HPF-14-02-T-S

F-215 HPF–18–01–T–S HPF–10–02–T–S (5,08 mm) .200" HPF SERIES POWER SOCKETS SPECIFICATIONS Surface Mount or Through-hole Mates with: HPM, HPW For complete specifications and recommended PCB layouts see www.samtec.com?HPF Insulator Material: Black LCP Contact Material: BeCu Plating: Sn over 50µ" (1,27 µm) Ni Insertion Depth: (3,68 mm) .145" to (8,26 mm) .325" (.368" (9,35 mm) plus board thickness minimum for bottom entry) Wiping Distance: (0,38 mm) .015" Insertion Force: (Single contact only) 56 oz (15,57 N) avg. Withdrawal Force: (Single contact only) 52 oz (14,46 N) avg. Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,15 mm) .006" max (02-10) (0,20 mm) .008" max (11-20) RoHS Compliant: Yes HPF/HPM CURRENT RATING (PER CONTACT) 16.6 A 14.4 A 13.2 A 12.7 A 8.9 A PINS 1 2 3 4 ALL NO. PINS PER ROW HPF (5,08 mm) .200" pitch • Three-finger Power Eye contact • Locking clip option LEAD STYLE PLATING OPTION OTHER OPTIONS S RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality 02 thru 20 FILE NO: 090871 0 000 –01 –LC = Through-hole = Locking Clip (Manual placement required) (Style –02 only) –02 –T = Matte Tin = Surface Mount –K = (6,50 mm) .256" DIA Polyimide Film Pick & Place Pad No. of Positions x (5,08) .200 –TR (5,08) .200 = Tape & Reel Packaging (14 positions maximum) (Style –02 only) (5,08) .200 (2,59) .102 (8,89) .350 (0,46) .018 (2,46) .097 (9,35) .368 (1,14) .045 –01 Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. (7,11) .280 –02