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HW-22-20-S-D-825-SM

HW-22-20-S-D-825-SM

  • 厂商:

    SAMTEC(申泰)

  • 封装:

  • 描述:

    CONN HDR 44POS 0.1 STACK SMD

  • 详情介绍
  • 数据手册
  • 价格&库存
HW-22-20-S-D-825-SM 数据手册
F-218 (Rev 10OCT17) HW–15–08–G–S–335–SM HW–25–15–L–D–474–SM–A (2.54 mm) .100" HW-SM SERIES FLEXIBLE .025" SQ BOARD STACKERS Board Mates: SSW, SSQ, ESW, ESQ, CES, SLW, BSW, BCS, SSM, HLE, PHF HW LEAD STYLE NO. PINS PER ROW PLATING OPTION Cable Mates: IDSS, IDSD, SMSD, SMSS SPECIFICATIONS Insulator Material: Top: Natural LCP Bottom: Black LCP Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C with Gold -55 °C to +105 °C with Tin RoHS Compliant: Yes STACKER HEIGHT –S –“XXX” = Single Row 02 thru 36 For complete specifications and recommended PCB layouts see www.samtec.com?HW-SM ROW OPTION = Stacker Height –D = Double Row 36 STACKER HEIGHT (6.35) .250 MIN (2.54) .100 x No. of Positions (4.70) .185 (2.54) .100 01 02 72 (7.37) .290 PROCESSING (2.54) .100 –‘‘XXX’’ 71 (5.08) .200 01 Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.15 mm) .006" max* *(.004" stencil solution may be available; contact IPG@samtec.com) = Polarized (0.64) .025 SQ TYP Specify omitted pin position –A (2.54) .100 RECOGNITIONS = Alignment Pin (2.54) .100 For complete scope of recognitions see www.samtec.com/quality (1.27) .050 (2.54) .100 –S ALSO AVAILABLE • Other platings • Locking Clip (Manual placement required) available with double row –SM Contact Samtec. –TR This Series is non-standard, non-returnable. = Tape & Reel Packaging (4–27 pins per row only) (Not Available on Lead Styles 10, 11, 12 & 20) Specify LEAD STYLE from chart LEAD OAL STYLE (SMT) POST (0.00).000 MIN OVERALL LENGTH Notes: For added mechanical stability, Samtec recommends mechanical board spacers be used in applications with gold or selective gold plated connectors. Contact ipg@samtec.com for more information. –D (Metal or plastic at Samtec discretion) FILE NO. E111594 (MOQ Required) OTHER OPTIONS SM (OAL) STACKER HEIGHT – 08 (11.81) .465 – 09 (16.89) .665 –10 (19.43) .765 –11 (21.97) .865 –12 (24.51) .965 –15 (14.35) .565 –16 (9.65) .380 –17 (10.54) .415 –20 (27.05) 1.065 –F = Gold flash on contact, Matte Tin on tail –L = 10 µ" (0.25 µm) Gold on contact area of longer tail, Matte Tin on tail –G = 10 µ" (0.25 µm) Gold on contact area of longer tail, Gold flash on balance –T = Matte Tin Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
HW-22-20-S-D-825-SM AI解析
1. 物料型号:HW–15–08–G–S–335–SM 和 HW–25–15–L–D–474–SM–A 2. 器件简介:这些是柔性板堆叠连接器,用于与SSW, SSQ, ESW, ESQ, CES, SLW, BSW, BCS, SSM, HLE, PHF等板对板连接器以及IDSS, IDSD, SMSD, SMSS等线对板连接器配合使用。 3. 引脚分配:文档提到了不同排的引脚数量,从02至36,包括单排和双排配置。 4. 参数特性: - 绝缘材料:顶部为天然LCP,底部为黑色LCP - 端子材料:磷青铜 - 镀层:金或锡覆盖50微英寸(1.27微米)镍 - 工作温度范围:金镀层为-55°C至+125°C,锡镀层为-55°C至+105°C - 符合RoHS标准 - 无铅可焊性 - SMT引脚共面性:最大0.15毫米 5. 功能详解:文档提供了连接器的详细规格和推荐的PCB布局,可在Samtec官网查看。 6. 应用信息:推荐在金或选择性金镀连接器的应用中使用机械板间隔器以增加机械稳定性。 7. 封装信息:提供了不同引脚配置和引脚样式的详细信息,包括引脚的OAL(SMT)和POST尺寸。
*介绍内容由AI识别生成
HW-22-20-S-D-825-SM 价格&库存

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