FR1MD3

FR1AD3 THRU FR1MD3 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Package outline Features The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Fast switching for high efficiency Low reverse leakage Built-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 250 C/10 seconds at terminals Compliant to Halogen-free 0.071(1.80) 0.063(1.40) Case: JEDEC SOD-323 molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any 0.108(2.75) 0.096(2.45) Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT SYMBOLS Typical thermal resistance (NOTE 3) Operating junction and storage temperature range 0.003(0.08) 0.008(0.20) 0.039(1.00) 0.031(0.80) Mechanical data Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375”(9.5mm) lead length at TA=75 C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) 0.016(0.40) 0.010(0.25) 0.055(1.40) 0.047(1.20) SOD-323 VRRM VRMS VDC FR FR 1AD3 1BD3 50 35 50 T A=25 oC unless otherwise noted) FR 1DD3 100 70 100 200 140 200 FR FR 1GD3 1JD3 FR 1KD3 FR 1MD3 400 280 400 800 560 800 1000 700 1000 600 420 600 UNITS V V V I(AV) 1.0 A IFSM 15.0 A VF 1.3 V IR 5.0 50.0 µA trr 150 CJ 250 5.0 80.0 -55 to +150 RθJA TJ,TSTG 500 ns pF C/W C Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A 2.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 3.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted www.fuxinsemi.com Page 1 Ver2.1 FR1AD3 THRU FR1MD3 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Rating and characteristic curves FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 1.2 1.0 0.8 Single Phase 0.6 Half Wave 60Hz Resistive Or Inductive Load 0.4 0.375"(9.5mm) Lead Length 0.2 0 0 20 TJ=25 C 40 60 80 100 120 140 160 180 200 AMBIENT TEMPERATURE,( C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PEAK FORWAARD SURGE CURRENT,(A) INSTANTANEOUS FORWARD CURRENT,(A) 50 25 20 15 8.3ms Single Half TJ=25 C 10 JEDEC method 5 0 1 5 PULSE GENERATOR (NOTE 2) ( ) Sine Wave 10 50 100 NUMBER OF CYCLES AT 60Hz (+) 1W NONINDUCTIVE OSCILLISCOPE (NOTE 1) NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. trr | | | | | | | | +0.5A 0 -0.25A -1.0A 1cm SET TIME BASE FOR 50 / 10ns / cm www.fuxinsemi.com Page 2 Ver2.1 FR1AD3 THRU FR1MD3 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FR1AD3 FR1BD3 FR1DD3 FR1GD3 FR1JD3 FR1KD3 FR1MD3 1R 2R 3R 4R 5R 6R 7R Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323 0.047 (1.20) 0.047 (1.20) 0.055 (1.40) Reel packing PACKAGE SOD-323 REEL SIZE 7" www.fuxinsemi.com REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3,000 4.0 30,000 183*183*123 178 Page 3 CARTON SIZE (m/m) 382*262*387 CARTON (pcs) 240,000 Ver2.1 FR1AD3 THRU FR1MD3 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 o t25 C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o