BTH-070-02-L-D-A

BASIC BLADE & BEAM HEADER (0.50 mm) .0197" PITCH • BTH SERIES BTH BTH Mates: BSH - NO. OF POSITIONS PER ROW SPECIFICATIONS Lead-Free Solderable: Yes SMT Lead Coplanarity: Vertical= (0.10 mm) .004" max (030-090), (0.15 mm) .006" max (120-150)* Right-angle= (0.15 mm) .006" max (030-090)* *(.004" stencil solution may be available; contact ipg@samtec.com) Board Stacking: For applications requiring more than two connectors per board or 90 positions or higher, contact ipg@samtec.com –F OTHER OPTION –K = Gold Flash on contact, Matte Tin on tail = (7.00 mm) .276” DIA Polyimide Film Pick & Place Pad –L –TR = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail = Tape & Reel (120 positions maximum) –C* (5.97) .235 (4.06) .160 –FR = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails (*–C Plating passes 10 year MFG testing) No. of Positions x (0.50) .01969 + (5.00) .197 = Full Reel Tape & Reel (must order maximum quantity per reel; contact Samtec for quantity breaks) (120 positions maximum) MATED HEIGHT (4.27) .168 LEAD STYLE MATED HEIGHT* –01 BTH - ALSO AVAILABLE NO. OF POSITIONS PER ROW –030, –060,–090 MOQ Required 30 µ" (0.76 µm) Gold Edge Mount Capability 8 mm, 11 mm, 16 mm, 19 mm and 22 mm Stack Height (Caution: Some automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) (11 mm, 16 mm, 19 mm and 22 mm not available with 50 positions) -D-A- PLATING OPTION –030, –050, –060, –090, –120, –150 Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: 2.0 A per pin (2 pins powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 175 VAC Max Cycles: 100 PROCESSING - 01 - (5.00 mm) .1971" *Processing conditions will affect mated height. - 01 - PLATING OPTION - D - RA - WT - –F OTHER OPTION –K = Gold Flash on contact, Matte Tin on tail = (7.00 mm) .276” DIA Polyimide Film Pick & Place Pad –L = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail No. of Positions x (0.50) .01969 + (10.88) .428 (9.78) .385 (3.05) .120 10 YEAR MFG WITH 50 µ" GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES (8.85) .348 Note: Some lengths, styles and options are non-standard, non-returnable. F-224 samtec.com?BTH Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.