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HDWM-10-61-G-D-472

HDWM-10-61-G-D-472

  • 厂商:

    SAMTEC(申泰)

  • 封装:

    -

  • 描述:

    .050"BOARDSPACERS

  • 详情介绍
  • 数据手册
  • 价格&库存
HDWM-10-61-G-D-472 数据手册
MICRO BOARD STACKER (1.27 mm) .050" PITCH • DWM/HDWM SERIES DWM/HDWM - DWM Mates: SMS, SLM, RSM NO. PINS PER ROW - 01 thru 50 SPECIFICATIONS Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +105 °C with Tin -55 °C to +125 °C with Gold - LEAD STYLE PLATING OPTION ­­– L Specify LEAD STYLE from chart - –D (4.98) .196 (0.00) .000 MIN LEAD THROUGHSTYLE HOLE –01 OAL (3.05) .120 ALSO AVAILABLE = Polarized Position (Specify position of omitted pin) OAL STACKER HEIGHT (5.08) .200 MIN (2.54) .100 OTHER OPTION – “XXX” = Stacker Height Example: –200 = (5.08 mm) .200" = Double Row –G - STACKER HEIGHT –“XXX” = Single Row = 10 µ" (0.25 µm) Gold on contact, Gold flash on tail (2.48) .098 Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.15 mm) .006" max* *(.004" stencil solution may be available; contact ipg@samtec.com) ROW OPTION –S = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail (1.27) .050 x No. of Positions PROCESSING - (11.43) .450 –51 (10.41) .410 –52 (10.80) .425 –53 (12.83) .505 –54 (14.10) .555 –55 (15.49) .610 –56 (15.88) .625 –57 (16.51) .650 –58 (17.91) .705 –59 (19.18) .755 –60 (20.96) .825 –61 (26.67) 1.050 Other Platings (MOQ Required) HDWM OAL LEAD THROUGH- SURFACE STYLE HOLE MOUNT –01 (11.43) .450 (8.38) .330 –51 (10.41) .410 — –52 (10.80) .425 — –53 (12.83) .505 (9.78) .385 –54 (14.10) .555 (11.05) .435 –55 (15.49) .610 (12.45) .490 –56 (15.88) .625 (12.83) .505 –57 (16.51) .650 (13.46) .530 –58 (17.91) .705 (14.86) .585 (15.62) .615 –59 (19.18) .755 –60 (20.96) .825 — –61 (26.67) 1.050 — Notes: For added mechanical stability, Samtec recommends mechanical board spacers be used in applications with gold or selective gold plated connectors. Contact ipg@samtec.com for more information. - NO. PINS PER ROW 01 thru 50 - LEAD STYLE - Specify LEAD STYLE from chart (1.27) .050 x No. of Positions PLATING OPTION ­­– L = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail –G (2.48) .098 - ROW OPTION –S = Single Row –D = Double Row = 10 µ" (0.25 µm) Gold on contact, Gold flash on tail (4.98) .196 - STACKER HEIGHT –“XXX” = Stacker Height Example: –250 = (6.35 mm) .250" - OTHER OPTION – “XXX” = Polarized Position (Specify position of omitted pin) – SM = Surface Mount (02 thru 40 positions only) –A = Alignment Pin (6 positions minimum –D only) Metal or plastic at Samtec discretion (Not available with –LC) – LC (0.00) .000 MIN (2.54) .100 OAL STACKER HEIGHT (5.08) .200 MIN (3.05) .120 = Locking Clip (5 positions minimum –D only) (Not available STACKER HEIGHT with –A) (6.35) OAL (Manual placement .250 required) MIN –P = Pick & Place Pad This Series is non-standard, non-returnable. F-224 samtec.com?DWM or samtec.com?HDWM Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
HDWM-10-61-G-D-472 AI解析
1. 物料型号:文档描述了DWM/HDWM系列的物料型号,包括不同的引脚配置和选项。 2. 器件简介:介绍了DWM/HDWM系列的堆叠板对板连接器,具有1.27mm的间距和不同的堆叠高度选项。 3. 引脚分配:提供了不同引脚数量的配置,从1到61个引脚,以及对应的引脚样式和尺寸。 4. 参数特性:包括操作温度范围、引脚样式、通孔和表面贴装选项、以及不同的电镀选项。 5. 功能详解:文档详细解释了连接器的功能,如表面贴装(SM)、极化位置、对齐销和锁定夹等。 6. 应用信息:建议在金或选择性金电镀连接器的应用中使用机械板间隔器以增加机械稳定性。 7. 封装信息:提供了不同引脚数量和引脚样式的封装尺寸。
*介绍内容由AI识别生成
HDWM-10-61-G-D-472 价格&库存

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