HPF-12-02-TM-S-LC-K

MAX POWER HEADERS, 16.1 STACKERS & SOCKETS A m p s (5.08 mm) .200" PITCH • HPM, HPW, HPF SERIES HPM, HPW HPF Board Mates: HPM, HPW - HPM Board Mates: HPF NO. OF PINS - 01 thru 20 High Temp High Power Header - LEAD STYLE PLATING OPTION -S- –T Specifiy LEAD STYLE from chart below –RA = Right-angle (-02 & -04 lead style only) –VS (2.54) .100 No. of Positions x (5.08) .200 E B C A D (6.35) .250 HPW High Temp High Power NO. OF PINS (2.54) .100 G –RA - LEAD STYLE F –VS - 04 - 02 thru 20 A B C D E – – – F G –01 (4.57) .180 (11.94) .470 –02 (4.57) .180 (13.21) .520 (2.54) .100 (4.57) .180 (8.08) .318 (12.24) .482 (8.38) .330 –04 (4.09) .161 (21.06) .829 (4.95) .195 –05 (4.57) .180 (3.81) .150 -S- PLATING OPTION –T – - STACK HEIGHT –“XXX” = Stacker Height (in inches) (0.13 mm) .005" increments = Matte Tin (10.72) .422 (8.64) .340 (3.96) .156 (13.82) .544 – – - POST HEIGHT – – – – OTHER OPTIONS –“XXX” Leave blank for Through-hole = Post Height (in inches) –VS = Surface Mount (2 pins/row minimum) –P POST HEIGHT (0.00) .000 MIN HPF STACK HEIGHT (29.21) 1.15 MAX WITH (0.00) .000 POST (7.62) .300 MIN - NO. OF PINS 02 thru 20 (2.54) .100 STACK HEIGHT (32.00) 1.26 MAX (5.08) .200 MIN = Pick & Place Pad (3 Pos. min.) (6.98 mm) .275" max. post height (–VS only) (34.29) 1.35 MAX (2.29) .090 - LEAD STYLE - –01 PLATING OPTION - S –T = Through-hole = Matte Tin –02 = Surface Mount - OTHER OPTIONS –LC = Locking Clip (Manual placement required) (–02 lead style only) –K No. of Positions x (5.08) .200 = (6.50 mm) .256" DIA Polyimide film Pick & Place Pad (5.08) .200 Note: Some lengths, styles and options are non-standard, non-returnable. = Pick & Place Pad (3 Pos. min.) (–VS only) (Not Available with -05 lead style) = Surface Mount (2 pins/row minimum) (-01 & -02 lead style only) PROCESSING Lead–Free Solderable: HPW-VS, HPM-VS, HPF = Yes HPM -TH, HPM -RA & HPW -TH = No, Lead Wave only SMT Lead Coplanarity: HPM = (0.20 mm) .008" max (02-15)* HPM = (0.25 mm) .010" max (16-20)* HPW = (0.20 mm) .008" max* HPF = (0.15 mm) .006" max (02-10)* (0.20 mm) .008" max (11-20)* *(.004" stencil solution may be available; contact ipg@samtec.com) OTHER OPTION –P Leave blank for Through-hole = Matte Tin SPECIFICATIONS Insulator Material: HPW/HPM = Glass Filled Polyester (Through-hole), Natural Liquid Crystal Polymer (Surface Mount) HPF = Black LCP Terminal Material (HPM/HPW): Copper Alloy Contact Material (HPF): BeCu Plating: Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +105 °C Voltage Rating: HPM/HPF = 850 VAC/1200 VDC Insertion Depth (HPF): (3.68 mm) .145" to (8.26 mm) .325" (.368" (9.35 mm) plus board thickness minimum for bottom entry) Wiping Distance (HPF): (0.38 mm) .015" - TAIL OPTION (8.89) .350 –02 –TR = Tape & Reel Packaging (14 positions max.) (Style –02 only) –FR = Full Reel Tape & Reel (must order max. quantity per reel; contact Samtec for quantity breaks) (14 positions max.) (Style -02 only) –01 samtec.com?HPM, samtec.com?HPW or samtec.com?HPF F-224 WEB Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.