HSEC8-130-01-S-PV-2-1-WT

HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS • Maximum Design Flexibility • Up to 64 Gbps PAM4 performance • PCI Express® 3.0, 4.0, 5.0 and 6.0 • Edge Rate® contacts optimized for signal integrity performance and high-cycle life • Up to 200 positions available • Vertical, right-angle, edge mount, pass-through orientations • Power/signal combo, press-fit tails, rugged weld tabs, locks and latches • Mating cable assemblies available Rugged tucked beam technology (HTEC8) KEY SPECIFICATIONS Differential pair for increased speed (HSEC8-DP) Custom designs allow for misalignment in the X-Y axes (HSEC1) SERIES PITCH TOTAL POSITIONS INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING LEAD-FREE SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 ℃ to +125 ℃ 1.9 A (2 pins) 240 VAC Yes HTEC8 0.80 mm 20-200 Black LCP Copper Alloy -55 ℃ to +125 ℃ 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 ℃ to +125 ℃ 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.2 A (2 pins) 215 VAC Yes F-224 (Rev 04APR24) samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (0.80 mm) .0315" PITCH • PASS-THROUGH & POWER COMBO - HSEC8 POSITIONS PER ROW 1 - 10, 13, 20 CARD THICKNESS - –01 = (1.60 mm) .062" thick card HSEC8-PE - DV - PLATING OPTION A - - PE –L OTHER OPTIONS - “X”R –K = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail Leave blank for Tray Packaging = (5.50 mm) .217" DIA Polyimide Film Pick & Place Pad –TR =Tape & Reel Packaging –FR –S Card Mates: (1.60 mm) .062" thick card, HSC8 = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail = Full Reel Tape & Reel Packaging (Must order max. quantities per reel. Contact Samtec for parts per reel) 1RRI3RVLWLRQV[        ALSO AVAILABLE 1.00 mm High-Speed Micro Plane Socket. View complete specifications at samtec.com?SAL1 HSEC8 - SIGNAL POSITIONS 1 20, 30, 40 (Signal positions per row) 1RRI3RVLWLRQV[  View complete specifications at: samtec.com?HSEC8-DV - CARD THICKNESS –01 = (1.60 mm) .062" thick card - - PV - PLATING OPTION –L POWER POSITIONS - –2, –4 = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail = Weld Tab –2 = Use with (2.36 mm) .093" Thick PCB A (8.00) .315 B (8.00) .315 (15.03) .592 (15.21) .599 D C SIGNAL POSITIONS Note: Some sizes, styles and options are non-standard, non-returnable. OTHER OPTION –WT = Use with (1.60 mm) .062" Thick PCB –S Card Mates: (1.60 mm) .062" thick card - –1 (Total, 2 per power bank) = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail HSEC8-PV POWER TAIL A (–2) B (–2) POWER POSITIONS C (–2) A (–4) B (–4) C (–4) 20 (32.10) 1.264 (15.20) .598 (18.20) .717 (44.10) 1.736 (15.20) .598 (18.20) .717 30 (40.10) 1.579 (23.20) .913 (26.20) 1.031 (52.10) 2.051 (23.20) .913 (26.20) 1.031 40 (48.10) 1.894 (31.20) 1.228 (34.20) 1.346 (60.10) 2.366 (31.20) 1.228 (34.20) 1.346 POWER TAIL D –1 (2.35) .093 –2 (3.13) .123 View complete specifications at: samtec.com?HSEC8-PV samtec.com/EdgeCard F-224 (Rev 04APR24) Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.