CLP-149-02-F-DH

F-218 (Rev 14DEC17) CLP–115–02–L–D CLP–107–02–F–D–P 10 YEAR MFG WITH 30 µ" GOLD EXTENDED LIFE PRODUCT CLP–130–02–L–D CLP–116–02–F–DH HIGH MATING CYCLES (1.27 mm) .050" CLP SERIES LOW-PROFILE DUAL WIPE SOCKET High-reliability Tiger Claw™ contacts Mates with: FTSH, FTS, FW SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?CLP Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Sn or Au over 50 µ" (1.27 µm) Ni Current Rating (CLP/FTSH): 3.4 A per pin (2 pins powered) Voltage Rating: 280 VAC/395 VDC Operating Temp Range: -55 °C to +125 °C Insertion Depth: Top Entry = (1.40 mm) .055" minimum, Bottom Entry = (2.41 mm) .095" minimum plus board thickness DH Entry = (2.31 mm) .091" to (2.67 mm) .105" Normal Force: 60 grams (0.59 N) average Max Cycles: 100 with 10 µ" (0.25 µm) Au RoHS Compliant: Yes (1.27 mm x 1.27 mm) .050" x .050" micro pitch APPLICATIONS CLP Low-profile (2.21 mm) .087" FTSH HORIZONTAL Surface mount Suitable for pass-through applications PASS-THRU CLP NO. PINS PER ROW 1 PLATING OPTION 02 ROW OPTION OTHER OPTION PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (02-35) (0.15 mm) .006" max (36-50)* *(.004" stencil solution may be available; contact IPG@samtec.com) –F = Gold flash on contact, Matte Tin on tail 02 thru 50 = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail For complete scope of recognitions see www.samtec.com/quality –G No. of Positions x (1.27) .050 + (0.43) .017 FILE NO. E111594 100 (1.27) .050 02 01 99 (MOQ Required) = Double Horizontal (Requires FTSH–01 and FTSH–04 lead styles) –A = Alignment Pin (Not available with –PA option) (05, 06, 07, 08, 10, 12, 15, 20, 25, 30, 40 positions only) (–DH option and other sizes. Contact Samtec.) –K = (4.00 mm) .157" DIA Polyimide film Pick & Place Pad (5 positions min.) (6.35) .250 x (3.18) .125 (4.32) .170 (4.57) (3.05) .180 .120 ALSO AVAILABLE = 10 µ" (0.25 µm) Gold (–D only) (0.41) .016 = Bottom Entry (Required for bottom entry applications) –DH –L RECOGNITIONS –BE –D = Double Row (1.27) .050 –P = Pick & Place Pad (5 positions min. –D only) (Not always necessary for auto placement. See Flex Processing.) (2.54) .100 –P OPTION • Single row • Other platings Contact Samtec. (3.43) .135 (2.29) .090 –D –DH A Note: Some sizes, styles and options are non-standard, non-returnable. PIN/ROW A 04-15 (3.56) .140 16-50 (7.11) .280 If odd pins/row, alignment pins are on middle position on centerline of the part. If even pins/row, then alignment pins are between middle two positions. (1.40) .055 –PA (8.25) .325 (3.07) .121 (0.89) .035 DIA (7.00) .275 –PA OPTION = Pick & Place Pad with Alignment Pin (–D only) (Not Available with –A option) Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. –TR = Tape & Reel