Cap acitance TVS Array PACKAGE MECHANICAL DATA SOT-143 Dim Min Max A 2.70 3.10 B 1.10 1.50 C 0.9 1.1 D 0.78 0.88 E 1.80 2.00 F 0.37 0.43 G 1.59 1.79 H 0.02 0.1 J 0.05 0.15 K 2.20 2.60 ALL Dimensions in mm www.fuxinsemi.com Page 3 Ver2.1 FSR05 Ultra Low Cap acitance TVS Array Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o