HSEC8-149-01-S-RA-L2

HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS • Maximum Design Flexibility • Up to 64 Gbps PAM4 performance • PCI Express® 3.0, 4.0, 5.0 and 6.0 • Edge Rate® contacts optimized for signal integrity performance and high-cycle life • Up to 200 positions available • Vertical, right-angle, edge mount, pass-through orientations • Power/signal combo, press-fit tails, rugged weld tabs, locks and latches • Mating cable assemblies available Rugged tucked beam technology (HTEC8) KEY SPECIFICATIONS Differential pair for increased speed (HSEC8-DP) Custom designs allow for misalignment in the X-Y axes (HSEC1) SERIES PITCH TOTAL POSITIONS INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING LEAD-FREE SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 ℃ to +125 ℃ 1.9 A (2 pins) 240 VAC Yes HTEC8 0.80 mm 20-200 Black LCP Copper Alloy -55 ℃ to +125 ℃ 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 ℃ to +125 ℃ 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.2 A (2 pins) 215 VAC Yes F-224 (Rev 04APR24) samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (0.80 mm) .0315" PITCH • RIGHT-ANGLE & EDGE MOUNT SOCKET HSEC8 - POSITIONS PER ROW 1 09, 10, 13, 20, 25, 30, 40, 49, 50, 60 - - CARD THICKNESS –01 - PLATING OPTION RA - –L = (1.60 mm) .062" thick card POSITIONS PER ROW –L2 B C (36.60) 1.441 40 (43.80) 1.724 (18.90) .744 50 (51.80) 2.039 (22.90) .902 (44.60) 1.756 60 (59.80) 2.354 (26.90) 1.059 (52.60) 2.071 (36.60) 1.441 40-BL (51.30) 2.020 (18.90) .744 50-BL (59.30) 2.335 (22.90) .902 (44.60) 1.756 60-BL (67.30) 2.650 (26.90) 1.059 (52.60) 2.071 $ –TR = Tape & Reel –FR = ECDP Latching (09, 13, 25, 49 only) A % Leave blank for Tray Packaging = Board Locks (09, 13, 25, 40, 49, 50, 60 only) –S Card Mates: (1.60 mm) .062" thick card, HSC8 Cable Mates: ECDP = Full Reel Tape & Reel Packaging (must order max. quantity per reel; contact Samtec for quantity breaks) & 40, 50, & 60 POSITIONS -BL OPTION 1RRI3RVLWLRQV[   "X"R –BL = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail HSEC8-RA - OTHER OPTIONS       1RRI3RVLWLRQV[  10, 20 & 30 POSITIONS View complete specifications at: samtec.com?HSEC8-RA HSEC8 - 1 - POSITIONS PER ROW 10, 20, 30, 40, 50, 60 01 - PLATING OPTION - - D EM2 –L –EM2 = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail =(1.60 mm) .062" thick PCB –S = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail HSEC8-EM Card Mates: (1.60 mm) .062" thick card, HSC8 Cable Mates: ECDP 1RRI3RVLWLRQV[ % $   10, 20 & 30 POSITIONS 1RRI3RVLWLRQV[   Note: Some sizes, styles and options are non-standard, non-returnable. 1RRI3RVLWLRQV[ 1RRI3RVLWLRQV[   40, 50 & 60 POSITIONS POSITIONS PER ROW A B 40 (18.90) .744 (36.60) 1.441 50 (22.90) .902 (44.60) 1.756 60 (26.90) 1.059 (52.60) 2.071 View complete specifications at: samtec.com?HSEC8-EM samtec.com/EdgeCard F-224 (Rev 04APR24) Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.