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HSEC8-137-01-SM-DV-A-TR

HSEC8-137-01-SM-DV-A-TR

  • 厂商:

    SAMTEC(申泰)

  • 封装:

  • 描述:

    CONN EDGE DUAL FMALE 74POS 0.031

  • 详情介绍
  • 数据手册
  • 价格&库存
HSEC8-137-01-SM-DV-A-TR 数据手册
HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS • Maximum Design Flexibility • Up to 64 Gbps PAM4 performance • PCI Express® 3.0, 4.0, 5.0 and 6.0 • Edge Rate® contacts optimized for signal integrity performance and high-cycle life • Up to 200 positions available • Vertical, right-angle, edge mount, pass-through orientations • Power/signal combo, press-fit tails, rugged weld tabs, locks and latches • Mating cable assemblies available Rugged tucked beam technology (HTEC8) KEY SPECIFICATIONS Differential pair for increased speed (HSEC8-DP) Custom designs allow for misalignment in the X-Y axes (HSEC1) SERIES PITCH TOTAL POSITIONS INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING LEAD-FREE SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 ℃ to +125 ℃ 1.9 A (2 pins) 240 VAC Yes HTEC8 0.80 mm 20-200 Black LCP Copper Alloy -55 ℃ to +125 ℃ 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 ℃ to +125 ℃ 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.2 A (2 pins) 215 VAC Yes F-224 (Rev 04APR24) samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (0.80 mm) .0315" PITCH • VERTICAL EDGE CARD SOCKET HSEC8 - POSITIONS PER ROW 1 09, 10, 13, 20, 25, 30, 37, 40, 49, 50, 60, 70, 80, 100 (13, 25, 49 only available with -L or -L2 latching option; 09 only available with -L2 option; 37 only available with -L latching option) - - CARD THICKNESS –01 - PLATING OPTION DV - - A –L = (1.60 mm) .062" thick card = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail –03 = (2.36 mm) .093" thick card OTHER OPTIONS - “X”R –K Leave blank for Tray Packaging –BL = Tape & Reel (09 - 70 only) = Polyimide Pick & Place Pad = Board Locks; –01 card only (Weld tab standard) –S –L = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail = Latching Option; –01 card only (13, 25, 37, 49 only) (Weld tab standard) –L2 –TR –FR = Full Reel Tape & Reel (must order max. quantities per reel; contact Samtec for quantity breaks) (09-70 only) = ECDP Latching; –01 card only (09, 13, 25, 49 only) (For use with ECDP) (Weld tab standard) HSEC8-DV No. of Positions x (0.80) .0315 + (7.80) .307 –WT = Weld tab Card Mates: (1.60 mm) .062" card, (2.36 mm) .093" card, HSC8 (7.00) .276 A B Cable Mates: ECDP (7.98) .314 No. of Positions x (0.80) .0315 + (7.80) .307 (7.00) .276 (No. of Positions + 6) x (0.80) .0315 + (0.60) .024 (1.32) .052 A B No. of Positions x (0.80) .0315 + (4.60) .181 (7.98) .314 (5.60) .220 No. of Positions x (0.80) .0315 + (2.20) .087 (No. of Positions + 6) x (0.80) .0315 + (0.60) .024 10, 20, & 30 POSITIONS No. of Positions x (0.80) .0315 + (4.60) .181 OTHER SOLUTIONS (5.60) .220 For complete edge card system with cards and sockets, visit samtec.com?RU8 POSITIONS PER ROW B CABLE 09*† (4.50) .177 (11.80) .465 ECDP-04 For a card to mate with an HSEC8 socket, visit samtec.com?HSC8 13*† (6.10) .240 (15.00) .591 ECDP-08 HSEC8-113-L2 25*† (6.10) .240 (24.60) .969 ECDP-16 HSEC8-125-L2 37† (18.10) .713 (34.20) 1.346 ECDP-32 HSEC8-149-L2 40 (18.90) .744 (36.60) 1.441 49*† (22.90) .902 (43.80) 1.724 50 (22.90) .902 (44.60) 1.756 10 YEAR MFG EXTENDED LIFE PRODUCT HIGH MATING CYCLES (1.32) .052 09, 13, 25, 37 & 40 THRU 100 POSITIONS A 60 (26.90) 1.059 (52.60) 2.071 70† (26.90) 1.059 (60.60) 2.386 80† (26.90) 1.059 (68.60) 2.701 100† (26.90) 1.059 (84.60) 3.331 CONNECTOR No. of Positions x (0.80) .0315 + (2.20) .087 HSEC8-109-L2 Positions where no dimensions are given do not have keying feature. * Mates with ECDP Series Note: Some sizes, styles and options are non-standard, non-returnable. † Available with -01 Card Only View complete specifications at: samtec.com?HSEC8-DV samtec.com/EdgeCard F-224 (Rev 04APR24) Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
HSEC8-137-01-SM-DV-A-TR
1. 物料型号:文档中列出了四种不同的系列,包括HSEC6、HTEC8、HSEC8和HSEC1,它们具有不同的间距(pitch)和总位置数。

2. 器件简介:这些边缘卡系统设计用于提供最大的设计灵活性,支持高达64 Gbps的PAM4性能,并兼容PCI Express® 3.0、4.0、5.0和6.0。

3. 引脚分配:文档中提供了不同系列的引脚分配信息,包括总位置数和每行的位置数。

4. 参数特性:列出了关键规格,如间距、总位置数、绝缘材料、接触材料、工作温度范围、电流和电压等级,以及是否可进行无铅焊接。

5. 功能详解:介绍了不同系列的特点,例如HTEC8的坚固隐藏梁技术,HSEC8-DP的差分对以提高速度,以及HSEC1的定制设计允许在X-Y轴上的错位。

6. 应用信息:文档提供了不同系列的典型应用场景,例如垂直边缘卡插座、电缆组件等。

7. 封装信息:提供了不同系列的封装选项,包括厚度、卡的包装方式、镀层选项等。
HSEC8-137-01-SM-DV-A-TR 价格&库存

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