HSEC8-137-01-S-D-EM2L 数据手册
HIGH-SPEED
EDGE CARD SYSTEMS
0.60 mm, 0.80 mm and 1.00 mm PITCH
FEATURES & BENEFITS
• Maximum Design Flexibility
• Up to 64 Gbps PAM4 performance
• PCI Express® 3.0, 4.0, 5.0 and 6.0
• Edge Rate® contacts optimized for signal
integrity performance and high-cycle life
• Up to 200 positions available
• Vertical, right-angle, edge mount,
pass-through orientations
• Power/signal combo, press-fit tails,
rugged weld tabs, locks and latches
• Mating cable assemblies available
Rugged tucked
beam technology
(HTEC8)
KEY SPECIFICATIONS
Differential pair for
increased speed
(HSEC8-DP)
Custom designs allow
for misalignment in
the X-Y axes (HSEC1)
SERIES
PITCH
TOTAL
POSITIONS
INSULATOR
MATERIAL
CONTACT
MATERIAL
OPERATING
TEMP RANGE
CURRENT
RATING
VOLTAGE
RATING
LEAD-FREE
SOLDERABLE
HSEC6
0.60 mm
56-168
Black LCP
Copper Alloy
-55 ℃ to +125 ℃
1.9 A (2 pins)
240 VAC
Yes
HTEC8
0.80 mm
20-200
Black LCP
Copper Alloy
-55 ℃ to +125 ℃
3.0 A (2 pins)
215 VAC
Yes
HSEC8
0.80 mm
18-200
Black LCP
BeCu
-55 ℃ to +125 ℃
2.8 A (2 pins)
240 VAC
Yes
HSEC1
1.00 mm
20-140
Black LCP
Phosphor Bronze
-55 ℃ to +125 ℃
2.2 A (2 pins)
215 VAC
Yes
F-224 (Rev 04APR24)
samtec.com/EdgeCard
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
(0.80 mm) .0315" PITCH • RIGHT-ANGLE & EDGE MOUNT SOCKET
HSEC8
-
POSITIONS
PER ROW
1
09, 10, 13,
20, 25, 30,
40, 49, 50, 60
-
-
CARD
THICKNESS
–01
-
PLATING
OPTION
RA
-
–L
= (1.60 mm) .062"
thick card
POSITIONS PER ROW
–L2
B
C
(36.60) 1.441
40
(43.80) 1.724
(18.90) .744
50
(51.80) 2.039
(22.90) .902
(44.60) 1.756
60
(59.80) 2.354
(26.90) 1.059
(52.60) 2.071
(36.60) 1.441
40-BL
(51.30) 2.020
(18.90) .744
50-BL
(59.30) 2.335
(22.90) .902
(44.60) 1.756
60-BL
(67.30) 2.650
(26.90) 1.059
(52.60) 2.071
$
–TR
= Tape & Reel
–FR
= ECDP Latching
(09, 13, 25, 49 only)
A
%
Leave blank for
Tray Packaging
= Board Locks
(09, 13, 25, 40,
49, 50, 60 only)
–S
Card Mates:
(1.60 mm) .062"
thick card,
HSC8
Cable Mates:
ECDP
= Full Reel
Tape & Reel Packaging
(must order max.
quantity per reel;
contact Samtec for
quantity breaks)
&
40, 50, & 60 POSITIONS
-BL OPTION
1RRI3RVLWLRQV[
"X"R
–BL
= 10 µ" (0.25 µm)
Gold on contact area,
Matte Tin on tail
= 30 µ" (0.76 µm)
Gold on contact area,
Matte Tin on tail
HSEC8-RA
-
OTHER
OPTIONS
1RRI3RVLWLRQV[
10, 20 & 30 POSITIONS
View complete specifications at: samtec.com?HSEC8-RA
HSEC8
-
1
-
POSITIONS
PER ROW
10, 20, 30, 40, 50, 60
01
-
PLATING
OPTION
-
-
D
EM2
–L
–EM2
= 10 µ" (0.25 µm)
Gold on contact area,
Matte Tin on tail
=(1.60 mm) .062"
thick PCB
–S
= 30 µ" (0.76 µm)
Gold on contact area,
Matte Tin on tail
HSEC8-EM
Card Mates:
(1.60 mm) .062"
thick card,
HSC8
Cable Mates:
ECDP
1RRI3RVLWLRQV[
%
$
10, 20 & 30 POSITIONS
1RRI3RVLWLRQV[
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
1RRI3RVLWLRQV[
1RRI3RVLWLRQV[
40, 50 & 60 POSITIONS
POSITIONS
PER ROW
A
B
40
(18.90) .744
(36.60) 1.441
50
(22.90) .902
(44.60) 1.756
60
(26.90) 1.059
(52.60) 2.071
View complete specifications at: samtec.com?HSEC8-EM
samtec.com/EdgeCard
F-224 (Rev 04APR24)
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
HSEC8-137-01-S-D-EM2L 价格&库存
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