DPAM-23-11.0-S-8-2-A-K-TR

F-214 DPAM–23–07.0–S–8–2–A DPAF–23–03.0–S–8–2–A ® (2,16 mm) .085" DPAM, DPAF SERIES HIGH DENSITY DIFFERENTIAL PAIR ARRAY DPAM Mates with: DPAF DPAF Mates with: DPAM PAIRS PER ROW DPAM SPECIFICATIONS Insulator Material: Black LCP Contact Material: Copper Alloy Plating: Au over 50µ" (1,27 µm) Ni Current Rating (2x3): 2.9 A per pin Operating Temp Range: -55°C to +125°C Contact Resistance: 10.4mΩ Working Voltage: 300 VAC Mated Cycles: 100 Cycles RoHS Compliant: Yes Lead-Free Solderable: Yes NO. OF ROWS –S =Eight Pair Rows =30µ" (0,76 µm) Gold on contact area, Tin on solder tail –3 =Three Pair Rows Perimeter Grounds (TYP) G1 NO OF ROWS –8 –3 02 01 G2 03 04 (MOQ Required) • Tin-Lead Solder Charge • Other platings Contact Samtec. A No. of positions x (2,16) .085 + (4,34) .171 (11,89) .468 (6,66) .262 (0,13) .005 (1,27) .050 DIA (2,16) .085 (1,08) .0425 No. of positions x (2,16) .085 + (2,95) .116 DPAF PAIRS PER ROW – 04, – 06, – 08, –15, –23 PLATING OPTION 03.0 –K =(20,00 mm) 0.80" DIA Polyimide film Pick & Place Pad –TR =Tape & Reel –GP =Guide Post (–23 only) –3 =Three Pair Rows Signal Pairs (TYP) NO OF ROWS 04 02 (2,54) 01 .100 (1,52) .060 G2 Perimeter Grounds (TYP) 03 (0,13) .005 (6,45) .254 (2,16) .085 Solder crimped on tail (1,08) .0425 No. of positions x (2,16) .085 + (2,95) .116 A OPTION = Lead-Free Tin Alloy 96.5% Sn/ 3%Ag/ .5% Cu Solder Crimp =(20,00 mm) 0.80" DIA Polyimide film Pick & Place Pad (1,27) .050 DIA WWW.SAMTEC.COM –8 –3 –K –2 =Eight Pair Rows =30µ" (0,76 µm) Gold on contact area, Tin on solder tail A (1,27) .050 SOLDER TYPE –8 G1 (1,27) .050 DPAM/DPAF Rated @ 3dB Insertion Loss* 10 mm Stack Height Single-Ended Signaling 8 GHz / 16 Gbps Differential Pair Signaling 7 GHz / 14 Gbps *Performance data includes effects of a non-optimized PCB. Complete test data available at www.samtec.com?DPAM, www.samtec.com?DPAF or contact sig@samtec.com NO. OF ROWS –S No. of positions x (2,16) .085 + (4,34) .171 Note: Patented Note: Some sizes, styles and options are non-standard, non-returnable. –2 = Lead-Free Tin Alloy 96.5% Sn/ 3% Ag/.5% Cu Solder Crimp (2,54) .100 Signal Pairs (TYP) (24,59) .968 (1,27) .050 notes at Download app ppnote /a om c.c te m www.sa @ samtec.com Contact SIG on protocols for questions ALSO AVAILABLE OPTION A RECOGNITIONS el Fibre Chann Rapid I/O ® PCI Express SATA ™ InfiniBand XAUI t I/O) MGT (Rocke A (2,54) .100 For complete scope of recognitions see www.samtec.com/quality s ocol t o r P rted o p p Su SOLDER TYPE –8 – 04, –06 – 08, –15, –23 For complete specifications and recommended PCB layouts see www.samtec.com?DPAM or www.samtec.com?DPAF PLATING OPTION 07.0 A (23,32) .918 (10,62) .418 DPAF DPAM MATED LEAD HEIGHT* STYLE –03.0 10 mm –07.0 *Processing conditions will affect mated height. SIZE –04 x –3 –06 x –3 –04 x –8 –06 x –8 –08 x –8 –15 x –8 –23 x –8 –08 x –3 –15 x –3 –23 x –3 USABLE PAIRS PER ARRAY* 6 Pairs 12 Pairs 16 Pairs 32 Pairs 48 Pairs 104 Pairs 168 Pairs 18 Pairs 39 Pairs 63 Pairs *Assumes first and last pair in each row are grounded –TR =Tape & Reel