BDL-101-G-F

F-215 BDL–110–G–F BBL–112–T–E BBD–130–T–B BHS–125–G–A BBS–116–G–C (2,54 mm) .100" BBS, BBL, BHS, BBD, BDL SERIES MACHINED BOARD STACKING STRIPS Mates with: SS, SD, HSS, SL, SDL, ESS, ESD TYPE STRIP 1 NO. PINS PER ROW PLATING OPTION LEAD STYLE FEATURES • Low profile design achieves (3,89 mm) .153" board spacings when mated with SL Series. • Approach the reliability of a permanent connection with the flexibility of a separable connection. SPECIFICATIONS For complete specifications see www.samtec.com?BBS, www.samtec.com?BBL, www.samtec.com?BHS www.samtec.com?BBD or www.samtec.com?BDL Insulator Material: Black Glass Filled Polyester (BBS, BBD, BBL) Black High Temp Nylon (BDL) Black Liquid Crystal Polymer (BHS) Temperature Range: -55°C to +125°C Terminal Material: Phosphor Bronze or Brass Plating: Au or Sn over 50µ" (1,27 µm) Ni RoHS Compliant: Yes Lead-Free Solderable: Wave only (BBS, BBD, BBL, BDL) Wave, or reflow with all Au (BHS) –G (2,54) .100 x No. of Positions BBS =20 µ" (0,51 µm) Gold (2,54) .100 = Standard Single Row (2,54) .100 TYP BBL = Low Profile Single Row (1,27) .050 –T (2,54) .100 =Tin BBL body available with Styles –E & –F only. BHS BBS BHS = High Temp Single Row BBL (2,54) .100 x No. of Positions BBD 01 thru 32 (2,54) .100 (5,08) .200 = Standard Double Row (2,54) .100 TYP = BBS & BBL (1,27) .050 01 thru 36 (2,54) .100 BDL = BBD, BDL & BHS BDL body available with Styles –E & –F only. = Low Profile Double Row BDL BBD –A –B –C –E –F Z = (5,33 mm) .210" Z = (8,51 mm) .335" Z = (14,86 mm) .585" Z = (1,78 mm) .070" Z = (2,16 mm) .085" Style E: (2,74) .108 RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality (3,18) .125 (0,46) .018 DIA (0,46) .018 DIA Z (1,27) .050 (1,78) .070 DIA Z (0,46) .018 DIA (1,78) .070 DIA (3,18) .125 Style F: (3,18) .125 (3,18) .125 BBL Series (1,27) .050 DIA (0,46) .018 DIA Z BBS and BHS Series BBD Series BDL Series Note: Some lengths, styles and options are non-standard, non-returnable. WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.