HDBNC-J-P-GN-ST-TH1

RF-13 HDBNC–J–P–GN–ST–EM1 HDBNC–J–P–GN–RA–BH1 HDBNC–P–C–GN–ST–TH1 HDBNC–J–P–GN–ST–BH1 HDBNC SERIES 75Ω HIGH DENSITY BNC JACKS SPECIFICATIONS Mates with: RFB6T, RFB8T, RFA6T For complete specifications and recommended PCB layouts see www.samtec.com?HDBNC-TH, www.samtec.com?HDBNC-BH or www.samtec.com?HDBNC-EM Shell Material: Au plated Brass Contact Material: Copper Alloy Insulator Material: PTFE Impedance: 75Ω ±2Ω Frequency Range: 0~6 GHz V.S.W.R: 1.45 max (with optimized launch design) Working Voltage: 330 Vrms max Dielectric Withstanding: 1500 Vrms min Contact Resistance: Center Contact: 1,5mΩ max Outer Contact: 0,4mΩ max Operating Temperature: -65°C to +125°C RoHS Compliant: Yes Lead–Free Solderable: Yes Patented design and bayonet latch 20% reduction in weight of traditional BNCs 4X THE PANEL DENSITY HDBNC Traditional BNCs Extended performance of 6 GHz for high density GENDER HDBNC EXTRACTION TOOL –J • Hand tool for quickly installing/uninstalling Contact Samtec. = Jack (4,25) .167 TYPE PLATING –P –GN –ST –BH1 = PCB Mount = 10µ" (0,25 µm) Gold contact, 100µ" (2,54 µm) Nickel shell = Straight = Through-hole (1,60 mm) .062 Board ORIENTATION –RA = Right Angle –EM1 = Edge Mount (–ST only) (3,70) .146 –TH1 (12,00) .472 (0,53) .021 DIA = Through-hole (–ST only) HDBNC–RA (6,50) .256 SQ (5,93) .233 SQ (17,50) .689 Note: Compatible with Amphenol’s HD-BNC™ (10,74) .423 (4,55) .179 DIA (6,51) .256 (16,96) .668 (11,25) .443 HDBNC–EM1 –BH2 = Through-hole (2,36 mm) .093 Board (–RA only) (20,30) .799 (11,70) .461 TERMINATION HDBNC–BH1 * Designed to meet SMPTE 424M 3G SDI specification. WWW.SAMTEC.COM (1,25) .049 DIA (5,71) .225 DIA (12,25) .482 (0,51) .020 DIA HDBNC–TH1