CLM-138-02-L-D-K

F-218 MLE–120–01–G–DV MLE–150–01–G–DV 10 YEAR MFG WITH 30 µ" GOLD EXTENDED LIFE PRODUCT CLM–126–02–F–D CLM–111–02–L–D HIGH MATING CYCLES (1.00 mm) .0394" CLM, MLE SERIES RUGGED RELIABLE MICRO SOCKETS SPECIFICATIONS CLM For complete specifications and recommended PCB layouts see www.samtec.com?CLM or www.samtec.com?MLE Insulator Material: Black LCP Contact Material: CLM: Phosphor Bronze MLE: BeCu Plating: CLM: Au or Sn over 50 µ" (1.27 µm) Ni MLE: Au over 10 µ" (0.25 µm) Ni Current Rating (CLM/FTM): 2.8 A per pin (2 pins powered) Current Rating (MLE/FTM): 2.9 A per pin (2 pins powered) Operating Temp Range: -55 °C to +125 °C Max Cycles: CLM: 100 with 10 µ" (0.25 µm) Au Voltage Rating: MLE: 310 VAC Insertion Depth: CLM: Top Entry = (1.40 mm) .055" min., Bottom Entry = (2.41 mm) .095" min. (Add board thickness for correct post OAL) MLE: (1.63 mm) .064" to (3.18 mm) .125" with (0.38 mm) .015" wipe, pass-through, or (2.44 mm) .096" minimum for bottom entry Normal Force: CLM: 40 grams (0.39 N) average RoHS Compliant: Yes Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (02-25) (0.15 mm) .006" max (26-50) RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality NO. PINS PER ROW 1 PLATING OPTION 02 Mates with: FTM, FTMH, MW D –F –BE = Gold flash on contact, Matte Tin on tail 02 thru 50 = Bottom Entry (Required for bottom entry) –L (1.00) .03937 No. of positions x (1.00) .03937 + (0.318) .0125 100 02 –P = Pick & Place Pad (7 positions minimum) –P 01 (0.28) .011 (2.26) .089 (2.12) .084 PIN/ROW A 04-15 (3.56) .140 (7.11) .280 16-50 –PA (8.26) .325 by A (3.81) .150 APPLICATION = (3.50 mm) .138" DIA Polyimide film Pick & Place Pad (7 positions minimum) (2.41) .095 (2.54) .100 (1.00) .03937 –K = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail (5.72) .225 x (3.57) .140 (1.36) .054 = Pick & Place Pad with integral Alignment Pin (3.00) .118 –PA ALSO AVAILABLE (MOQ Required) • Alignment pin • Other Gold plating options Contact Samtec. 1 NO. PINS PER ROW 01 Mates with: FTM, FTMH, MW PLATING OPTION DV –G FILE NO. E111594 No. of positions x (1.00) .03937 + (0.20) .008 (0.71) .028 (1.00) 02 .03937 (3.07) .121 (1.00) .03937 (0.30) .012 01 (4.32) .170 Note: Some lengths, styles and options are non-standard, non-returnable. (3.12) .123 (0.64) .025 DIA = Alignment Pin (3 positions minimum) Metal or plastic at Samtec discretion –K = (4.00 mm) .1575" DIA Polyimide film Pick & Place Pad (5 positions minimum) –A –P (6.35) .250 x (3.18) .125 (3.30) .130 = Metal Pick & Place Pad (5 positions minimum) (3.50) .138 –TR = Tape & Reel Packaging –P Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM OPTIONS –A = 10 µ" (0.25 µm) Gold 02 thru 50 100 –TR = Tape & Reel Packaging (0.89) .035 DIA (7.00) .275 Pass-Thru MLE OPTIONS All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.