GMI-30-2-1.27-G-10

SUPERNOVA® LOW PROFILE COMPRESSION INTERPOSER (1.00 mm) .0394" PITCH • GMI SERIES SPECIFICATIONS Insulator Material: Black LCP Contact Material: Copper Alloy Plating: Au or 50 µ" (1.27 µm) Ni Current Rating: .89 A per pin (10 pins powered) GMI - POSITIONS PER ROW - –10, –20, –30 STYLE –2 = Dual Compression - - BOARD SPACING –1.27 = (1.27 mm) .050" Board Space PLATING OPTION - –G ROWS –10 = 10 µ" (0.25 µm) Gold on contact area = Ten Rows PROCESSING Lead-Free Solderable: Yes SMT Lead Complanarity: (0.05 mm) .002" (10-20)* (0.08 mm) .003" (30)* *(.004" stencil solution may be available; contact ipg@samtec.com) (No. of positions x (1.00) .03937) + (6.80) .268 (12.00) .472 GMI Series is an ideal low-cost solution for board stacking, module-to-board or LGA interface (1.27) .050 No. of positions x (1.00) .03937) + (4.00) .157 10 X 10 of positions x (1.00) .03937) + (6.80) .268 (1.27) .050 No. of positions x (1.00) .03937) + (4.00) .157 (No. of positions x (1.00) .03937) + (4.00) .157 (No. of positions x (1.00) .03937) + (4.00) .157 30 X 10 20 X 10 Note: Some lengths, styles and options are non-standard, non-returnable F-224 (Rev 24JAN24) samtec.com?GMI Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (No. of pos