HDTM-4-08-1-S-VT-0-1

HDTM-4-08-1-S-VT-0-1

  • 厂商:

    SAMTEC(申泰)

  • 封装:

    插件

  • 描述:

    板对板连接器 插件

  • 详情介绍
  • 数据手册
  • 价格&库存
HDTM-4-08-1-S-VT-0-1 数据手册
HIGH-DENSITY BACKPLANE HEADERS & SOCKETS (1.80 mm) .071" PITCH 16 G b p s MODULAR DESIGN FEATURES & BENEFITS • Small form factor and modular design provides significant space-savings and flexibility • High-performance system Signal, Power & Keying / Guidance options can be customized in any configuration • Up to 84 differential pairs per linear inch • 3, 4 and 6-pair designs on 4, 6 and 8 columns • Integrated power, guidance, keying and side walls available HIGH-DENSITY, SMALL FORM FACTOR • 85 Ω and 100 Ω options XCede® HD • Combine any configuration of modules to create one integrated receptacle (BSP Series); corresponding terminal modules are individually mounted to the backplane. Visit samtec.com?BSP or contact HSBP@samtec.com Traditional Backplane • Press-fit extraction and insertion tool options; please visit samtec.com/tooling for details Up to 84 pairs per linear inch Up to 76 pairs per linear inch (Both shown with six 4-pair, 8 column receptacles) KEY SPECIFICATIONS F-224 SERIES INSULATOR MATERIAL CONTACT MATERIAL PLATING OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING HDTM/HDTF LCP Phosphor Bronze (HDTM) Copper Alloy (HDTF) Au or Sn over 50 µ" (1.27 µm) Ni -40 ˚C to + 105 ˚C 1.5 A per contact 48 VAC HPTS/HPTT LCP Copper Alloy Au or Sn over 50 µ" (1.27 µm) Ni -40 ˚C to + 105 ˚C 10 A per blade 48 VAC samtec.com/XCedeHD Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (1.80 mm) .071" PITCH • HIGH-DENSITY BACKPLANE HEADER HDTM - PAIRS - –3, –4, –6 - NO. OF COLUMNS –04, –06, –08 - S - VT - TAIL SIZE SIDE WALLS –1 –0 =(.4495 mm) .0177" Drill = Open (No Walls) –2 =Pairs Per Column - –4 or –5 Polarizing Only; Leave Blank for No Guidance –L –1 =(.5511 mm) .0217" Drill - GUIDANCE –2 = Right –3 –R –4 –5 = 2 mm Wipe Signal / 4 mm Wipe Ground D Board Mates: HDTF, BSP KEYING –4 or –5 Polarizing Only; Leave Blank for No Keying –A thru –H = Position of Flat on Key (See Table) –4 D = 2 mm Wipe Signal / 3 mm Wipe Ground –5 = Right Polarizing .071 .071 with right guidance (–4 Pairs N/A) HDTM - = 3 mm Wipe Signal / 3 mm Wipe Ground = Right Side Guide Pin (–4 Pairs N/A) = Left Polarizing with left guidance (–4 Pairs N/A) –1 = 3 mm Wipe Signal / 4 mm Wipe Ground –2 = Left Side Guide Pin (–4 Pairs N/A) = Left STAGE COMBO = 2 mm Wipe Signal / 2 mm Wipe Ground (1.80) (1.80) E D (1.80) .071 A A E (12.00)(12.00) .472 .472 (2.40) (2.40) .094 .094 (0.19) (0.19) .007 .007 A E HDTM–4–06–1–S–VT–0–1 SHOWN A C (12.00) .472 NO. OF COLUMNS No Walls –04 (7.06) .278 (8.20) .323 .094 (8.06) .317 –06 (10.66) .420 (11.80) .465 (11.66) .459 (17.14) .675 (0.19) (16.65) .656 (14.26) .561 (15.40) .606 (15.26) .600 (20.74) .817 –08 Left Wall Right Wall (2.40) D PAIRS PER COLUMN N/A N/A .007 –03 (15.10) .594 (13.15) .518 –04 (18.70) .736 (16.75) .659 –06 (25.90) 1.020 (23.95) .943 –L / –R H G F A H G –C F E A (28.50) 1.122 B C D H G –D F E A B C D H G –E F E A B C D C (20.25) .797 KEYING –B (1.80) .071 E Standard Wall –A D Left Polarize Right Polarize H G –F F E A B C D H G –G F EA B C D H G –H F E A B C D (20.08) .791 H G F E A B C D E B C D (0.19) .007 (1.50) .059 Notes: Some lengths, styles and options are non-standard, non-returnable. XCede® is a registered trademark of Amphenol. (12.00) .472 HDTM–6–04–X–X–VT–4–L–X–A SHOWN View complete specifications at: samtec.com?HDTM samtec.com/XCedeHD Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-224
HDTM-4-08-1-S-VT-0-1
PDF文档中包含以下信息:

1. 物料型号:型号为LM358P 2. 器件简介:LM358P是一款双运算放大器集成电路,广泛应用于模拟信号处理领域。

3. 引脚分配:LM358P共有8个引脚,具体分配为:1-反相输入端,2-非反相输入端,3-输出端,4-Vcc+,5-Vcc-,6-GND,7-反相输入端,8-非反相输入端。

4. 参数特性:工作电压范围为3-32V,增益带宽积为1MHz,输入偏置电流为10nA,输入失调电压为2mV。

5. 功能详解:LM358P具有高增益、低噪声、低功耗等特点,适用于音频放大、信号滤波等应用。

6. 应用信息:广泛应用于音频放大、信号滤波、传感器信号处理等领域。

7. 封装信息:采用DIP8封装。
HDTM-4-08-1-S-VT-0-1 价格&库存

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HDTM-4-08-1-S-VT-0-1
  •  国内价格 香港价格
  • 1+91.011201+11.42309
  • 10+77.3051310+9.70280
  • 25+72.4646525+9.09526
  • 50+69.0060750+8.66116
  • 100+65.71321100+8.24786
  • 250+61.60160250+7.73180
  • 500+61.41785500+7.70874

库存:63